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| STD70NH02L STD70NH02L-1 N-channel 24V - 0.0062 - 60A - DPAK/IPAK STripFETTM II Power MOSFET General features Type STD70NH02L-1 STD70NH02L VDSS 24V 24V RDS(on) <0.008 <0.008 ID 60A(1) 60A(1) 1. Value limited by wire bonding 3 1 DPAK IPAK 3 2 1 RDS(ON) * Qg industry's benchmark Conduction losses reduced Switching losses reduced Low threshold device Description The device utilizes the latest advanced design rules of ST's proprietary STripFETTM technology. This is suitable for the most demanding DC-DC converter application where high efficiency is to be achieved. Internal schematic diagram Applications Switching application Order codes Part number STD70NH02LT4 STD70NH02L-1 Marking D70NH02L D70NH02L Package DPAK IPAK Packaging Tape & reel Tube July 2006 Rev 5 1/16 www.st.com 16 Contents STD70NH02L - STD70NH02L-1 Contents 1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Electrical characteristics (curves) ............................ 6 3 4 5 6 7 Test circuit ................................................ 9 Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 2/16 STD70NH02L - STD70NH02L-1 Electrical ratings 1 Electrical ratings Table 1. Symbol Vspike (1) VDS VDGR VGS ID (2) Absolute maximum ratings Parameter Drain-source voltage rating Drain-source voltage (VGS = 0) Drain-gate voltage (RGS = 20k) Gate-source voltage Drain current (continuous) at TC = 25C Drain current (continuous) at TC = 100C Drain current (pulsed) Total dissipation at TC = 25C Derating factor Value 30 24 24 20 60 50 240 70 0.47 360 -55 to 175 Unit V V V V A A A W W/C mJ C ID IDM (3) PTOT (4) EAS Single pulse avalanche energy Operating junction temperature Storage temperature Tj Tstg 1. Guaranted when external Rg= 4.7 and Tf Rthj-case Rthj-amb TJ Thermal data Thermal resistance junction-case max Thermal resistance junction-to ambient max Maximum lead temperature for soldering purpose 2.14 100 275 C/W C/W C 3/16 Electrical characteristics STD70NH02L - STD70NH02L-1 2 Electrical characteristics (TCASE=25C unless otherwise specified) Table 3. Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on) On/off states Parameter Drain-source breakdown voltage Zero gate voltage drain current (VGS = 0) Gate-body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 25mA, VGS =0 VDS = 20V VDS = 20V, TC = 125C VGS = 20V VDS = VGS, ID = 250A VGS = 10V, ID = 30A VGS = 5V, ID = 15A 1 1.8 0.0062 0.008 0.008 0.014 Min. 24 1 10 100 Typ. Max. Unit V A A nA V Table 4. Symbol gfs (1) Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd Qoss(2) Dynamic Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Output charge Test conditions VDS = 10V, ID = 18A Min. Typ. 27 2050 545 70 12 200 18 25 17 7.7 3.5 14 22 Max. Unit S pF pF pF ns ns ns ns nC nC nC nC VDS = 25V, f = 1MHz, VGS = 0 VDD = 10V, ID = 40A RG = 4.7 VGS = 4.5V (see Figure 13) VDD = 5V, ID = 60A, VGS = 10V, RG = 4.7 (see Figure 14) VDS =10V, VGS =0V f=1MHz Gate DC Bias =0 Test Signal Level =20mV Open Drain RG Gate input resistance 1 1. Pulsed: Pulse duration = 300 s, duty cycle 1.5 %. 2. Qoss.= Coss * Vin, Coss = Cgd + Cgd. See Chapter 4: Appendix A 4/16 STD70NH02L - STD70NH02L-1 Electrical characteristics Table 5. Symbol ISD ISDM (1) VSD (2) trr Qrr IRRM Source drain diode Parameter Source-drain current Source-drain current (pulsed) Forward on voltage ISD = 30A, VGS = 0 36 35 3.6 Test conditions Min. Typ. Max. 60 240 1.3 Unit A A V ns C A Reverse recovery time ISD = 60A, di/dt = 100A/s, Reverse recovery charge VDD = 15V, Tj = 150C Reverse recovery current (see Figure 15) 1. Pulse width limited by safe operating area. 2. Pulsed: Pulse duration = 300 s, duty cycle 1.5 % 5/16 Electrical characteristics STD70NH02L - STD70NH02L-1 2.1 Figure 1. Electrical characteristics (curves) Safe operating area Figure 2. Thermal impedance Figure 3. Output characterisics Figure 4. Transfer characteristics Figure 5. Transconductance Figure 6. Static drain-source on resistance 6/16 STD70NH02L - STD70NH02L-1 Figure 7. Gate charge vs gate-source voltage Figure 8. Electrical characteristics Capacitance variations Figure 9. Normalized gate threshold voltage vs temperature Figure 10. Normalized on resistance vs temperature Figure 11. Source-drain diode forward characteristics Figure 12. Normalized BVDSS vs temperature 7/16 Test circuit STD70NH02L - STD70NH02L-1 3 Test circuit Figure 14. Gate charge test circuit Figure 13. Switching times test circuit for resistive load Figure 15. Test circuit for inductive load Figure 16. Unclamped Inductive load test switching and diode recovery times circuit Figure 17. Unclamped inductive waveform Figure 18. Switching time waveform 8/16 STD70NH02L - STD70NH02L-1 Appendix A 4 Appendix A Figure 19. Buck converter: power losses estimation The power losses associated with the FETs in a synchronous buck converter can be estimated using the equations shown in the table below. The formulas give a good approximation, for the sake of performance comparison, of how different pairs of devices affect the converter efficiency. However a very important parameter, the working temperature, is not considered. The real device behavior is really dependent on how the heat generated inside the devices is removed to allow for a safer working junction temperature. The low side (SW2) device requires: Very low RDS(on) to reduce conduction losses Small Qgls to reduce the gate charge losses Small Coss to reduce losses due to output capacitance Small Qrr to reduce losses on SW1 during its turn-on The Cgd/Cgs ratio lower than Vth/Vgg ratio especially with low drain to source voltage to avoid the cross conduction phenomenon; The high side (SW1) device requires: Small Rg and Ls to allow higher gate current peak and to limit the voltage feedback on the gate Small Qg to have a faster commutation and to reduce gate charge losses Low RDS(on) to reduce the conduction losses. Power losses calculation High side switching (SW1) Low side switch (SW2) Table 6. Pconduction R DS(on)SW1 * I 2 * L R DS(on)SW2 * I 2 * (1 - ) L Pswitching Vin * (Q gsth(SW1) + Q gd(SW1) ) * f * IL Ig Zero Voltage Switching 9/16 Appendix A Table 6. Power losses calculation High side switching (SW1) Recovery (1) STD70NH02L - STD70NH02L-1 Low side switch (SW2) Not applicable Vin * Q rr(SW2) * f Vf(SW2) * I L * t deadtime * f Q gls(SW2) * Vgg * f Pdiode Conductio n Not applicable Pgate(QG) Q g(SW1) * Vgg * f Vin * Q oss(SW1) * f 2 PQoss Vin * Q oss(SW2) * f 2 1. Dissipated by SW1 during turn-on Table 7. Paramiters meaning Meaning Duty-cycle Post threshold gate charge Third quadrant gate charge On state losses On-off transition losses Conduction and reverse recovery diode losses Gate drive losses Output capacitance losses Parameter d Qgsth Qgls Pconduction Pswitching Pdiode Pgate PQoss 10/16 STD70NH02L - STD70NH02L-1 Package mechanical data 5 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com 11/16 Package mechanical data STD70NH02L - STD70NH02L-1 DPAK MECHANICAL DATA mm. DIM. MIN. A A1 A2 B b4 C C2 D D1 E E1 e e1 H L (L1) L2 L4 R V2 2.2 0.9 0.03 0.64 5.2 0.45 0.48 6 5.1 6.4 4.7 2.28 4.4 9.35 1 2.8 0.8 0.6 0.2 0 8 0 1 0.023 0.008 8 4.6 10.1 0.173 0.368 0.039 0.110 0.031 0.039 6.6 0.252 0.185 0.090 0.181 0.397 TYP MAX. 2.4 1.1 0.23 0.9 5.4 0.6 0.6 6.2 MIN. 0.086 0.035 0.001 0.025 0.204 0.017 0.019 0.236 0.200 0.260 TYP. MAX. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 inch 0068772-F 12/16 STD70NH02L - STD70NH02L-1 Package mechanical data TO-251 (IPAK) MECHANICAL DATA DIM. MIN. A A1 A3 B B2 B3 B5 B6 C C2 D E G H L L1 L2 0.45 0.48 6 6.4 4.4 15.9 9 0.8 0.8 0.3 0.95 0.6 0.6 6.2 6.6 4.6 16.3 9.4 1.2 1 0.017 0.019 0.236 0.252 0.173 0.626 0.354 0.031 0.031 2.2 0.9 0.7 0.64 5.2 mm TYP. MAX. 2.4 1.1 1.3 0.9 5.4 0.85 0.012 0.037 0.023 0.023 0.244 0.260 0.181 0.641 0.370 0.047 0.039 MIN. 0.086 0.035 0.027 0.025 0.204 inch TYP. MAX. 0.094 0.043 0.051 0.031 0.212 0.033 H C A C2 L2 D B3 B6 A1 L = = 3 B5 B A3 = B2 = G = E L1 1 2 = 0068771-E 13/16 Packing mechanical data STD70NH02L - STD70NH02L-1 6 Packing mechanical data DPAK FOOTPRINT All dimensions are in millimeters TAPE AND REEL SHIPMENT REEL MECHANICAL DATA DIM. A B C D G N T 1.5 12.8 20.2 16.4 50 22.4 18.4 13.2 mm MIN. MAX. 330 0.059 0.504 0.520 0.795 0.645 0.724 1.968 0.881 BULK QTY 2500 inch MIN. MAX. 12.992 TAPE MECHANICAL DATA DIM. A0 B0 B1 D D1 E F K0 P0 P1 P2 R W BASE QTY 2500 mm MIN. 6.8 10.4 1.5 1.5 1.65 7.4 2.55 3.9 7.9 1.9 40 15.7 16.3 inch MIN. MAX. 7 0.267 0.275 0.409 0.417 0.476 0.059 0.063 0.059 0.065 0.073 0.291 0.299 0.100 0.108 0.153 0.161 0.311 0.319 0.075 0.082 1.574 0.618 0.641 MAX. 10.6 12.1 1.6 1.85 7.6 2.75 4.1 8.1 2.1 14/16 STD70NH02L - STD70NH02L-1 Revision history 7 Revision history Table 8. Date 09-Sep-2004 10-Feb-2005 04-Feb-2006 19-Jul-2006 Revision history Revision 2 3 4 5 Preliminary version Complete version with curves Inserted new package: IPAK New template, no content change Changes 15/16 STD70NH02L - STD70NH02L-1 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 16/16 |
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