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Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
GENERAL DESCRIPTION
Enhanced performance, new generation, high-voltage, high-speed switching npn transistor in a plastic full-pack envelope intended for use in horizontal deflection circuits of colour television receivers. Features exceptional tolerance to base drive and collector current load variations resulting in a very low worst case dissipation.
QUICK REFERENCE DATA
SYMBOL VCESM VCEO IC ICM Ptot VCEsat ICsat tf PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector saturation current Fall time CONDITIONS VBE = 0 V TYP. 4.5 0.4 MAX. 1500 700 8 15 35 1.0 0.6 UNIT V V A A W V A s
Ths 25 C IC = 4.5 A; IB = 1.1 A ICM = 4.5 A; IB(end) = 1.1 A
PINNING - SOT186A
PIN 1 2 3 base collector emitter DESCRIPTION
PIN CONFIGURATION
case
SYMBOL
c b
123
case isolated
e
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO IC ICM IB IBM -IB(AV) -IBM Ptot Tstg Tj PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Reverse base current Reverse base current peak value 1 Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -65 MAX. 1500 700 8 15 4 6 100 5 35 150 150 UNIT V V A A A A mA A W C C
average over any 20 ms period Ths 25 C
THERMAL RESISTANCES
SYMBOL Rth j-hs Rth j-a PARAMETER Junction to heatsink Junction to ambient CONDITIONS with heatsink compound in free air TYP. 55 MAX. 3.6 UNIT K/W K/W
1 Turn-off current.
September 1997
1
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 C unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from all three terminals to external heatsink CONDITIONS f = 50-60 Hz; sinusoidal waveform; R.H. 65% ; clean and dustfree MIN. TYP. MAX. 2500 UNIT V
Cisol
Capacitance from T2 to external f = 1 MHz heatsink
-
10
-
pF
STATIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL ICES ICES IEBO BVEBO VCEOsust VCEsat VBEsat hFE hFE PARAMETER Collector cut-off current
2
CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VEB = 7.5 V; IC = 0 A IB = 1 mA IB = 0 A; IC = 100 mA; L = 25 mH IC = 4.5 A; IB = 1.1 A IC = 4.5 A; IB = 1.7 A IC = 100 mA; VCE = 5 V IC = 4.5 A; VCE = 1 V
MIN. 7.5 700 4.0
TYP. 13.5 13 5.5
MAX. 1.0 2.0 1.0 1.0 1.1 7.0
UNIT mA mA mA V V V V V
Emitter cut-off current Emitter-base breakdown voltage Collector-emitter sustaining voltage Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain
DYNAMIC CHARACTERISTICS
Ths = 25 C unless otherwise specified SYMBOL Cc PARAMETER Collector capacitance Switching times (line deflection circuit) Turn-off storage time Turn-off fall time CONDITIONS IE = 0 A; VCB = 10 V; f = 1 MHz ICM = 4.5 A; IB(end) = 1.1 A; LB = 6 H; -VBB = 4 V; (-dIB/dt = 0.6 A/s) TYP. 80 MAX. UNIT pF s s
ts tf
5.0 0.4
6.0 0.6
2 Measured with half sine-wave voltage (curve tracer).
September 1997
2
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
ICsat
+ 50v 100-200R
IC
90 %
Horizontal
tf
10 %
Oscilloscope
IB
t
ts IBend
Vertical 100R 6V 30-60 Hz 1R
t
- IBM
Fig.1. Test circuit for VCEOsust.
Fig.4. Switching times definitions.
IC / mA
+ 150 v nominal adjust for ICM
1mH
250 200
100
IBend
LB
BU1508AX 12nF
BY228
0 VCE / V
min VCEOsust
-VBB
Fig.2. Oscilloscope display for VCEOsust.
Fig.5. Switching times test circuit (BU1508AX).
TRANSISTOR IC DIODE
ICsat
100
h FE
t
5V
IB
IBend
10
t 20us 26us 64us VCE
Tj = 25 C Tj = 125 C
1V
1 0.01
t
0.1 IC / A
1
10
Fig.3. Switching times waveforms.
Fig.6. Typical DC current gain. hFE = f (IC) parameter VCE
September 1997
3
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
1.2 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4
VBESAT / V
Tj = 25 C Tj = 125 C
10
VCESAT / V
Tj = 25 C Tj = 125 C
6A 4.5A
IC/IB= 3 4 5
1 3A IC=2A 0.1
0.1
1 IC / A
10
0.1
1 IB / A
10
Fig.7. Typical base-emitter saturation voltage. VBEsat = f (IC); parameter IC/IB
VCESAT / V IC/IB= 5 4 3
Fig.10. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC
Eoff / uJ
1.0 0.9 0.8 0.7 0.6 0.5
1000
IC = 4.5A 3.5A
100
Tj = 25 C Tj = 125 C
0.4 0.3 0.2 0.1 0
10
0.1 1 IC / A 10
0.1
1 IB / A
10
Fig.8. Typical collector-emitter saturation voltage. VCEsat = f (IC); parameter IC/IB
VBESAT / V
Tj = 25 C
Fig.11. Typical turn-off losses. Tj = 85C Eoff = f (IB); parameter IC
ts, tf / us ts
1.2 1.1 1.0 0.9 0.8 0.7 0.6
Tj = 125 C
IC= 6A 4.5A 3A 2A
12 11 10 9 8 7 6 5 4 3 2 1 0 4
IC = 4.5A 3.5A tf 0.1 1 IB / A 10
0
1
2 IB / A
3
Fig.9. Typical base-emitter saturation voltage. VBEsat = f (IB); parameter IC
Fig.12. Typical collector storage and fall time. ts = f (IB); tf = f (IB); parameter IC; Tj = 85C
September 1997
4
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
120 110 100 90 80 70 60 50 40 30 20 10 0
PD%
Normalised Power Derating
with heatsink compound
100
IC / A
= 0.01
ICM max 10 IC max
II
tp =
10 us
Ptot max
0 20 40 60 80 Ths / C 100 120 140
1
100 us
Fig.13. Normalised power dissipation. PD% = 100PD/PD 25C = f (Ths)
Zth / (K/W) 10
I
1 ms
0.1
10 ms
0.5 1 0.2 0.1 0.05 0.1 0.02 D=0
T P D tp D= tp T t
DC
0.01 1 10 100 VCE / V 1000
0.01 1E-06
Fig.15. Forward bias safe operating area. Ths = 25C I Region of permissible DC operation. II Extension for repetitive pulse operation.
NB: Mounted with heatsink compound and 30 5 newton force on the centre of the envelope.
1E-04
1E-02 t/s
1E+00
Fig.14. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T
September 1997
5
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
MECHANICAL DATA
Dimensions in mm Net Mass: 2 g
10.3 max 3.2 3.0
4.6 max 2.9 max
Recesses (2x) 2.5 0.8 max. depth
2.8 6.4 15.8 19 max. max. seating plane 15.8 max
3 max. not tinned 3 2.5 13.5 min. 1 0.4
M
2
3 1.0 (2x) 0.6 2.54 0.5 2.5 1.3 0.9 0.7
5.08
Fig.16. SOT186A; The seating plane is electrically isolated from all terminals.
Notes 1. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V0 at 1/8".
September 1997
6
Rev 1.100
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BU1508AX
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1997
7
Rev 1.100

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