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3.3V 10Gbps DIFFERENTIAL CML LINE DRIVER/RECEIVER WITH INTERNAL TERMINATION
FEATURES
s s s s s s s s Accepts up to 10.7Gbps data < 45ps edge rate Gain 4V/V CML/PECL differential inputs CML outputs Internal 50 input termination Internal 50 output load resistors Available in die or 16-pin (3mm x 3mm) MLF package
SY58016L FINAL
DESCRIPTION
The SY58016L is a high-speed, current mode logic (CML) differential receiver. It is ideal for interfacing with high frequency sources. It can be used as Line Receiver, Line Driver and Limiting Amplifier. The device can be operated from DC to 10Gbps. The input incorporates internal temination resistors, and directly interfaces to a CML logic signal. The output is CML compatible, and includes 50 load resistors.
APPLICATIONS
s s s s Backplane buffering OC-3/OC-192 SONET clock or data distribution/driver All GigE clock or data distribution/driver Fibre Channel distribution/driver
FUNCTIONAL BLOCK DIAGRAM
VCC
16
TYPICAL PERFORMANCE
VEE
15
VEE
14
VCC
13 12
50
VCC11
Backplane SY58016L
D1
50
Q
50 100mV Input Swing 50 400mV Output Swing
VTR* 2 VTR* 3 /D 4
VCC
VTR* VTR* /Q
10 9
400mV Out
50
VCC
50
VCC
(< 45ps Edge Rate) 100mV In
5
6
7
8
VCC
VEE
VEE
VCC
*VTR is not connected to the DIE.
MLF and MicroLeadFrame are trademarks of Amkor Technology, Inc.
Rev.: A Amendment: /0
1
Issue Date: September 2002
Micrel
SY58016L
PACKAGE/ORDERING INFORMATION
Ordering Information
VCC VEE VEE VCC
Part Number SY58016LXC SY58016LMI SY58016LMITR*
*Tape and Reel
Package Type DIE MLF-16 MLF-16
Operating Range 25C Industrial Industrial
Package Marking -- 016L 016L
16 15 14 13 D VTR VTR /D 1 2 3 4 16-pin MLF 5678
VCC VEE VEE VCC
12 11 10 9
Q VTR VTR /Q
16-Pin MLF (MLF-16)
PIN DESCRIPTION
Pin Number 1, 4 2, 3, 10, 11 6, 7, 14, 15 Exposed pad 12, 9 5, 8, 13, 16 Pin Name D, /D VTR VEE Q, /Q VCC Pin Function CML, PECL Differential Inputs with internal 50 pull-up resistors. Transmission Line Return: Normally connected to the most positive supply. Most Negative Supply. Exposed pad to be at the same electrical potential as VEE pins. CML Differential Outputs with internal 50 pull-up resistors. Positive Power Supply: +3.3V nominal.
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Micrel
SY58016L
Absolute Maximum Ratings(Note 1)
Supply Voltage VCC - VEE| ........................................... +4.0V Output Voltage (VOUT) .............................. Max. VCC +0.5V ........................................................... Min. VCC -1.0V Maximum Input Current (IIN) .................................... 25mA Maximum Output Current (IOUT) .............................. 25mA Lead Temperature (Soldering, 10 sec.) .................... 220C
Operating Ratings(Note 2)
Supply Voltage (VIN) Input Voltage (VCC = 0V) ......................... -1.0V to +0.5V Input Voltage (VEE = 0V) ........... VCC -1.0V to VCC +0.5V Ambient Temperature (TA) ......................... -40C to +85C Storage Temperature (TS) ....................... -65C to +150C Package Thermal Resistance MLF (JA) Still Air ............................................................. 60C/W 500lfpm ............................................................ 54C/W MLF (JB)(Note 4) ............................................................. 32C/W
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. The device is guaranteed to meet the DC specifications, shown in the table above, after thermal equilibrium has been established. The device is tested in a socket such that transverse airflow of 500lfpm is maintained. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
Note 2. Note 3. Note 4.
DC ELECTRICAL CHARACTERISTICS
VEE = GND, VCC = +3.3V 10% Symbol IEE RIN ROUT VIH VIL VOH VOL VOUT(swing) Parameter Power Supply Current Input Resistance Output Source Impedance Input HIGH Voltage Input LOW Voltage Output HIGH Voltage Outuput LOW Voltage Output Voltage Swing Note 1 Note 1 Note 1 Condition Min -- 40 40 VCC-0.9 VCC-1.0 -- 325 Typ 50 50 50 -- -- Max 75 60 60 VCC VCC-0.1 VCC -- Units mA V V V V mVp-p
VCC-0.040 VCC-0.010 400
VCC-0.400 VCC-0.325
Note 1. 50 output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition.
QOUT VIN, VOUT 400mV (typical) /QOUT
QOUT VDIFF--IN,VDIFF--OU 800mV QOUT -- /QOUT /QOUT
Figure 1. Input/Output Swing
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Micrel
SY58016L
AC ELECTRICAL CHARACTERISTICS
VEE = GND, VCC = +3.3V 10% Symbol fMAX tPLH tPHL tJITTER VIN tr, tf
Note 1. Note 2. Note 3. Note 4.
Parameter Maximum Data Rate Propagation Delay Random Jitter Deterministic Jitter Minimum Input Swing Output Rise/Fall Times (20% to 80%)
Condition
Min 10.7 --
Typ -- 100 -- -- -- 30
Max -- 150 1.5 15 -- 45
Units Gbps ps ps(rms) ps(pk-pk) mVp-p ps
Note 1 Note 2 Note 3 Note 4
-- -- 100 --
Measured with a K28.7 comma detect character pattern, measured at 10Gbps. See "Figure 2. Eye Diagram." Measured with a K28.5 pattern 223-1 PRBS pattern at 10Gbps. Minimum input swing for which AC parameters are guaranteed. See Figure 1. Reduced input swing will impact maximum data rate and the resulting eye pattern. 50 load and input swing is more than 100mVp-p.
EYE DIAGRAM
Figure 2. Eye Diagram
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Micrel
SY58016L
16 LEAD MicroLeadFrameTM (MLF-16)
0.85 +0.15 -0.65 3.00BSC 2.75BSC
16 1
0.42 +0.18 -0.18 0.23 +0.07 -0.05 0.01 +0.04 -0.01 1.60 +0.10 -0.10 0.42
+0.18 -0.18
0.65 +0.15 -0.65 0.20 REF.
N
PIN 1 ID
1
0.50 DIA
2 3 4
2.75BSC 3.00BSC
2 3 4
1.60 +0.10 -0.10
12 max SEATING PLANE TOP VIEW CC C L 4 0.23 +0.07 -0.05 0.01 +0.04 -0.01 1. 2. 3. 4.
0.42 +0.18 -0.18
0.5 BSC 1.5 REF BOTTOM VIEW
0.40 +0.05 -0.05
0.5BSC
SECTION "C-C" SCALE: NONE
DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS
Package Notes: 1. Package meets Level 2 Moisture Sensitivity Classification and is shipped in Dry-pack form. 2. Expose pad must be soldered to a ground for proper thermal management.
Rev. 02
MICREL, INC.
TEL
1849 FORTUNE DRIVE SAN JOSE, CA 95131
FAX
USA
+ 1 (408) 944-0800
+ 1 (408) 944-0970
WEB
http://www.micrel.com
This information is believed to be accurate and reliable, however no responsibility is assumed by Micrel for its use nor for any infringement of patents or other rights of third parties resulting from its use. No license is granted by implication or otherwise under any patent or patent right of Micrel, Inc. (c) 2002 Micrel, Incorporated.
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