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MC33269, NCV33269 800 mA, Adjustable Output, Low Dropout Voltage Regulator
The MC33269/NCV33269 series are low dropout, medium current, fixed and adjustable, positive voltage regulators specifically designed for use in low input voltage applications. These devices offer the circuit designer an economical solution for precision voltage regulation, while keeping power losses to a minimum. The regulator consists of a 1.0 V dropout composite PNP-NPN pass transistor, current limiting, and thermal shutdown. * 3.3 V, 5.0 V, 12 V and Adjustable Versions. 2.85 V version available as MC34268. * Space Saving DPAK, SOP-8 and SOT-223 Power Packages * 1.0 V Dropout * Output Current in Excess of 800 mA * Thermal Protection * Short Circuit Protection * Output Trimmed to 1.0% Tolerance * Pb-Free Package is Available
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SO-8 D SUFFIX CASE 751
8 1 Gnd/Adj 1 2 Vout Vin 3 4
8 7 6 5 (Top View) DPAK DT SUFFIX CASE 369A
NC Vout NC
1 3 1. GND/Adj 2. Vout 3. Vin SOT-223 ST SUFFIX CASE 318E
123 (Top View)
DEVICE TYPE/NOMINAL OUTPUT VOLTAGE
MC33269D MC33269DT NCV33269DTRK* MC33269T MC33269D-3.3 MC33269DT-3.3 NCV33269DTRK-3.3* MC33269T-3.3 MC33269ST-3.3 Adj Adj Adj Adj 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V MC33269D-5.0 MC33269DT-5.0 MC33269T-5.0 MC33269D-12 MC33269DT-12 NCV33269DTRK-12* MC33269T-12 5.0 V 5.0 V 5.0 V 12 V 12 V 12 V 12 V 1 3
1
2
3
(Top View) Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2.
*NCV prefix is for automotive and other applications requiring site and change control.
TO-220AB T SUFFIX CASE 221A 1. GND/Adj 2. Vout 3. Vin
1
2
3
12 3 (Top View)
Heatsink surface (shown as terminal 4 in case outline drawing) is connected to Pin 2.
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.
DEVICE MARKING INFORMATION
See general marking information in the device marking section on page 9 of this data sheet.
(c) Semiconductor Components Industries, LLC, 2004
1
March, 2004 - Rev. 16
Publication Order Number: MC33269/D
MC33269, NCV33269
MAXIMUM RATINGS
Rating Power Supply Input Voltage Power Dissipation Case 369A (DPAK) TA = 25C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 751 (SOP-8) TA = 25C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 221A TA = 25C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Case 318E TA = 25C Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Case Operating Die Junction Temperature Range Operating Ambient Temperature Range Storage Temperature Electrostatic Discharge Sensitivity (ESD) Human Body Model (HBM) Machine Model (MM) MC3326 NCV33269 Symbol Vin Value 20 Unit V
PD qJA qJC PD qJA qJC PD qJA qJC PD qJA qJC TJ TA Tstg ESD
Internally Limited 92 6.0 Internally Limited 160 25 Internally Limited 65 5.0 Internally Limited 156 15 -40 to +150 -40 to +125 -40 to +125 -55 to +150 4000 400
W C/W C/W W C/W C/W W C/W C/W W C/W C/W C C C V
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MC33269, NCV33269
ELECTRICAL CHARACTERISTICS (CO = 10 mF, TA = 25C, for min/max values TA = -40C to +125C, unless otherwise noted.)
Characteristic Output Voltage (Iout = 10 mA, TA = 25C) 3.3 Suffix (VCC = 5.3 V) 5.0 Suffix (VCC = 7.0 V) 12 Suffix (VCC = 14 V) Output Voltage (Line, Load and Temperature) (Note 1) (1.25 V Vin - Vout 15 V, Iout = 500 mA) (1.35 V Vin - Vout 10 V, Iout = 800 mA) 3.3 Suffix 5.0 Suffix 12 Suffix Reference Voltage (Iout = 10 mA, Vin - Vout = 2.0 V, TA = 25C) for Adjustable Voltage Reference Voltage (Line, Load and Temperature) (Note 1) (1.25 V Vin - Vout 15 V, Iout = 500 mA) (1.35 V Vin - Vout 10 V, Iout = 800 mA) for Adjustable Voltage Line Regulation (Iout = 10 mA, Vin = [Vout + 1.5 V] to Vin = 20 V, TA = 25C) Load Regulation (Vin = Vout + 3.0 V, Iout = 10 mA to 800 mA, TA = 25C) Dropout Voltage (Iout = 500 mA) (Iout = 800 mA) Ripple Rejection (10 Vpp, 120 Hz Sinewave; Iout = 500 mA) Current Limit (Vin - Vout = 10 V) Quiescent Current (Fixed Output) (1.5 V Vout 3.3 V) (5 V Vout 12 V) Minimum Required Load Current Fixed Output Voltage Adjustable Voltage Adjustment Pin Current Symbol VO 3.27 4.95 11.88 VO 3.3 5.0 12 3.33 5.05 12.12 V Min Typ Max Unit V
3.23 4.9 11.76 Vref Vref 1.235 1.225
3.3 5.0 12 1.25 1.25
3.37 5.1 12.24 1.265 1.275 V V
Regline Regload Vin - Vout
- - - -
- - 1.0 1.1 - - 5.5 - - - -
0.3 0.5 1.25 1.35 - - 8.0 20
% % V
RR ILimit IQ
55 800 - -
dB mA mA
ILoad - 8.0 IAdj - 0 - 120
mA
mA
1. The MC33269-12, Vin - Vout is limited to 8.0 V maximum, because of the 20 V maximum rating applied to Vin.
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MC33269, NCV33269
Vin
Vout
Trim Links
VAdj
Gnd
This device contains 38 active transistors.
Figure 1. Internal Schematic
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MC33269, NCV33269
1.5 Vin -Vout , DROPOUT VOLTAGE (V) 1.3 1.1 0.9 0.7 0.5 TA = 25C TA = -40C VO , OUTPUT VOLTAGE DEVIATION
100 mV/Div Cin = 10 mF CO = 10 mF Tantalum Vin = VO + 3.0 V Preload = 0.1 A
TA = 125C
I O , OUTPUT CURRENT
0.5 A
0
200
400
600
800
1000
0A 20 ms/DIV
IO, OUTPUT LOAD CURRENT (mA)
Figure 2. Dropout Voltage versus Output Load Current
V FB(OV), OVERVOLTAGE INPUT THRESHOLD (%VFB )
Figure 3. Transient Load Regulation
1100 IO = 800 mA OUTPUT CURRENT (A)
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 TA = 25C MC33269D-XX L = 25 mm Copper
1060 1020 980 940 900 -55
-25
0
25
50
75
100
125
0
0
2.0
4.0
6.0
8.0
10
12
14
16
TA, AMBIENT TEMPERATURE (C)
INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V)
Figure 4. Dropout Voltage versus Temperature
Figure 5. MC33269-XX Output DC Current versus Input-Output Differential Voltage
70 RR, RIPPLE REJECTION RATIO (dB) 60 50 40 30 20 0.1 Vin = VO + 3.0 V IL = 800 mA TA = 25C RR, RIPPLE REJECTION RATIO (dB) VO = 3.3 V or 5.0 V VO = 12 V
70 60 50 40 30 20 0.1
Vin = 8.0 V Vout = 5.0 V IL = 800 mA CAdj = 22 mF TA = 25C
1.0
10 f, FREQUENCY (kHz)
100
1.0
10 f, FREQUENCY (kHz)
100
Figure 6. MC33269 Ripple Rejection versus Frequency
Figure 7. MC33269-ADJ Ripple Rejection versus Frequency
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MC33269, NCV33269
R JA, THERMAL RESISTANCE, JUNCTION-TO-AIR ( C/W) R JA, THERMAL RESISTANCE, JUNCTION-TO-AIR ( C/W)
170 150 130 PD(max) for TA = 50C
3.2 2.8 2.4
100 90 80 70 60 50 40 Minimum Size Pad Free Air Mounted Vertically
PD(max) for TA = 50C 2.0 oz. Copper L
2.4 2.0 1.6 1.2 0.8 0.4 0
90 70 50 RqJA 30 0 10 20
L
L, LENGTH OF COPPER (mm)
Figure 8. SOP-8 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
R JA, THERMAL RESISTANCE
JUNCTION-TO-AIR ( C/W)
240 200 160 120 80
Free Air Mounted Vertically Minimum Size Pad
PD(max) for TA = 50C 2.0 oz. Copper L
1.25 0.83 0.63 0.50 0.42 0.35
L
RqJA 40 0 5.0 10 15 20
25
30
L, LENGTH OF COPPER (mm)
Figure 10. SOT-223 Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
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PD, MAXIMUM POWER DISSIPATION (W)
IIII IIII IIII
III I IIIIIII II IIIIIII I III
2.0 oz. Copper L 3.0 mm 30 40 280
110
Graph represents symmetrical layout
2.0 1.6 1.2 0.8
RqJA 0 5.0 10 15 20
0.4 50
L, LENGTH OF COPPER (mm)
Figure 9. DPAK Thermal Resistance and Maximum Power Dissipation versus P.C.B. Copper Length
2.50
IIII IIII IIII IIII
L 25 30
MC33269, NCV33269
APPLICATIONS INFORMATION Figures 11 through 15 are typical application circuits. The output current capability of the regulator is in excess of 800 mA, with a typical dropout voltage of less than 1.0 V. Internal protective features include current and thermal limiting. * The MC33269 requires an external output capacitor for stability. The capacitor should be at least 10 mF with an equivalent series resistance (ESR) of less than 10 W but greater than 0.2 W over the anticipated operating temperature range. With economical electrolytic capacitors, cold temperature operation can pose a problem. As temperature decreases, the capacitance also decreases and the ESR increases, which could cause the circuit to oscillate. Also capacitance and ESR of a solid tantalum capacitor is more stable over temperature. The use of a low ESR ceramic capacitor placed within close proximity to the output of the device could cause instability. ** An input bypass capacitor is recommended to improve transient response or if the regulator is connected to the
Vin ** Cin GND An input capacitor is not necessary for stability, however it will improve the overall performance. CAdj*** V out + 1.25 1 ) R2 ) I R2 Adj R1 ***CAdj is optional, however it will improve the ripple rejection. The MC34269 develops a 1.25 V reference voltage between the output and the adjust terminal. Resistor R1, operates with constant current to flow through it and resistor R2. This current should be set such that the Adjust Pin current causes negligible drop across resistor R2. The total current with minimum load should be greater than 8.0 mA. MC33269-XX Vout Co * 10 mF
supply input filter with long wire lengths. This will reduce the circuit's sensitivity to the input line impedance at high frequencies. A 0.33 mF or larger tantalum, mylar, ceramic, or other capacitor having low internal impedance at high frequencies should be chosen. The bypass capacitor should be mounted with shortest possible lead or track length directly across the regulator's input terminals. Applications should be tested over all operating conditions to insure stability. Internal thermal limiting circuitry is provided to protect the integrated circuit in the event that the maximum junction temperature is exceeded. When activated, typically at 170C, the output is disabled. There is no hysteresis built into the thermal limiting circuit. As a result, if the device is overheating, the output will appear to be oscillating. This feature is provided to prevent catastrophic failures from accidental device overheating. It is not intended to be used as a substitute for proper heat-sinking.
Vin ** Cin Vout R1 Adj R2
MC33269
Co * 10 mF
Figure 11. Typical Fixed Output Application
Vin ** Cin
MC33269 Adj I out + 1.25 R S
RS
Iout Co * 10 mF
Figure 13. Current Regulator
Vin ** Cin GND Vout
Figure 12. Typical Adjustable Output Application
MC33269-XX
Vin ** Cin
MC33269 R1 Adj R2
Vout
Co* 10 mF
MC33269-XX ** Cin GND The Schottky diode in series with the ground leg of the upper regulator shifts its output voltage higher by the forward voltage drop of the diode. This will cause the lower device to remain off until the input voltage is removed. Co * 10 mF
R2 sets the maximum output voltage. Each transistor reduces the output voltage when turned on.
Figure 14. Battery Backed-Up Power Supply
Figure 15. Digitally Controlled Voltage Regulator
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MC33269, NCV33269
ORDERING INFORMATION
Device MC33269D MC33269DR2 MC33269DR2G MC33269DT MC33269DTG MC33269DTRK MC33269DTRKG MC33269T MC33269D-3.3 MC33269DR2-3.3 MC33269DR2-3.3G MC33269DT-3.3 MC33269DT-3.3G MC33269DTRK-3.3 MC33269DTRK-3.3G MC33269ST-3.3T3 MC33269ST-3.3T3G MC33269T-3.3 MC33269D-5.0 MC33269DR2-5.0 MC33269DT-5.0 MC33269DTRK-5.0 MC33269DTRK-5.0G MC33269T-5.0 MC33269D-12 MC33269DR2-12 MC33269DT-12 MC33269DTRK-12 MC33269DTRK-12G MC33269T-12 NCV33269DTRK* NCV33269DTRK-3.3* Package SO-8 SO-8 SO-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) TO-220 SO-8 SO-8 SO-8 (Pb-Free) DPAK DPAK (Pb-Free) DPAK DPAK (Pb-Free) SOT-223 SOT-223 (Pb-Free) TO-220 SO-8 SO-8 DPAK DPAK DPAK (Pb-Free) TO-220 SO-8 SO-8 DPAK DPAK DPAK (Pb-Free) TO-220 DPAK DPAK Shipping Information 98 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 75 Units / Rail 75 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 50 Units / Rail 98 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 75 Units / Rail 75 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 4000 Units / Tape & Reel 4000 Units / Tape & Reel 50 Units / Rail 98 Units / Rail 2500 Units / Tape & Reel 75 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 50 Units / Rail 98 Units / Rail 2500 Units / Tape & Reel 75 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel 50 Units / Rail 2500 Units / Tape & Reel 2500 Units / Tape & Reel
NCV33269DTRK-12* DPAK 250 Units / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *NCV prefix is for automotive and other applications requiring site and control changes.
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MC33269, NCV33269
MARKING DIAGRAMS
SO-8 D SUFFIX CASE 751 8 269AJ ALYW 8 69-12 ALYW 8 269-3 ALYW 8 269-5 ALYW
1
1
1
1
DPAK DT SUFFIX CASE 369A
SOT-223 ST SUFFIX CASE 318E
269AJ ALYWW 2 1 3
69-12 ALYWW 2 1 3
269-3 ALYWW 2 1 3
269-5 ALYWW 2 1 3
ALYW 2693 1 2 3
TO-220AB T SUFFIX CASE 221A
MC 33269T AWLYWW
MC 33269T-12 AWLYWW
MC 33269T-3.3 AWLYWW
MC 33269T-5.0 AWLYWW
1
2
3
1
2
3
1
2
3
1
2
3
A WL, L Y WW, W
= Assembly Location = Wafer Lot = Year = Work Week
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MC33269, NCV33269
PACKAGE DIMENSIONS
SO-8 D SUFFIX CASE 751-07 ISSUE AA
-X- A
8 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751-01 THRU 751-06 ARE OBSOLETE. NEW STANDARD IS 751-07. MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8_ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0_ 8_ 0.010 0.020 0.228 0.244
B
1 4
S
0.25 (0.010)
M
Y
M
-Y- G C -Z- H D 0.25 (0.010)
M SEATING PLANE
K
N
X 45 _
0.10 (0.004)
M
J
ZY
S
X
S
DIM A B C D G H J K M N S
SOLDERING FOOTPRINT*
1.52 0.060 7.0 0.275 4.0 0.155
0.6 0.024
1.270 0.050
SCALE 6:1 mm inches
Figure 16. SO-8
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33269, NCV33269
DPAK DT SUFFIX CASE 369A-13 ISSUE AB
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. DIM A B C D E F G H J K L R S U V Z INCHES MIN MAX 0.235 0.250 0.250 0.265 0.086 0.094 0.027 0.035 0.033 0.040 0.037 0.047 0.180 BSC 0.034 0.040 0.018 0.023 0.102 0.114 0.090 BSC 0.175 0.215 0.020 0.050 0.020 --- 0.030 0.050 0.138 --- MILLIMETERS MIN MAX 5.97 6.35 6.35 6.73 2.19 2.38 0.69 0.88 0.84 1.01 0.94 1.19 4.58 BSC 0.87 1.01 0.46 0.58 2.60 2.89 2.29 BSC 4.45 5.46 0.51 1.27 0.51 --- 0.77 1.27 3.51 ---
-T- B V R
4
C E
A S
1 2 3
Z U
K F L D G
2 PL
J H 0.13 (0.005) T
M
SOLDERING FOOTPRINT*
6.20 0.244 2.58 0.101 5.80 0.228
3.0 0.118
1.6 0.063
6.172 0.243
SCALE 3:1
mm inches
Figure 17. DPAK
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33269, NCV33269
PACKAGE DIMENSIONS
SOT-223 ST SUFFIX CASE 318E-04 ISSUE K
A F
4
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
S
1 2 3
B
D L G J C 0.08 (0003) H M K
INCHES DIM MIN MAX A 0.249 0.263 B 0.130 0.145 C 0.060 0.068 D 0.024 0.035 F 0.115 0.126 G 0.087 0.094 H 0.0008 0.0040 J 0.009 0.014 K 0.060 0.078 L 0.033 0.041 M 0_ 10 _ S 0.264 0.287
MILLIMETERS MIN MAX 6.30 6.70 3.30 3.70 1.50 1.75 0.60 0.89 2.90 3.20 2.20 2.40 0.020 0.100 0.24 0.35 1.50 2.00 0.85 1.05 0_ 10 _ 6.70 7.30
SOLDERING FOOTPRINT*
3.8 0.15 2.0 0.079
2.3 0.091
2.3 0.091
6.3 0.248
2.0 0.079 1.5 0.059
mm inches
SCALE 6:1
Figure 18. SOT-223
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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MC33269, NCV33269
TO-220AB T SUFFIX CASE 221A-09 ISSUE AA
SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04
-T- B
4
F T S
C
Q
123
A U K
H Z L V G D N R J
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MC33269, NCV33269
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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MC33269/D

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