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| IA NT Features Applications Lead free as standard RoHS compliant* ESD protection Protects up to ten data lines Low insertion loss Cell Phones PDAs and Notebooks GPS and SMART Cards *R oH S CO M PL 2FAB-M20R - Integrated Passive & Active Device using MLP General Information The 2FAB-M20R device, manufactured using Thin Film on Silicon technology, provides ESD protection for the external ports of portable electronic devices such as cell phones, modems and PDAs. The ESD protection provided by the component enables a data port to withstand a minimum 8 KV Contact /15 KV Air Discharge per the ESD test method specified in IEC 61000-4-2. The device measures 3.5 mm x 3.5 mm and is intended to be mounted directly onto an FR4 printed circuit board. The MLP device meets typical thermal cycle and bend test specifications. GROUND PAD I/O PADS MLP PACKAGE Electrical & Thermal Characteristics Electrical Characteristics (TA = 25 C unless otherwise noted) Resistance Capacitance @ 2.5 V 1 MHz Rated Standoff Voltage Breakdown Voltage @ 1 mA Forward Voltage @ 10 mA Leakage Current @ 3 V ESD Protection: IEC 61000-4-2 Contact Discharge Air Discharge Symbol R C VWM VBR VF ID Minimum 90 16 6.0 Nominal 100 20 5.0 0.8 Maximum 110 24 Unit pF V V V 0.1 8 15 A kV kV Thermal Characteristics (TA = 25 C unless otherwise noted) DC Power Rating Operating Temperature Range Storage Temperature Range P TJ TSTG -40 -55 25 25 100 +85 +150 mW C C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAB-M20R - Integrated Passive & Active Device using MLP Product Dimensions This silicon-based device is packaged using micro leadframe packaging technology. The MLPs have an exposed die attach pad that provides the interconnect medium from die to PCB. The pads are arranged for easy PCB routing. The pitch is 0.5 mm and the dimensions for the packaged device are shown below. 3.51 (0.138) 0.75 (0.0295) Recommended Pad Layout 3.51 (0.138) 3.51 (0.138) 2.01 (0.079) FAB B0412 3.51 (0.138) 3.51 (0.138) 0.40 (0.016) 0.51 (0.020) 0.5 (0.020) How to Order 2.01 (0.0790) 0.75 (0.0295) 2 FAB -- M 20 R Thin Film Model MLP Package No. of Solder Pads 2.03 (0.080) 0.27 (0.0106) Packaging Option R = Tape and Reel Packaged 3000 pcs. / 13 reel (100 % Sn Termination) 0.43 (0.0170) DIMENSIONS = MILLIMETERS (INCHES) Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAB-M20R - Integrated Passive & Active Device using MLP Block Diagram The MLP Device block diagram below includes the pin names and basic electrical connections associated with each channel. EXT1 R1 INT1 EXT10 R10 INT10 GND GND EXT2 R2 EXT3 R3 INT2 EXT9 R9 INT9 INT3 EXT8 R8 INT8 GND GND EXT4 R4 GND INT5 EXT7 R7 INT7 EXT5 R5 INT5 EXT6 R6 INT6 Frequency Response Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 2FAB-M20R - Integrated Passive & Active Device using MLP Device Pin Out The Pin-Out for the device is shown below. Note also that the device is shown with bottom side pads facing up. EXT4 EXT5 EXT7 EXT7 EXT8 20 19 18 17 16 EXT3 EXT2 EXT1 INT1 INT2 1 2 3 4 5 6 7 8 9 10 INT3 INT4 INT5 INT6 INT7 15 14 13 12 11 EXT9 EXT10 INT10 INT9 INT8 Pin Out Function Pin Out Function Pin Out Function Pin1 EXT3 Pin6 INT3 Pin11 INT8 Pin2 EXT2 Pin7 INT4 Pin12 INT9 Pin3 EXT1 Pin8 INT5 Pin13 INT10 Pin4 INT1 Pin9 INT6 Pin14 EXT10 Pin5 INT2 Pin10 INT7 Pin15 EXT9 Pin Out Function Pin16 EXT8 Pin17 EXT7 Pin18 EXT6 Pin19 EXT5 Pin20 EXT4 Packaging The surface mount product is packaged in a 12 mm x 8 mm Tape and Reel format per EIA-481 standard. TOP SIDE VIEW (INTO COMPONENT POCKET) DIMENSIONS = 0.3 0.05 (.01 .002) 2.0 0.05 (.08 .002) 4.0 0.1 (.16 .004) 1.5 0.1/-0 (.06 .004/-0) DIA. 1.75 0.1 (.07 .004) MILLIMETERS (INCHES) R 0.3 MAX. (0.01) 12.0 0.3 (.47 .01) 5.5 0.3 (.22 .01) 3.9 0.1 (.154 .004) 8.0 0.3 (.31 .01) R 0.25 TYP. (0.010) 0.9 0.1 (.035 .004) 3.9 0.1 (.154 .004) ORIENTATION OF COMPONENT IN POCKET BACKSIDE FACING UP Reliable Electronic Solutions Asia-Pacific: TEL +886- (0)2 25624117 * FAX +886- (0)2 25624116 Europe: TEL +41-41 768 5555 * FAX +41-41 768 5510 The Americas: TEL +1-951 781-5492 * FAX +1-951 781-5700 www.bourns.com Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT(c) 2004, BOURNS, INC. LITHO IN U.S.A. 06/05 e/IPA0507 2FAB-M20R REV. A 03/05 |
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