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| oH VE S CO AV R M AI SIO PL LA N IA BL S NT E Features Concave terminals Lead free version available (see How to Order "Termination" options) RoHS compliant* 8 bit multiple applications Smallest bussed chip array E 24 Series from 10 ohms to 1 megohm *R CAT25 - Thick Film Chip Resistor Arrays Electrical Characteristics Parameters Number of Resistors Resistance Range E24 Resistance Tolerance Power Rating/Resistor Rating Temperature T.C.R. Maximum Operating Voltage Operating Temperature CAT25 8 10 ohms to 1 megohm 5% 62.5 mW +70 C +/-200 ppm/C 25 V -55 C to +125 C Test Method How To Order CA T 25 - 103 J A __ Product CA = Chip Array Pin Style T = Concave Model Resistance Value 103 = 10K ohms Tolerance J=5% Electrical Circuit A = 8 Resistors, Bussed Type JIS-C-5202.5.1 JIS-C-5202.5.2 Environmental Characteristics Specification Short Time Overload Load Life Humidity Load Life Resistance to Soldering Heat Terminal Strength Temperature Cycle Vibration Insulation Resistance Dielectric Withstanding Voltage Lead Solderability Characteristics +/-(3 % +0.1 ohm) +/-(5 % +0.1 ohm) +/-(3 % +0.1 ohm) +/-(1 % +0.1 ohm) +/-(1 % +0.1 ohm) +/-(2 % +0.1 ohm) +/-(1 % +0.1 ohm) 1000 megohms minimum 50 VRMS >95 % Test Method JIS-C-5202.5.5 JIS-C-5202.7.10 JIS-C-5202.7.9 JIS-C-5202.6.4 JIS-C-5202.6. JIS-C-5202.7.4 JIS-C-5202.6.3 JIS-C-5202.5.6 JIS-C-5202.5.7 JIS-C-5202.6.5 Terminations LF = Tin-plated (lead free) Blank = Solder-plated For Standard Values Used in Capacitors, Inductors, and Resistors, click here. Outline Drawing Land Pattern 4.8 - 5.2 (.190 - .205) 2.10 0.20 (.083 .008) 2.8 - 3.0 (.110 - .118) 0.9 - 1.1 (.035 - .043) 103 0.30 0.20 (.012 .008) 0.80 0.10 (.032 .004) 4.00 0.20 (.157 .008) 0.35 0.20 (.014 .008) 0.25 0.20 (.010 .008) 0.55 0.10 (.022 .004) 3.3 - 3.4 (.130 - .133) 3.2 - 3.5 (.125 - .138) 0.50 0.20 (.020 .008) 0.4 - 0.5 (.016 - .020) 0.80 (.032) 0.25 0.15 DIA. (.010 .006) Electrical Circuit 0.40 0.20 (.016 .008) DIMENSIONS ARE: MM (INCHES) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CAT25 - Thick Film Chip Resistor Arrays Soldering Profile for Lead Free Chip Resistors and Arrays 275 <1> Maximum of 20 seconds between 260 C peak <1> 255 C +255 C and +260 C 225 220 C Temperature (C) 190 C 175 150 C 60 - 90 seconds Ramp Down 3 C/second 125 60 - 120 seconds 10 seconds minimum 75 Ramp Up 3 C/second maximum 25 0 50 100 150 Time (seconds) 200 250 300 Packaging 12 (.472) embossed tape 4,000 pcs. per reel Material Substrate Element Coating Terminal Alumina 96 Ruthenium Oxide Glass AgPb, Plated Ni+SnPb REV. 04/06 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. |
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