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TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module Features
10
Functional Block Diagram
Vref
1
GND
Vmode
2
1 Bit Bias Control
9
GND
GND
3
8
RFout
* * * * * * * * * * *
RFin
4
7
GND
Vcc1
5
6
Vcc2
Product Description
The TQM713019 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for use in mobile phones. Its extremely small 4x4mm package makes it ideal for today's compact data enabled phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The TQM713019 is designed on TriQuint's advanced InGaP HBT GaAs technology offering state of the art reliability, temperature stability, and ruggedness. Selectable bias mode and a shutdown mode with low leakage current improves talk and standby time. The output match, realized within the module package, optimizes efficiency/linearity at maximum rated output power. The module is a 4x4mm land grid array with backside ground. The TQM713019 is footprint compatible with industry standard 4x4mm CDMA PA modules.
InGaP HBT Technology High Efficiency: 41% CDMA Low Leakage Current: < 1uA Low Icq = 55mA Supports new chipsets with Vref @ 2.6V Capable of running as 0-bit PA in low bias mode to 28dBm Optimized for 50 system Small 10 pin 4x4mm module Excellent Rx band noise performance CDMA 1XRTT, 1XEV-DO compliant Full ESD protection
Applications
* * IS-95 / CDMA2000 Single mode, dual mode, and tri mode CDMA/AMPS phones
Package Style
4mm x 4mm LGA package
Electrical Specifications
Parameter Frequency CDMA mode maximum Gain CDMA ACPR CDMA ALTR Power Supply Current @ 28dBm IREF Rx Band Noise Pout1 Min 824 28 29 50 65 450 2.0 -140 Typ Max 849 Units MHz dBm dB dBc dBc mA mA dBm/Hz
Note 1 : CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.85VDC, Tc=25C
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
1
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Absolute Maximum Ratings
Symbol PIN VCC VREF VMODE TCASE TSTORE RF Input Power Supply Voltage Reference Voltage Vmode (1 bit Bias Control) Case Operating Temperature Storage Temperature Parameter Absolute Maximum Value 10 0.0 to 5.0 0.0 to 3.5 0.0 to 3.5 -40 to +100 -55 to +150 Units dBm VDC VDC VDC C C
Note: The part may not survive all maximums applied simultaneously.
Recommended Operating Conditions
Symbol VCC VREF PA On PA Off VMODE High Bias Mode Low Bias Mode TCASE Case Operating Temperature Vmode (1 bit Bias Control) 0 2.5 -30 2.85 25 0.5 3.0 +85 VDC VDC C Parameter Supply Voltage Reference Voltage 2.70 0 2.85 <0.5 2.95 VDC VDC Min. 3.2 Typ/Nom 3.4 Max. 4.2 Units VDC
Power Range Truth Table
Parameter High Power Low Power Shut Down VREF 2.85 V 2.85 V 0.0 V VMODE Low High Low Range 16 dBm - 28 dBm < 16 dBm -
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
2
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
CDMA (IS-98C) Electrical Characteristics1
Parameter RF Frequency Large Signal Gain Pout = +28 dBm Pout = +16 dBm Adjacent Channel Power Pout +16dBm Adjacent Channel Power Pout +16dBm Quiescent Current IREF IMODE PAE PAE Input VSWR Harmonics 2fo 3fo Spurious / Stability Ruggedness Noise Power in Rx Band Note 1: Note 2: Pout +28dBm; 10:1 VSWR; VCC = 3.2 to 4.2V; -30 C < Temp < 85C 10:1 VSWR; Pin = +10dBm; -30 C < Temp < 85C Pout = +28dBm, IS-95 Standard No degradation -140 -135 dBm/Hz VCC = 3.4V; VREF = 2.85V; VMODE = 2.85V ; Temp = 25 C Pout = +28dBm; VCC = 3.4V; VREF = 2.85V; VMODE = 0V; Temp = 25C All Conditions Pout = +28dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 0V; Temp = 25C Pout = +16dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 2.85V; Temp = 25C All Terminals Pout +28dBm -50 -65 -40 -40 -65 dBc dBc dBc 1.5 :1 2.0 :1 9.5 % 41 75 uA % (ACPR2)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C -60 -65 55 2 3 -57 -57 dBc dBc mA mA +16dBm Pout +28dBm (ACPR1)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C -50 -52 -45 -45 dBc dBc +16dBm Pout +28dBm VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C 25 23 29 27 33 dB dB Conditions Min. 824 Typ/Nom Max. 849 Units MHz
Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25C unless otherwise specified; TriQuint Test Board ACPR1 Measured @ 885kHz Offset; ACPR2 Measured @ 1.98MHz
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
3
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
cdma2000 (IS-98D) Electrical Characteristics1,3
Parameter RF Frequency Large Signal Gain Pout = +27.5 dBm Pout = +16 dBm Adjacent Channel Power Pout +16dBm Adjacent Channel Power Pout +16dBm Quiescent Current IREF IMODE PAE PAE Input VSWR Noise Power in Rx Band Note 1: Note 2: Note 3: VCC = 3.4V; VREF = 2.85V; VMODE = 2.85V ; Temp = 25 C Pout = +27.5dBm; VCC = 3.4V; VREF = 2.85V; VMODE = 0V; Temp = 25C All Conditions Pout = +27.5dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 0V; Temp = 25C Pout = +16dBm; VCC = 3.4V; VRE F = 2.85V; VMODE = 2.85V; Temp = 25C All Terminals Pout = +28dBm, IS-95 Standard 1.5 :1 -140 2.0 :1 -135 dBm/Hz 9.5 % 40 75 uA % (ACPR2)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C -60 -65 55 2 3 -57 -57 dBc dBc mA mA +16dBm Pout +27.5dBm (ACPR1)2 VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C -50 -55 -45 -45 dBc dBc +16dBm Pout +27.5dBm VCC = 3.2 to 4.2V; VREF = 2.85V; -30 C < Temp < 85C 25 23 28.5 27 dB dB Conditions Min. 824 Typ/Nom Max. 849 Units MHz
Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25C unless otherwise specified; TriQuint Test Board ACPR1 Measured @ 885kHz Offset; ACPR2 Measured @ 1.98MHz 9600 bps Fundamental and Supplemental Traffic Channels (0 dB), peak-to-average ratio (CCDF=1%) = 4.5dB
AMPS Mode Electrical Characteristics1
Parameter RF Frequency High Power Output, Pout Large Signal Gain PAE Note 1: Pout = 31.5dBm; VCC = 3.4V; Temp = 25C 50 Conditions Min. 824 31.5 27.5 57 Typ/Nom Max. 849 Units MHz dBm dB %
Test Conditions: VCC=3.4VDC , VREF=2.85VDC, TC = 25C unless otherwise specified; TriQuint Test Board
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
4
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Pin Out and Assignments
Vref
1 10
GND
Vmode
2
1 Bit Bias Control
9
GND
GND
3
8
RFout
RFin
4
7
GND
Vcc1
5
6
Vcc2
Pin 1 2 3 4 5 6 7 8 9 10 Paddle1
Symbol VREF VMODE GND RFIN VCC1 VCC2 GND RFOUT GND GND GND
Description Regulated voltage for bias setting. VREF is set to 0VDC to power off the TQM713019 1 step bias control Ground RF input. The RF circuit is DC grounded internally2. 50 Ohm RF impedance. Collector voltage for input stage Collector voltage for output stage Ground RF output. The RF circuit is DC blocked internally. 50 Ohm RF impedance Ground Ground Device ground and thermal path for heat removal
Note 1: TriQuint recommends the use of several via holes to the backside ground under the paddle Note2: Internal DC ground for RFIN
RFin
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
5
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Typical Performance
Test Conditions (Unless Otherwise Specified): VCC=3.4VDC, VREF=2.85VDC, VMODE= 0 or 2.85VDC, POUT=28.0 or 16dBm
Icc @ 836MHz (IS-95 CDMA) 600 500 400
Icc (mA)
- 30C 25C 85C
PAE @ 836MHz (IS-95 CDMA) 50.0 40.0
- 30C
PAE (%)
30.0 20.0 10.0 0.0
25C 85C
300 200 100 0 0 24 6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm )
024
6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm )
ACPR @ 836MHz (IS-95 CDMA)
-40 -45
ACPR (dBc)
- 30C 25C
ALTR @ 836MHz (IS-95 CDMA) -50 -55
- 30C
-50 -55 -60 -65 -70 0
85C
ALTR (dBc)
-60 -65 -70 -75 -80
25C 85C
24
6 8 10 12 14 16 18 20 22 24 26 28 Pout (dBm )
0
2
4
6
8 10 12 14 16 18 20 22 24 26 28 Pout (dBm )
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
6
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Typical Performance (Continued)
Gain @ 836MHz (IS-95 CDMA) 30 28
PAE @ Pout = 28dBm (IS-95 CDMA) 50.0 48.0 46.0 500 475 450
85C 25C -30C
Gain (dB)
PAE (%)
26 24 22 20 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 Pout (dBm ) -30C 25C 85C
44.0 42.0 40.0 38.0 824
425 400 375 350 849
829
834 839 Freq (MHz)
844
PAE @ Pout = 16dBm (IS-95 CDMA) 12.0 10.0
PAE (%)
ACPR and ALTR @ Pout = 28dBm (IS-95 CDMA) 150 140
ACPR (dBc) Icc (mA)
-44 -46 -48 -50 -52 -54 -56 -58 -60 -62 -64 824
-30C 85C 25C
-50 -52 -54 -58 -60 -62 -64 -66 -68 834 839 Freq (MHz) 844 -70 849
ALTR (dBc)
-56
8.0 6.0 4.0 2.0 824
85C 25C -30C
130 120 110 100 849
829
834 839 Freq (MHz)
844
829
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
Icc (mA)
7
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Typical Performance (Continued)
ACPR and ALTR @ Pout = 16dBm (IS-95 CDMA) -44 -46 -48
ACPR (dBc)
-60 -62 -64
ALTR (dBc)
Gain @ Pout = 16dBm and 28dBm (IS-95 CDMA) 35 32 31 30 34 33 32 31
85C 25C -30C
High Power Gain (dB)
-50 -52 -54 -56 -58 -60 -62 -64 824 829 834 839 Freq (MHz)
-30C 85C 25C
-66 -68 -70 -72 -74 -76 -78 -80 849
29 28 27 26 25 24 23 22 824 829 834 839 Freq (MHz) 844
30 29 28 27 26 25 849
844
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
8
Low Power Gain (dB)
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Application Information; tuning procedures; board layout precautions
TriQuint offers our customers the below evaluation board as a means for testing and analysis of TQM713019. The evaluation board schematic and picture are provided for preliminary analysis and design. Figure 1 shows the TriQuint application board, while Figure 2 shows the schematic of the board. 1 10 Pin # 1 2 3 4 5 6 7 IN OUT 8 9 10 Figure 1: Evaluation Board Vcc2, Function No Connect Vmode, High/low Bias Mode Vref, Reference Voltage Vcc1, 1st Stage Collector Voltage GND, DC Ground GND, DC Ground 2nd Stage Collector Voltage Vcc2, 2nd Stage Collector Voltage GND, DC Ground GND, DC Ground
10000 pF
Vmode
10000 pF
Vmode
TQM713019
Vref
Vref
GND
GND
GND
RFout
RFout
RFin Vcc1
100000 pF 10uF
RFin
GND
Vcc1
Vcc2 100000 pF 10uF
Vcc2
GND @ PADDLE
Figure 2: Evaluation Board Schematic Data Sheet: Subject to change without notice 9
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
PC Board Layout Recommendations
T J K U
D N M
S
E
DIMENSION D E J K M N S T U
MM 3.85 4.30 0.68 0.45 0.85 1.90 3.80 2.00 1.00
Note1: Only ground signal traces are allowed directly under the package Note 2: Primary dimensions are in millimeters alternate dimensions are in inches.
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
10
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Packaging and Ordering Information
Package Type: 10 Pin Plastic Module Package
Pin 1 2 3 4 5 Top View
10 9 8 7 6
DESIGNATION DESCRIPTION DIMENSION A OVERALL HEIGHT 1.5 +/-0.12 mm D PACKAGE LENGTH 4.0 +/-0.1 mm E PACKAGE WIDTH 4.0 +/-0.1 mm J SOLDER MASK OPENING LENGTH AND 0.575 +/-0.075 mm WIDTH K METAL PAD LENGTH AND WIDTH DISTANCE BETWEEN METAL PAD AND PACKAGE EDGE GND SOLDER MASK OPENING WIDTH GND SOLDER MASK OPENING LENGTH DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE DISTANCE BETWEEN GND SOLDER MASK OPENING AND PACKAGE EDGE TERMINAL PITCH FOR TERMINAL 1-10, 2-9, 3-8, 4-7 AND 5-6 0.40 0.10 2.00 3.80 0.10 1.00 3.400 +/-0.05 mm +/-0.025 mm +/-0.05 mm +/-0.05 mm +/-0.1 mm +/-0.1 mm mm mm
Side View
5 4 3 2 1
6 7 8 9 10
Note:
P T S R Q e e1
TERMINAL PITCH FOR TERMINAL 1-2-3- 0.850 4-5 AND 6-7-8-9-10
GND SOLDER MASK OPENING IS NOT CENTERED ON THE PACKAGE
Bottom View
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
11
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Package Marking
10
1 2 3 4 5 Bottom View
9 713019 YYWW XXXX 8 7 6 Top View
WHITE INK OR LASER MARK Line 1: Part Number: 713019 Line 2: YYWW = Year and Work Week Line 3: XXXX = TriQuint assembly lot number
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
12
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Tape & Reel
PART CAVITY
DISTANCE BETWEEN CENTERLINE COVER TAPE CARRIER TAPE
FEATURE LENGTH WIDTH DEPTH PITCH CAVITY TO PERFORATION LENGTH DIRECTION CAVITY TO PERFORATION WIDTH DIRECTION WIDTH WIDTH
SYMBOL A0 B0 K0 P1 P2 F C W
SIZE (in) SIZE (mm) 0.171 4.35 0.171 4.35 0.071 1.80 0.315 8.00 0.079 2.00 0.217 0.362 0.472 5.50 9.20 12.00
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
13
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
SOIC-8, QSOP 16, MSOP 08 & 10, TSSOP 16, HP VFQFP-N 4X4 & 5X5, VQFN-24, VQFN-20. Modules 4X4 FEATURE PART FLANGE DIAMETER THICKNESS SPACE BETWEEN FLANGE OUTER DIAMETER ARBOR HOLE DIAMETER KEY SLIT WIDTH KEY SLIT DIAMETER SYMBOL A W2 W1 N C B D
13" REEL
HUB
SIZE (in) SIZE (mm) 12.992 330 0.717 18.2 0.504 12.8 4.016 102.0 0.512 13.0 0.079 2.0 0.787 20.0
MODULE 4X4 User Direction of Feed
Reel Quantity = 2500 units
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
14
TQM713019
Data Sheet
3V HBT GaAs CDMA 4x4mm Power Amplifier Module
Additional Information 1T
1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: Hwww.triquint.comH Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902
For technical questions and additional information on specific applications: Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2004 TriQuint Semiconductor, Inc. All rights reserved.
For additional information and latest specifications, see our website: www.triquint.com Rev. D, March 2005
Data Sheet: Subject to change without notice
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