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EGF1A THRU EGF1D
ULTRAFAST SURFACE MOUNT RECTIFIER
Reverse Voltage - 50 to 200 Volts Forward Current - 1.0 Ampere
D
DO-214BA
FEATURES
Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Ideal for surface mount automotive applications High temperature metallurgically bonded construction Superfast recovery times for high efficiency Glass passivated cavity-free junction Built-in strain relief Easy pick and place High temperature soldering guaranteed: 450C/5 seconds at terminals Complete device submersible temperature of 265C for 10 seconds in solder bath
E P A T
N
0.060 (1.52) 0.040 (1.02)
T
E
*
0.187 (4.75) 0.167 (4.24)
0.0105 (0.27) 0.0065 (0.17)
0.118 (3.00) 0.106 (2.69)
0.108 (2.74) 0.098 (2.49)
0.060 (1.52) 0.030 (0.76)
0.152 TYP. 0.006 0.226 (5.74) 0.196 (4.98)
0.114 (2.90) 0.094 (2.39)
MECHANICAL DATA
Case: JEDEC DO-214BA molded plastic over glass body Terminals: Solder plated, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Weight: 0.0048 ounces, 0.120 gram
Patent No. 3,996,602, brazed-lead assembly by Patent No. 3,930,306 and lead forming by Patent No. 5,151,846
(R)
*Glass-plastic encapsulation technique is covered by
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25C ambient temperature unless otherwise specified.
SYMBOLS
EGF1A
EGF1B
EGF1C
EGF1D
UNITS
Device Marking Code Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current at TL=125C Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0A Maximum DC reverse current at rated DC blocking voltage Typical reverse recovery time (NOTE 1) Typical junction capacitance (NOTE 2) Typical thermal resistance (NOTE 3) Operating junction and storage temperature range
NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied VR=4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas
EA VRRM VRMS VDC I(AV) 50 35 50
EB 100 70 100 1.0
EC 150 105 150
ED 200 140 200 Volts Volts Volts Amps
IFSM VF IR trr CJ RJA RJL TJ,TSTG
30.0 1.0 5.0 50.0 50.0 15.0 85.0 30.0 -65 to +175
Amps Volts A ns pF C/W C
TA=25C TA=125C
4/98
RATINGS AND CHARACTERISTICS CURVES EGF1A THRU EGF1D
AVERAGE FORWARD RECTIFIED CURRENT, AMPERES FIG. 1 - MAXIMUM FORWARD CURRENT DERATING CURVE FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
1.0
PEAK FORWARD SURGE CURRENT, AMPERES
30 25 20 15 10 5.0 0 1 10
TJ=TJ max. 8.3ms SINGLE HALF SINE WAVE (JEDEC Method)
0.5
RESISTIVE OR INDUCTIVE LOAD P.C.B. MOUNTED on 0.2 x 0.2" (5.0 x 5.0mm) COPPER PAD AREAS
0 0 25 50 75 100 125 150 175
LEAD TEMPERATURE, C
100
NUMBER OF CYCLES AT 60 HZ
FIG. 3 -TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS
50
FIG. 4 - TYPICAL REVERSE CHARACTERISTICS
1,000
PULSE WIDTH=300s 1% DUTY CYCLE
10
INSTANTANEOUS FORWARD CURRENT, AMPERES
INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES
100
TJ=150C
TJ=25C
10
TJ=100C
1
TJ=150C
1
0.1
0.1
TJ=25C
0 0 0.01 0.2 20 40 60 80 100
PERCENT OF RATED PEAK REVERSE VOLTAGE, %
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
INSTANTANEOUS FORWARD VOLTAGE, VOLTS FIG. 6 - TYPICAL TRANSIENT THERMAL IMPEDANCE
70
JUNCTION CAPACITANCE, pF
60 50 40 30 20 10 0 0.1 1 10
TJ=25C f=1.0 MHz Vsig=50mVp-p
TRANSIENT THERMAL IMPEDANCE, C/W
FIG. 5 - TYPICAL JUNCTION CAPACITANCE
100
10
1
100
0.1 0.01
0.1
REVERSE VOLTAGE, VOLTS
1 10 t, PULSE DURATION, sec.
100

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