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PolarHTTM HiPerFET Power MOSFET ISOPLUS220TM (Electrically Isolated Back Surface) IXFC 96N15P VDSS = 150 V ID25 = 42 A RDS(on) = 26 m < 200 ns trr N-Channel Enhancement Mode Fast Recovery Diode, Avalanche Rated ISOPLUS 220TM E153432 Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL FC VISOL Weight 1.6 mm (0.062 in.) from case for 10 s Mounting force 50/60 Hz, 1 minute Test Conditions TJ = 25C to 175C TJ = 25C to 175C; RGS = 1 M Continuous Transient TC TC TC TC TC = 25C = 25C, pulse width limited by TJM = 25C = 25C = 25C Maximum Ratings 150 150 20 30 42 250 60 40 1.0 10 120 -55 ... +175 175 -55 ... +150 300 11...65/2.4...11 2500 3 V V V V A A A mJ J V/ns W C C C C N/lb ~V g G D S Isolated back surface* G = Gate S = Source D = Drain IS IDM, di/dt 100 A/s, VDD VDSS, TJ 175C, RG = 4 TC = 25C Features Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low drain to tab capacitance(<35pF) Low RDS (on) HDMOSTM process Rugged polysilicon gate cell structure Unclamped Inductive Switching (UIS) rated Fast intrinsic Rectifier Applications DC-DC converters Battery chargers Switched-mode and resonant-mode power supplies DC choppers AC motor control Advantages Easy assembly: no screws, or isolation foils required Space savings High power density Low collector capacitance to ground (low EMI) Symbol Test Conditions (TJ = 25C, unless otherwise specified) BVDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 250 A VDS = VGS, ID = 4 mA VGS = 20 VDC, VDS = 0 VDS = VDSS VGS = 0 V TJ = 150 C Characteristic Values Min. Typ. Max. 150 3.0 5.0 100 25 300 26 V V nA A A m VGS = 10 V, ID = 48 A, Note 1 Pulse test, t 300 s, duty cycle d 2 % (c) 2006 IXYS All rights reserved DS99240E(03/06) IXFC 96N15P Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) Min. Typ. Max. 35 45 3500 VGS = 0 V, VDS = 25 V, f = 1 MHz 1000 280 30 VGS = 10 V, VDS = 0.5 VDSS, ID = 48 A RG = 4 (External) 33 66 18 110 VGS= 10 V, VDS = 0.5 VDSS, ID = 48 A 26 59 S pF pF pF ns ns ns ns nC nC nC 1.25 K/W (TO-247, PLUS220) 0.21 K/W Note: Bottom heatsink (Pin 4) is electrically isolated from Pin 1,2, or 3. ISOPLUS220TM (IXFC) Outline gfs Ciss Coss Crss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCS VDS= 10 V; ID = 48 A, Note 1 Source-Drain Diode Symbol IS ISM VSD trr QRM IRM Test Conditions VGS = 0 V Repetitive IF = IS, VGS = 0 V, IF = 25 A -di/dt = 100 A/s VR = 100 V, VGS = 0 V Characteristic Values (TJ = 25C, unless otherwise specified) Min. Typ. Max. 96 250 1.5 A A V Ref: IXYS CO 0177 R0 200 ns 600 6 nC A Notes: 1. Pulse test, t 300 s, duty cycle d 2 % IXYS reserves the right to change limits, test conditions, and dimensions. IXYS MOSFETs and IGBTs are covered by 4,835,592 one or moreof the following U.S. patents: 4,850,072 4,881,106 4,931,844 5,017,508 5,034,796 5,049,961 5,063,307 5,187,117 5,237,481 5,381,025 5,486,715 6,162,665 6,259,123 B1 6,306,728 B1 6,404,065 B1 6,534,343 6,583,505 6,683,344 6,710,405B2 6,710,463 6,727,585 6,759,692 6,771,478 B2 IXFC 96N15P Fig. 1. Output Characteristics @ 25C 100 90 80 150 70 9V VGS = 10V 9V 200 VGS = 10V 175 Fig. 2. Extended Output Characteristics @ 25C I D - Amperes I D - Amperes 60 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 6V 7V 8V 125 100 8V 75 50 25 0 0 2 4 6 8 10 12 14 16 18 20 7V 6V V D S - Volts Fig. 3. Output Characteristics @ 150C 100 90 80 VGS = 10V 9V 2.8 2.6 2.4 VGS = 10V V D S - Volts Fig. 4. RDS(on) Norm alized to 0.5 ID25 A ID = 48 Value vs. Junction Tem perature R D S ( o n ) - Normalized I D - Amperes 70 60 50 40 30 20 10 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 7V 6V 5V 8V 2.2 2 1.8 1.6 1.4 1.2 1 0.8 0.6 -50 -25 0 25 50 75 100 125 150 175 I D = 96A I D = 48A V D S - Volts Fig. 5. RDS(on) Norm alized to 3.8 3.4 TJ - Degrees Centigrade Fig. 6. Drain Current vs. Case Fig. Tem perature 8045 7040 TJ = 175C D Amperes IID -- Amperes 0.5 D25 ID = 48IA Value vs. ID R D S ( o n ) - Normalized 3 2.6 2.2 1.8 1.4 1 0.6 0 50 100 150 VGS = 15V 6035 External Lead Current Limit 30 50 25 40 20 30 15 20 10 10 5 00 -50 -50 -25 -25 VGS = 10V TJ = 25C 200 250 00 I D - Amperes TTC -Degrees Centigrade C - Degrees Centigrade 25 25 50 50 75 75 100 125 150 100 125 150 175 175 (c) 2006 IXYS All rights reserved IXFC 96N15P Fig. 7. Input Adm ittance 180 160 140 60 TJ = -40C 25C 150C Fig. 8. Transconductance 50 g f s - Siemens TJ = 150C 25C -40C 4 5 6 7 8 9 1 0 I D - Amperes 120 100 80 60 40 20 0 40 30 20 10 0 0 25 50 75 100 125 150 175 200 V G S - Volts Fig. 9. Source Current vs. Source-To-Drain Voltage 300 10 9 250 8 7 VDS = 75V I D = 48A I G = 10mA I D - Amperes Fig. 10. Gate Charge I S - Amperes 200 VG S - Volts TJ = 150C TJ = 25C 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 6 5 4 3 2 1 0 0 10 20 30 40 50 60 70 80 90 100 110 150 100 50 0 V S D - Volts Q G - nanoCoulombs Fig. . 1 2. Fo r w ar d - Bia s Fig 12. Forw ard-Bias SafeeOperating g A r e a Saf Op e r at in Area 1000 1000 Fig. 11. Capacitance 10000 f = 1MHz Capacitance - picoFarads R DS(on) Limit R D S (o n ) L im it I I D--Amperes Amperes D C iss 100 100 25s5 s 2 100s 1 0 0 s 1ms 1000 C oss 1m s 10ms 10 10 TJ = 175C T J = 1 7 5 C TC = 25C T C = 2 5 C 1 1 DC 10m s C rss 100 0 5 10 15 20 25 30 35 40 DC V DS - Volts IXYS reserves the right to change limits, test conditions, and dimensions. 1 1 10 10 V D S - Volts 1 0 0 V D S - V olts 100 1000 1000 IXFC 96N15P Fig. 13. Maxim um Transient Therm al Resistance 10.00 R( t h ) J C - C / W 1.00 0.10 0.01 0.1 1 10 100 1000 Pulse Width - milliseconds (c) 2006 IXYS All rights reserved |
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