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| A- PREPARED BY: DATE: t SPEC.No: DG-996011 APPROVED BY: Jd DATE: B /`YY ( ELECTRONIC COMPONENTS GROUP SHARP CORPORATION SPECIFICATION REPRESENTATIVE 1 DIVISION: Opto-Electronic Devices Division / Y DEVICE SPECIFICATION FOR . Light Emitting Diode MODEL No. LTlZE4OA 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp5 consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting corn use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * OA equipment * Audio visual equipment * Home appliance * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I 1 If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3), please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Traffic signals * Gas leakage sensor breakers l Rescue and security equipment * Other safety equipment L (3) Please do not use this product for equipment which require extremely high reliability and safety in fimction and precision, such as ; * Space equipment * Telecommunication equipment (for trunk lines) l Nuclear power control equipment * Medical equipment c . (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: I M.Katoh, Department General Manager of Engineering Dept.,111 Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION -I 1 1 CUSTOMER'S APPROVAL DATE: BY: J i __, .i L. .DG-g96011.-. Nd. `_. - . Feb/22/9! PAGE - MODEL LTl ZE40A l/14 LTlZE40A Smdkation 1. Application This specification applies to the light emitting diode device Model No. LTl ZE4OA. [AlInGaP (dicing or scribe/brake type/Yellow green) chip LED device] 2. Outline dimensions and temkal connections ...*.*..**...~.......,~f~ to the attached sheet Page2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-5. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 4-1. Test items and test conditions 4-2. Failure judgement criteria 5. incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7. 5- 1. Inspection method 5-2. Description of inspection and criteria 6. Taping specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 8- 11. 6-1. Taping 6-2. Label 6-3. Luminous intensity rank 6-4. Dominant wavelength raak 7. Packing Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ...* Refer to the attached sheet Page 12. 7- 1. Dampproof package 7-2. Storage conditions 7-3. Treatment after opening 8. Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 13. 8- 1. Reflow soldering 8-2. Manual soldering 9. Precautions for use . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14. 9- 1. Precautions matters for designing circuit 9-2. Cleaning method 10. Ekironment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 14. lo- 1. Ozonosphere destructive chemicals. 10-2. Bromic non-burning materials Febl2219' 2. Outliue dimensions terminalconnections and j--I 0. 4 . I . --- 1. Plabzd Resist area area m m I- h-l= e-w 2. Pin Conection 0 @ Cathode Anode 43-o 3. Unspecified tol. to be ktl. 1 unit mm PWB: Resin: Material Glass-Epoxy Epoxy Finish Au Plated Drawiug No. / / I _.. _ DG-99.6011 ifDDEl, No. ' ,,-, _ -`. `-\U \.`yi t * :.-- \ .. -. .._ Febl22/99PAGE . 3/14 3. Ratings and characteristics (Notel) Duty ratio=l/lO,Puise width=O.lms (Note2) Manual soldering Max.3second (Note 3)Measured by SHARP EG&G MODELSSO(Radiometer/Photometersystem) (Tolerance: f 15%) L Forward Current 60 Derating Curve -25 b 25 50 75 100 Ta("c) 125 Anbient Temperature Peak Fotward Current vs. Duty Ratio cTa=25"c) l/100 l/10 Duty Raito 1 DR 10 (/ ' ~ dG-996011 MopLyo.., .. \\ `, ._ ' -.LT l,$EdO A~, 1 Jud8/9! PAGE 5114 3-4. Characteristics Diagram(typ) (Note 1) Forward Current vs.Fotward Voltage Relative Luminous Intensity vs. Ambient Tamerature (IF=5mAI 1000 8 fla=2573 s E a Y t 2 l.L 0. 1 1.2 1.4 1.6 1.8 Fotward Voltage 2 2.2 VFW 2.4 B -60 -40 -20 0 20 40 60 80 100 120 Ambient Tetwature Ta("c) Relative Lminoua lntenaitv VI. Fromrd Voltare Ua=25%) t i i iiitttt i i iii/iii i i iiiiltl 0. 1 1 Forward Current 10 IFW 100 (Note 1) Above characteristicdata aretypical data andnot a guarantteed data. 4. Reliability The reliability of products shall be satisfied with items listed below. ,-I. Test items and test conditions Confidence level: 907 4-2. Failure judgement criteria * 1 Parameter Forward voltage Reverse current Luminous intensity l Symbol vF Failure judgement criteria l 2 v, > U.S.L. x 1.2 IR > U.S.L. x 2.0 Iv > The first stage value X 2.0 or The first stage value X 0.5 > Iv IR IV 1: Measuring condition is in accordance with specification. $2: U.S.L. is shown by Upper Specification Limit. , i I. I,. ., "k. / JIG<-9960`1 *-YODEL y No.,,. 1 ) `I. ., Febl22/9! PAGE ~hZk40~-.. 7114 5. Incoming inspection S- 1. Inspection method A single sampling plan, normal inspection level S-4 based on IS0 2859-l shall be adopted. AQL Product inserted in reverse direction 0.1% 7 8 9 10 11 Outline dimensions Dust and flaw Resin flash Resin crack Solderbility Not conforming to the specification Effect to the specification Over the unspecified tolerance 0.3mm or greater Corn the product side face Minor defect 0.4% could solder 50% or greater and less than 90% out of judgement area * 1 * 1 Judgement area : The plated area of the product bottom 6.Taping specification 6-l.Tapiug 6-1-l.Shape and dimension of tape(TYP.) w tP Cathode 1 Cover tape Carrier tape Width Thickness WI 5.5 Width Thickness t3 Wa t1 0.1 8.0 0.2 Thicknessof the entire unit t2 1.2 % Material : Carrier tape...PS,Cover tape... Polyester With cover tapeand carrier tape combined .. DG-996011 Febl22/9 PAGE 9114 -._ 6-I-2.Shape and dimension of reel(TYP.) Parameter 1Symbol 1 Dimension 1 Remarks Frange External diameter Spindle hole diameter Key slit Width Depth dotation for part name etc. % Material : Reel...Polystyrene Hub 460 C E U Labeling 413 2.0 4.5 on one side of flange.(part name,quantity,lot No.) ' I; DG-996011 MO&L go. ..- Febl22/99 --YLy &&A` y.., PAGE 10114 6-1-3.Tapingspecification (1) Lead tape: End 40-50 (2) Cover tape strengthagainstpeeling:F=O. l-O.SN( 6 =lO"or less) Cover tape 1 speed : Sum/s (3) Tape strengthagainstbending: The radiusof bendingcircle shouldbe 30mmor more. If it is lessthan 3Omm, cover may peel. the (4) Jointing of tape: There shouldnot bejoint of cover tape or carrier tape. (5) Quantity per reel: Average 4,OOOpcs. reel per (6) Others: 0 There shouldnot be missing above continuous three products. @ Productsshouldbe easilytakenout. @ Productsshouldnot be attachedto the cover tape at peeling. ,' ,: DG-996011 M,ODEI, No. <4 "~ .A. u ..LTl~Ei~A Jud8/9! PAGE 1l/14 6-2. Label cl+ QUAIiKR i i- Model number c Quantity of products + EIAJ C-3 Bar code - 0 Productionplant code(tobe indicated alphabetically) @ Productionlot(singleor doublefigures) Q) Year of production(tbelast two figures of the year) @ Month of production (to be indicatedalphabeticallywith Januarycorresponding A) to @ Dateof production(0 - 3 1) 1 6-3.Lurninous intensity rank(Note 1) Luminous intensity A 10 19 B 14 28 C 21 - unit (Ta=25"C) Condition D E (Note 1) 40 mcd J?=2omA 30 30 43 84 Also I sbaIlnot asktbe delivery ratio of eachrank. 6-4.Dominantwavelength rank (Note 2) Dominantwavelength d unit (Ta=25"C) Condition e f (r 562 565.0 568 - 566.0 569 572.0 571n - 575 (Note 2) This rank value is the setting value of when that cla.ssiiIes the rank and be not a guaranteevalue. it Also I shallnot askthe delivery ratio of eachrank. ,.' .-. , . \ . _/ Y DGr996011 1 ..v , a; -- . Febl22199 PAGE MODEL For 7. PaclAngspecification 7- 1. Dampproofpackage In other to avoid the absorptionof humidity iu transportand storage, the device s arepackedin aluminumsleeve. Label e Silicagel Q Ree1 Label 7-2.Strageconditions Temperature: 5 to 30C Humidity : lessthan 6O%RH 7-3.Treatmentafter opening (1) Please makea solderingwithin 15daysafter openingunderfollowing condition; Temperature: 5 to 30C Humidity : less than 6O%RH (2) In casethe devicesare not usedfor a long time after opening,the storagein dry box is recommendable. Or it is better to repack the deviceswith a desiccativeby the sealerandput them in the somestorage conditionsas7-2. Then they shouldbe usedwithiu 2 weeks. (3) Please makea solderingafter a follewing bakiugtreatmentif unusedterm shouldbe over the conditions OfW *Recommendable conditions: 0 in taping Temprature:6O"cto 65"C,Time:36to 48 hours 0 in individual (on PWB or metallic tray) Temprature:lOO"Cto120"C ,Time:2 to 3 hours Febl22/99 PAGE 13114 8. Soldering 8- 1.Reflow soldering (1) It is not recommended to exceed the soldering temperature and time shown below. Caused by substrate bend or the other mechanical stress during reflow soldering may happen gold wire disconnection etc. Therefore please check and study your solder reflow machine's best condition. (2) In case of 2 times reflow process.2nd reflow process should be done within 8 hours after 1st reflow process.(Strage condition ; at 3O"c,RH less than 6O%RH) ' (3) Reflow soldering temperature profile to be done under the following condition. MAX 250 140-160 h Time(s) Recommendable Thermal Model , (4) Recommendable Metal Mask pattern for screen print Recommend 0.2mm to 0.3mm thickness metal mask for screen print. Caused by solder reflow condition, solder paste, substrate and the other material etc., may change solderbility. Please check and study actual solderbility before usage. Center of the produc 2 r L ---mm -.-_-.-_ R .-. i i il " /---.- - .-_- 4 `- --. -. A IF 1.25 Recommended soldar pattern (U&mm) 8-2.Manual soldering (1) It is recommended to keep the soldering iron temperature at 350% (soldering iron power consumption 2OW) and not to solder more than once or for over 3 seconds. (2) When using a soldering iron, care must be taken not to damage the package. (Pay attention not to allow any under stress or heat on package.) L 9-l. Precautions matters for designing circuit This product is not designed as electromagnetic and ionized-particle radiation resistant. 9-2. Cleaning method (1) Solvent cleaning Recommend conditions: 0 Solvent temperature is not more than 45 degree. 0 Immersion up to 3 minutes. (2) Ultrasonic cleaning The affect on the device from ultrasonic bath, ultrasonic output, duration, board size and device mounting method. Test the cleaning method under actual conditions and check for abnormalities before actual use. (3) Solvents Use only the following types of solvent. water, methyl alcohol, ethyl alcohol, isopropyl alcohol Recommend conditions: RT. 4OKHz, 3OW/l, 3 to 5 minutes 10. Environment 10-l. Ozonosphere destructive chemicals. (1) The device doesn't contain following substance. (2) The device doesn't have a production line whose process requires following substance. Restricted part: CFCs,halones,CCh,Trichloroethane(Methychlorofotm) 1O-2. Bromic non-burning materials The device doesn't contain bromic non-burning materials(PBBOs,PBBs) |
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