 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ISL3984 TM P RE L I M I NA R Y Data Sheet December 2000 File Number 4862.4 2.4GHz Power Amplifier and Detector [ /Title (ISL39 84) /Subject (2.4G Hz Power Amplifier and Detector) /Autho r () /Keywords (Intersil Corporation, semiconductor, Wireless Communications , RF, Radio Frequency , IF, Intermediate FreThe ISL3984 is a 2.4GHz monolithic SiGe Power Amplifier designed to operate in the ISM Band. It features two low voltage single supply stages. Cascaded, they deliver 18dBm (Typ) output power for the typical DSSS signal (ACPR, 1st Side Lobe < -30dBc, 2nd Side Lobe < -50dBc). In addition, the device includes a 2.4GHz detector which is accurate over a 15dB dynamic range within ()1dB. Therefore, an accurate ALC function can be implemented. The ISL3984 is housed in a 16 lead MLFP package well suited for PCMCIA board applications. Features * Single Supply . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 3.6V * Output Power . . . . . . . . . . . 18dBm (Typ) at ACPR, DSSS, 1st Side Lobe < -30dBc, 2nd Side Lobe < -50dBc * Power Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30dB (Typ) * Detector Linear Input Power Range . . . . . . . . . . . . . .15dB * Detector Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1dB Applications * IEEE802.11 1, 2 or 5.5Mbps Standard * Systems Targeting IEEE802.11b, 11Mbps Standard * Wireless Local Area Networks (WLAN) * PCMCIA Wireless Transceivers * ISM Systems Including Automatic Level Control (ALC) * TDMA Packet Protocol Radios Ordering Information PART NUMBER ISL3984IR ISL3984IR96 TEMP RANGE (oC) -40 to 85 -40 to 85 PACKAGE 16 Ld MLFP Tape and Reel PKG. NO. L16.4x4 Pinouts ISL3984 (MLFP) TOP VIEW RF_IN GND GND GND 9 Simplified Block Diagram DS_VCC DET_OUT 13 12 11 10 8 GND PACKAGE PINOUT SUBJECT TO CHANGE 7 GND 6 RF_OUT 5 GND RF_IN PEAK DETECTOR RF_OUT VCC_DET 14 PE 15 BIAS_GND 16 BIAS LOG 1 BIAS_VCC 2 REXT 3 DS_VCC 4 GND PE REXT DET_OUT 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright (c) Intersil Corporation 2000 PRISM(R) is a registered trademark of Intersil Corporation. PRISM and design is a trademark of Intersil Corporation. ISL3984 Pin Descriptions PIN NUMBER 1 2 NAME DESCRIPTION BIAS_VCC Power Supply. REXT Bias Resistor, biasing scheme independent of absolute temperature. Driver Stage Power Supply. DC and RF Ground. RF Output of the Power Amplifier. DC and RF Ground. RF Input of the Power Amplifier. DC and RF Ground. Detector Output. Detector Power Supply. Digital Input Control Pin to enable operation of the Power Amplifier. Enable logic level is high. 3 4, 5 6 7, 8, 9, 10 11 12 13 14 15 DS_VCC GND RF_OUT GND RF_IN GND DET_OUT VCC_DET PE The ISL3984 contains a highly linear RFPA designed to deliver 18dBm and meet an ACPR specification of -30dBc in the 2.4 to 2.5GHz ISM band. The performance of this two stage RFPA can be optimized by adjusting the bias current with a dedicated resistor. No external positive or negative power supplies are required to set the bias currents. The on chip bias network provides the optimum bias current temperature compensation when low TC external resistor is used. To get the best performance from the ISL3984, the output stage matching network can be tailored using external components. The ISL3984 power detect function provides a DC output voltage that is proportional to the logarithm of the output power. For an output power of 18dBm, the detector is accurate to within a 0.5dB. The slope of the detector output voltage is 100mV/dB over a 15dB dynamic range. A simple application of the detector is to provide in-line monitoring of the output power using a DC voltmeter. No longer is a power meter or spectrum analyzer required. A more value added application would use the HFA3861B/HFA3863 Baseband Processor to dynamically monitor the ISL3984 output power and to control transmit power by adjusting the AGC of the HFA3783 IF Quadrature Modem to provide the best possible error free data transfer rate for any given environment. Closed loop power control is very important feature which compensates for variability in the transmit chain (radio to radio, channel to channel, over temperature...). The ISL3984 power up/down feature integrates the power down capability onto the IC and requires no external components thus freeing up board space and reducing external component count and cost. When the CMOS compatible Power Enable (PE) pin is driven low, the total supply current drops to under 50A in, typically, 300ns. When the PE pin is driven high, the full ISL3984 output power is available in a few hundred nanoseconds. In summary, the ISL3984 RFPA provides a highly cost effective solution for the PA function by integrating many features that would require significant development time, drive up the total bill of materials cost and consume precious board space. It mates seamlessly with the other PRISM II ICs to provide a highly integrated, cost effective 11Mb/s WLAN solution in the 2.4 to 2.5GHz ISM band. 16 BIAS_GND DC and RF Ground. The ISL3984 works seamlessly with the PRISM II and PRISM II.V WLAN chip set components to give you a highly integrated, cost effective 11Mb/s WLAN solution in the 2.4 to 2.5GHz ISM band. The ISL3984 is fabricated in the fastest SiGe BiCMOS process available allowing superior RF performance, normally found only in GaAs ICs. Cost effective functions, normally requiring external components, are integrated into one IC. The ISL3984 integrates the following functions in one compact 16 pin MLFP: * Two Stage, 30dB Gain RFPA, * Logarithmic power detect function (15dB Dynamic Range), * CMOS level compatible Power Up/Down function, * Single Supply, 2.7V to 3.6V Operation. 2 ISL3984 Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4V Voltage on Any Other Pin. . . . . . . . . . . . . . . . . . . -0.3 to VCC +0.3V VCC to VCC Decouple . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +0.3V Any GND to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +0.3V Thermal Information Thermal Resistance (Typical, Note 1) JA (oC/W) MLFP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC Operating Conditions Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40 to 85oC Supply Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . 2.7V to 3.6V CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with "direct attach" features. See Intersil TB379. General DC Electrical Specifications PARAMETER Supply Voltage Total Power Amplifier Supply Current at 3.3V, 18dBm Output RF Detector Supply Current Power Down Supply Current Power Up/ Down Speed CMOS Low Level Input Voltage CMOS High Level Input Voltage (VDD = 3.6V) CMOS Threshold Voltage CMOS High or Low Level Input Current TEMP. (oC) Full 25 25 Full Full Full Full Full Full MIN 2.7 0.7*VDD >0.3*VDD -10 TYP 137 200 300 0.5*VDD MAX 3.6 2 0.3*VDD <0.7*VDD +10 UNITS V mA mA A ns V V V A Power Amplifier AC Electrical Specifications PARAMETER RF Frequency Range Power/Voltage Gain Input 50 VSWR Output 50 VSWR Output Power Output Stability VSWR Output Load Mismatch NOTE: VCC = 3.3V, f = 2.45GHz, Unless Otherwise Specified. Typical Application Circuit (external input and output matching networks) has been used. TEMP. (oC) Full Full 25 25 MIN 2400 27 TYP 30 18 MAX 2500 35 2:1 3:1 10:1 10:1 UNITS MHz dB dBm - TEST CONDITIONS ACPR, DSSS, 1st Side Lobe <30dBc, 2nd Side Lobe <-50dBc Output Spurs Less than -60dBc (Note 2) Full Full Full 2. Devices sustain no damage when subjected to a mismatch of maximum 10:1. Peak Detector AC Electrical Specifications PARAMETER RF Output Detector Response Time RF Output Detector Voltage Range RF Output Detector Linearity RF Output Detector Accuracy RF Output Detector Slope TEST CONDITIONS External Capacitor, C = 5pF Load > 1M Over Linear Range 600mVDC Output Over Linear Range TEMP. (oC) Full Full Full Full Full MIN 0 -0.5 -1 TYP 0.15 10 MAX 1.5 0.5 +1 UNITS s V dB/V dB dB/V 3 ISL3984 Typical Application Example ISL3984 - 16 PIN MLFP PACKAGE L2 3.3V P1 C3 0.1F P2 D1 DL4001 DETOUT VCC C9 1000pF C11 270pF R3 10 PE C6 1000pF 15 R2 100k VCC 16 6 5 R4 1k 13 14 8 7 12 11 10 9 C1 4.7F BLM31P500S VCC C10 1 RFIN (50) 2.7pF 2 4.64k L3 1.5nH L1 BLM10A1215 C2 1000pF L5 2.2nH L4 BLM10A1215 C5 1000pF C7 10pF 3 4 C4 1000pF R1 RFOUT (50) C8 1.8pF V CC Typical Performance Curves -5 -5 INPUT RETURN LOSS (dB) -17 -20 2.7V INPUT RETURN LOSS (dB) -17 -20 -40oC 25oC -29 85oC -29 3.6V 2.0 2.4 2.5 3.0 2.0 2.4 2.5 3.0 FREQUENCY (GHz) FREQUENCY (GHz) FIGURE 1. INPUT RETURN LOSS OVER VOLTAGE FIGURE 2. INPUT RETURN LOSS OVER TEMPERATURE 4 ISL3984 Typical Performance Curves (Continued) OUTPUT RETURN LOSS (dB) -4 OUTPUT RETURN LOSS (dB) -4 -40oC 2.7V -9 -10 3.6V 2.0 2.4 2.5 3.0 -9 -10 2.0 85oC 2.4 2.5 25oC 3.0 FREQUENCY (GHz) FREQUENCY (GHz) FIGURE 3. OUTPUT RETURN LOSS OVER VOLTAGE FIGURE 4. OUTPUT RETURN LOSS OVER TEMPERATURE 32 3.6V 30 LINEAR GAIN (dB) 2.7V LINEAR GAIN (dB) 28 32 30 28 25oC -40oC 85oC 2.0 2.4 2.5 3.0 2.0 2.4 2.5 3.0 FREQUENCY (GHz) FREQUENCY (GHz) FIGURE 5. LINEAR GAIN OVER VOLTAGE OUTPUT POWER (dBm) COMPRESSION (dBm) 0 1 2 2.7V 3.6V OUTPUT POWER (dBm) COMPRESSION (dBm) FIGURE 6. LINEAR GAIN OVER TEMPERATURE 0 1 2 85oC 25oC -40oC 3.6V 2dB/DIV. 2.7V 85oC -40oC 2dB/DIV. 25oC -25 -11 INPUT POWER (dBm) -5 -25 -11 INPUT POWER (dBm) -5 FIGURE 7. GAIN COMPRESSION OVER VOLTAGE FIGURE 8. GAIN COMPRESSION OVER TEMPERATURE 5 ISL3984 Typical Performance Curves (Continued) 10dB/DIV. 10dB/DIV. 2.7V 3V 3.3V 3.6V -40C 25C 85C CENTER FREQUENCY 2450MHz SPAN 50MHz INPUT POWER -2dBm CENTER FREQUENCY 2450MHz SPAN 50MHz INPUT POWER -2dBm FIGURE 9. DSSS OUTPUT SIGNAL OVER VOLTAGE 0.9 0.8 0.7 DETECTOR OUTPUT (V) 0.6 0.5 0.4 0.3 0.2 0.1 0 13 14 15 16 17 18 19 20 OUTPUT POWER (dBm) 2.7V 3.6V FIGURE 10. DSSS OUTPUT SIGNAL OVER TEMPERATURE 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 13 14 15 16 17 18 19 20 OUTPUT POWER (dBm) -40oC 25oC 85oC FIGURE 11. DETECTOR OUTPUT OVER VOLTAGE 6 DETECTOR OUTPUT (V) FIGURE 12. DETECTOR OUTPUT OVER TEMPERATURE ISL3984 Micro Lead Frame Plastic Package (MLFP) 2X A D D/2 D1 D1/2 2X 6 0.50 DIA. 1 2 3 N E1/2 E1 E/2 E 0.25 C B 0.25 C A L16.4x4 16 LEAD MICRO LEAD FRAME PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220-VGGC ISSUE A) INCHES SYMBOL A A1 A2 A3 b D D1 MIN MAX 0.039 0.002 0.031 MILLIMETERS MIN MAX 1.00 0.05 0.80 0.20 REF 0.23 0.35 5 NOTES 0.008 REF 0.009 0.014 0.157 BSC 0.147 BSC 0.088 - 4.00 BSC 3.75 BSC 2.25 4.00 BSC 3.75 BSC 2.25 0.65 BSC 0.50 16 4 4 0.75 2 3 3 0.60 12 7 7 0.20 C B 2X 0.20 C A 2X 0 A2 A C 0.05 C SEATING PLANE SIDE VIEW 5 4X P b D2 0.10 M C A B 7 D2/2 N 4X P 1 2 3 E2 7 L e (Nd-1)Xe REF. BOTTOM VIEW C L 5 b E2/2 (Ne-1)Xe REF. A3 A1 TOP VIEW B D2 E E1 E2 e L N Nd Ne P 0.157 BSC 0.147 BSC 0.088 0.026 BSC 0.019 16 4 4 0.009 0.024 12 0.029 0.24 - CC A1 C L Rev. 2 8/00 NOTES: 1. Dimensioning and tolerancing per ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd is the number of terminals in the X direction, and Ne is the number of terminals in the Y direction. 4. Controlling dimension: Millimeters. Converted dimensions to inches are not necessarily exact. Angles are in degrees. 5. Dimension b applies to the plated terminal and is measured between 0.20mm and 0.25mm from the terminal tip. 6. The Pin #1 identifier exists on the top surface as an indentation mark in the molded body. 7. Dimensions D2 and E2 are the maximum exposed pad dimensions for improved grounding and thermal performance. SECTION "C-C" e TERMINAL TIP FOR ODD TERMINAL/SIDE FOR EVEN TERMINAL/SIDE e All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at website www.intersil.com/quality/iso.asp. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 7 |
Price & Availability of ISL3984
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |