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| APM9966/C Dual N-Channel Enhancement Mode MOSFET Features * SOP-8 20V/6A , RDS(ON)=19m(typ.) @ VGS=4.5V RDS(ON)=27m(typ.) @ VGS=2.5V TSSOP-8 20V/6A , RDS(ON)=21m(typ.) @ VGS=4.5V RDS(ON)=29m(typ.) @ VGS=2.5V Applications * Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. * * * Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SO-8 and TSSOP-8 Packages Pin Description APM9966 S1 G1 S2 G2 1 2 3 4 8 7 6 5 D1 D1 D2 D2 D1 S1 S1 G1 1 2 3 4 8 7 6 5 D2 S2 S2 G2 S1 G1 S2 G2 1 2 3 4 8 7 6 5 APM9966C D D D D D S1 S1 G1 1 2 3 4 8 7 6 5 D S2 S2 G2 SO-8 D1 D1 TSSOP-8 D1 SO-8 D TSSOP-8 D G1 G1 G1 G1 S1 D2 D2 S1 S1 D2 S1 D S1 D S1 G2 G2 G2 G2 S2 S2 S2 S2 S2 S2 ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 1 www.anpec.com.tw APM9966/C Ordering and Marking Information APM9966/C Handling Code Temp. Range Package Code Package Code K : SO-8 O : TSSOP-8 Operation Junction Temp. Range C : -55 to 150 C Handling Code TR : Tape & Reel APM9966/C K/O : APM9966/C XXXXX XXXXX - Date Code Absolute Maximum Ratings Symbol VDSS VGSS ID * IDM Drain-Source Voltage Gate-Source Voltage Parameter (TA = 25C unless otherwise noted) Rating 20 10 6 20 SO-8 TA=25C TSSOP-8 SO-8 TA=100C TSSOP-8 1.6 1.0 0.625 0.4 150 -55 to 150 50 Unit V A Maximum Drain Current - Continuous Maximum Drain Current - Pulsed PD Maximum Power Dissipation W TJ TSTG RjA Maximum Junction Temperature Storage Temperature Range Thermal Resistance - Junction to Ambient C C C/W * Surface Mounted on FR4 Board, t 10 sec. Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 2 www.anpec.com.tw APM9966/C Electrical Characteristics (Cont.) Symbol Static BVDSS Drain-Source Breakdown Voltage VGS=0V , IDS=250A IDSS VGS(th) IGSS Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current SOP-8 VDS=16V , VGS=0V VDS=VGS , IDS=250A VGS=10V , VDS=0V VGS=4.5V , IDS=6A RDS(ON)a Drain-Source On-state Resistance TSSOP-8 VSDa Diode Forward Voltage VGS=2.5V , IDS=5.2A VGS=4.5V , IDS=6A VGS=2.5V , IDS=5.2A ISD=1.7A , VGS=0V VDS=10V , IDS= 1A VGS=4.5V , 19 27 21 29 0.8 14 3.5 2.1 25 VDD=10V , IDS=1A , VGEN=4.5V , RG=0.2 VGS=0V VDS=15V Frequency=1.0MHz 22 67 36 780 165 105 pF 0.5 0.7 20 1 1 100 23 33 m 25 35 1.1 18 nC 47 42 122 67 ns V V A V nA Parameter (TA = 25C unless otherwise noted) APM9966/C Min. Typ. Max. Test Condition Unit Dynamicb Qg Total Gate Charge Qgs Gate-Source Charge Qgd td(ON) Tr td(OFF) Tf Ciss Coss Crss Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Notes a b : Pulse test ; pulse width 300s, duty cycle 2% : Guaranteed by design, not subject to production testing Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 3 www.anpec.com.tw APM9966/C Typical Characteristics Output Characteristics 20 VGS=2,3,4,5,6,7,8,9,10V 1V Transfer Characteristics 20 ID-Drain Current (A) 16 ID-Drain Current (A) 15 12 0.5V 10 8 5 TJ=25C TJ=-55C TJ=125C 4 0 0 1 2 3 4 5 0 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VDS - Drain-to-Source Voltage (V) VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature 1.50 IDS=250uA On-Resistance vs. Drain Current 0.05 SOP-8 VGS(th)-Threshold Voltage (V) (Normalized) 1.25 1.00 0.75 0.50 0.25 0.00 -50 RDS(ON)-On-Resistance () 0.04 VGS=4.5V 0.03 VGS=2.5V 0.02 0.01 -25 0 25 50 75 100 125 150 0.00 0 4 8 12 16 20 Tj - Junction Temperature (C) ID - Drain Current (A) Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 4 www.anpec.com.tw APM9966/C Typical Characteristics (Cont.) On-Resistance vs. Drain Current TSSOP-8 On-Resistance vs. Gate-to-Source Voltage SOP-8 0.05 0.10 0.09 ID=6A RDS(ON)-On-Resistance () RDS(ON)-On-Resistance () 0.04 VGS=4.5V 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.03 VGS=2.5V 0.02 0.01 0.00 0.00 0 4 8 12 16 20 0 1 2 3 4 5 6 7 8 9 10 ID - Drain Current (A) VGS - Gate-to-Source Voltage (V) On-Resistance vs. Gate-to-Source Voltage TSSOP-8 On-Resistance vs. Junction Temperature 2.00 VGS=4.5V 0.10 ID=6A RDS(ON)-On-Resistance () 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 0 1 2 3 4 5 6 7 8 9 10 RDS(ON)-On-Resistance () (Normalized) 0.09 1.75 1.50 1.25 1.00 0.75 0.50 0.25 0.00 -50 ID=6A -25 0 25 50 75 100 125 150 VGS - Gate-to-Source Voltage (V) TJ - Junction Temperature (C) Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 5 www.anpec.com.tw APM9966/C Typical Characteristics (Cont.) Gate Charge 5 VDS=10V ID=1A Capacitance 1200 Frequency=1MHz VGS-Gate-Source Voltage (V) 4 1000 Capacitance (pF) 800 600 400 200 0 Ciss 3 2 1 Coss Crss 0 0 2 4 6 8 10 12 14 16 0 4 8 12 16 20 QG - Gate Charge (nC) VDS - Drain-to-Source Voltage (V) Source-Drain Diode Forward Voltage 20 Single Pulse Power 80 10 IS-Source Current (A) 60 TJ=150C Power (W) 1 TJ=25C 40 20 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0 0.01 0.1 1 10 30 VSD -Source-to-Drain Voltage (V) Time (sec) Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 6 www.anpec.com.tw APM9966/C Typical Characteristics (Cont.) Normalized Thermal Transient Impedence, Junction to Ambient Normalized Effective Transient Thermal Impedance 1 Duty Cycle=0.5 D=0.2 D=0.1 0.1 D=0.05 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=50C/W 3.TJM-TA=PDMZthJA SINGLE PULSE D=0.02 0.01 1E-4 1E-3 0.01 0.1 1 10 30 Square Wave Pulse Duration (sec) Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 7 www.anpec.com.tw APM9966/C Packaging Information SOP-8 pin ( Reference JEDEC Registration MS-012) E H e1 D e2 A1 A 1 L 0.004max. Dim A A1 D E H L e1 e2 1 Mi ll im et er s Min . 1. 35 0. 10 4. 80 3. 80 5. 80 0. 40 0. 33 1. 27B S C 8 Max . 1. 75 0. 25 5. 00 4. 00 6. 20 1. 27 0. 51 Min. 0. 053 0. 004 0. 189 0. 150 0. 228 0. 016 0. 013 0.015X45 Inche s Max . 0. 069 0. 010 0. 197 0. 157 0. 244 0. 050 0. 020 0. 50B S C 8 Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 8 www.anpec.com.tw APM9966/C Packaging Information (Cont.) TSSOP-8 e 87 2x E/2 E1 E S ( 2) GAUGE PLANE 12 e/2 D A2 A b A1 0.25 L (L1) ( 3) 1 Dim A A1 A2 b D e E E1 L L1 R R1 S 1 2 3 Millimeters Min. 0.00 0.80 0.19 2.9 0.65 BSC 6.40 BSC 4.30 0.45 1.0 REF 0.09 0.09 0.2 0 12 REF 12 REF 0.004 0.004 0.008 0 4.50 0.75 0.169 0.018 Max. 1.2 0.15 1.05 0.30 3.1 Min. 0.000 0.031 0.007 0.114 Inches Max. 0.047 0.006 0.041 0.012 0.122 0.026 BSC 0.252 BSC 0.177 0.030 0.039REF 8 8 12 REF 12 REF Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 9 www.anpec.com.tw APM9966/C Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. Reflow Condition (IR/Convection or VPR Reflow) temperature Peak temperature 183C Pre-heat temperature Time Classification Reflow Profiles Convection or IR/ Convection Average ramp-up rate(183C to Peak) 3C/second max. 120 seconds max Preheat temperature 125 25C) 60 - 150 seconds Temperature maintained above 183C Time within 5C of actual peak temperature 10 -20 seconds Peak temperature range 220 +5/-0C or 235 +5/-0C Ramp-down rate 6 C /second max. 6 minutes max. Time 25C to peak temperature VPR 10 C /second max. 60 seconds 215-219C or 235 +5/-0C 10 C /second max. Package Reflow Conditions pkg. thickness 2.5mm and all bgas Convection 220 +5/-0 C VPR 215-219 C IR/Convection 220 +5/-0 C pkg. thickness < 2.5mm and pkg. volume 350 mm pkg. thickness < 2.5mm and pkg. volume < 350mm Convection 235 +5/-0 C VPR 235 +5/-0 C IR/Convection 235 +5/-0 C www.anpec.com.tw Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 10 APM9966/C Reliability test program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles Carrier Tape & Reel Dimensions E Po P P1 D t F W Bo Ao D1 T2 Ko J C A B T1 A p p lic a tio n A 330 1 B 6 2 + 1 .5 D C 1 2 .7 5 + 0 .1 5 D1 J 2 0 .5 Po T1 1 2 .4 0 .2 P1 2 .0 0 .1 T1 1 2 .4 0 .2 P1 2 .0 0 .1 T2 2 0 .2 Ao 6 .4 0 .1 T2 2 0 .2 Ao 7 .0 0 .1 W 12 0. 3 Bo 5 .2 0 . 1 W 12 0. 3 Bo 3 .6 0 .3 P 8 0 .1 Ko E 1 .7 5 0 .1 t SOP- 8 F 5 .5 1 1 .5 5 + 0 .1 1 .5 5 + 0 .2 5 4 .0 0 .1 B 6 2 + 1 .5 D 1 .5 + 0 .1 C 1 2 .7 5 + 0 .1 5 D1 1 .5 + 0 .1 J 2 + 0 .5 Po 4 .0 0 .1 2 .1 0 .1 0 .3 0 .0 1 3 P 8 0 .1 Ko E 1 .7 5 0 .1 t A p p lic a tio n A 330 1 T S S O P -8 F 5 .5 0 . 1 1 .6 0 .1 0 .3 0 .0 1 3 Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 11 www.anpec.com.tw APM9966/C Cover Tape Dimensions Application SOP- 8 TSSOP- 8 Carrier Width 12 12 Cover Tape Width 9.3 9.3 Devices Per Reel 2500 2500 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. A.3 - Mar., 2003 12 www.anpec.com.tw |
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