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| FBGA Fine Pitch Ball Grid Array * Array molded, cost effective, space saving package solution * Available in 1.40mm (LFBGA), 1.20mm (TFBGA), and 1.00mm (VFBGA), 0.80mm (WFBGA) and 0.55mm (UFBGA) maximum thickness * Laminate substrate based package which enables 2 and 4 layers of routing flexibility FEATURES * Thin, lightweight, space saving package * Flexible body sizes range from 4mm x 4mm to 23mm x 23mm * 0.50, 0.65, 0.75, 0.80, 1.00mm ball pitch * Eutectic & Pb free solder balls * Green package available * Multiple routing layers and dedicated ground/power planes available for improved electrical performance * BT laminate materials (2 and 4 metal layers) * JEDEC standard compliant DESCRIPTION STATS ChipPAC's Fine Pitch Ball Grid Array (FBGA) is a laminate substrate based chip scale package with plastic overmolded encapsulation and an array of fine pitch solder ball terminals. The FBGA package's reduced outline and thickness and higher density options make it an ideal advanced technology packaging solution for high performance and/or portable applications. The use of the latest materials and advanced assembly infrastructure produce a reliable and cost effective package. Lead free and halogen free compatible material sets are available. STATS ChipPAC's FBGA is available in a broad range of JEDEC standard body sizes with LFBGA (<1.70mm [typically <1.40mm]), TFBGA (<1.20mm), VFBGA (<1.00mm), WFBGA (<0.80mm) and UFBGA (0.55mm max.) thickness. LFBGA-H (with attached heatsink) is qualified for small body sizes. APPLICATIONS * Microprocessors/Controllers * Wireless RF * Analog * ASIC * Memory * Simple PLDs * Others www.statschippac.com FBGA Fine Pitch Ball Grid Array SPECIFICATIONS Die Thickness Mold Cap Thickness Marking Packing Options 75-300m (3-12 mils) 0.25-0.90mm Laser Tape & reel/JEDEC tray RELIABILITY Moisture Sensitivity Level Temperature Cycling High Temp Storage Pressure Cooker Test Temperature/Humidity Test Unbiased HAST JEDEC Level 2A, 260C Reflow Condition C (-65C to 150C), 1000 cycles 150C, 1000 hrs 121C/100% RH/2atm, 168 hrs 85C/85% RH, 1000 hrs 130C/85% RH/2 atm, 96 hrs THERMAL PERFORMANCE, ja (C/W) Package LFBGA Body Size (mm) 11 x 11 (2L) 15 x 15 (4L) Pin Count 144 208 Thermal performance is highly dependent on package size, die size, substrate layers and thickness, and solder ball configuration. Simulation for specific applications should be performed to obtain maximum accuracy. Die Size (mm) 4.5 x 4.5 10.2 x 10.2 Thermal Performance ja(C/W) 34.1 19.4 Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-9) under natural convection as defined in JESD51-2. ELECTRICAL PERFORMANCE Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design to provide the best prediction of electrical behavior. First order approximations can be calculated using parasitics per unit length for the constituents of the signal path. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire. Conductor Component Wire Net (2L) Total (2L) Wire Net (4L) Total (4L) Length (mm) 2 2-7 4-9 2 2-7 4-9 Resistance (mOhms) 120 34 -119 154 - 239 120 34 - 119 154 - 239 Inductance (nH) 1.65 1.30 - 4.55 2.95 - 6.20 1.65 0.90 - 3.15 2.55 - 4.80 Inductance Mutual (nH) 0.45 - 0.85 0.26 - 2.28 0.71 - 3.13 0.45 - 0.85 0.18 - 1.58 0.63 - 2.43 Capacitance (pF) 0.10 0.25 - 0.95 0.35 - 1.05 0.10 0.35 - 1.10 0.45 - 1.20 Capacitance Mutual (pF) 0.01 - 0.02 0.06 - 0.42 0.07 - 0.44 0.01 - 0.02 0.06 - 0.42 0.07 - 0.44 Note: Net = Total Trace Length + Via + Solder Ball. CROSS-SECTION FBGA PACKAGE CONFIGURATIONS Body Sizes (mm) 4x4 to 23x23; Common body sizes: 5x10, 7x9, 8x10, 8x11, 8x12, 8x14, 10x12, 10x14, 13x13, 15x15, 16x16, 17x17 Ball Count 40 to 450 Ball Pitch (mm) 0.50 to 0.80 Typ. Pkg. Thickness LFBGA: 1.70mm (1.40mm max. typical) TFBGA: 1.20mm max. VFBGA: 1.00mm max. WFBGA: 0.80mm max. UFBGA: 0.55mm max. LFBGA-H Corporate Office Global Offices 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823 USA 510-979-8000 JAPAN 81-3-5789-5850 KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 CHINA 86-21-5976-5858 UK 44-1483-413-700 MALAYSIA 603-4257-6222 NETHERLANDS 31-38-333-2023 The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document. STATS ChipPAC reserves the right to change the information at any time and without notice. (c)Copyright 2006. STATS ChipPAC Ltd. All rights reserved. May 2006 |
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