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| PL IA Features Applications NT Lead free as standard RoHS compliant* Low profile Low power loss, high efficiency UL 94V-0 classification High frequency switching power supplies Inverters Free wheeling Polarity protection *R oH S CO M General Information The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Bourns offers Schottky Rectifier Diodes for rectification applications, in compact chip package 2010 size format, which offers PCB real estate savings and are considerably smaller than most competitive parts. The Schottky Rectifier Diodes offer a forward current of 1 A with a repetitive peak reverse voltage of 40 V. Bourns(R) Chip Diodes conform to JEDEC standards, are easy to handle on standard pick and place equipment and their flat configuration minimizes roll away. FRP Substrate and Epoxy Underfill Electrical Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter DC Blocking Voltage Repetitive Peak Reverse Voltage Average Forward Rectified Current1 Instantaneous Forward Voltage @ IF = 1.0 A Reverse Leakage Current @ VRRM Peak forward surge current 8.3 ms single half sine-wave superimposed on rated load (JEDEC Method) Notes: 1 See Forward Derating Curve. Thermal Characteristics (@ TA = 25 C Unless Otherwise Noted) Parameter Junction Temperature Range Storage Temperature Range Symbol TJ TSTG Min. -40 -40 Nom. +25 +25 Max. +125 +125 Unit C C *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. 6 CD2010-B140 - Surface Mount Schottky Rectifier Diode Tin Plated Connectors Symbol VDC VRRM I(AV) VF IR Min. Nom. Max. 40 40 1.0 Unit V V A V mA 0.45 0.55 0.1 IFSM 70 A CD2010-B140 - Surface Mount Schottky Rectifier Diode Product Dimensions This is a lead free product. It is packaged with FRP substrate and is epoxy underfilled. The terminals are pure tin plated and are solderable per MIL-STD-750, Method 2026. The package weighs approximately 0.02 g. The package and dimensions are shown below. A Recommended Footprint The device will mount onto existing JEDEC SOD-106 footprint. How To Order CD 2010 - B 1 40 Common Code Chip Diode Package * 2010 Model B = Schottky Barrier Diode Current 1=1A Working Peak Reverse Voltage 40 = 40 VRWM (Volts) B C D E F Dimensions A B C D E F 4.40 - 4.60 (0.173 - 0.181) 2.10 - 2.30 (0.083 - 0.091) 0.50 (0.020) 0.75 - 1.15 (0.029 - 0.045) 0.75 - 1.15 (0.029 - 0.045) 0.85 - 1.25 (0.033 - 0.049) DIMENSIONS: MM (INCHES) *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD2010-B140 - Surface Mount Schottky Rectifier Diode Rating and Characteristic Curves Forward Current Derating Curve Average Forward Rectified Current (Amps) 1.5 Peak Forward Surge Current (Amps) Maximum Non-Repetitive Peak Forward Surge Current 80 70 60 50 40 30 20 10 0 1 10 Number of Cycles at 60 Hz 100 Pulse Width 8.3 ms Single Half Sine-Wave (JEDEC Method) 1.0 0.5 0 0 25 50 75 100 125 150 Lead Temperature (C) Forward Characteristics 10.00 Reverse Characteristics 100 Instantaneous Forward Current (Amps) 10 Instantaneous Reverse Current (mA) 1.00 TJ = 100 C 1.0 0.10 0.10 1.0 TJ = 25 C 0.01 0 0.2 0.4 0.6 0.8 1.0 1.2 Instantaneous Forward Voltage (Volts) 0.001 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Typical Junction Capacitance 400 Junction Capacitance (pF) TJ = 25 C f = 1.0 MHz Vsig = 50 mVP-P 100 10 0.1 1.0 10 Reverse Voltage (Volts) 100 *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. CD2010-B140 - Surface Mount Schottky Rectifier Diode Packaging Information The product will be dispensed in Tape and Reel format (see diagram below). P 0 P 1 d E Index Hole T 120 F W B D2 D1 D P Trailer A Device C Leader W1 Start DIMENSIONS: MM (INCHES) End ....... ....... ....... ....... ....... ....... ....... ....... 10 pitches (min.) 10 pitches (min.) Direction of Feed Devices are packed in accordance with EIA standard RS-481-A and specifications shown here. Item Carrier Width Carrier Length Carrier Depth Sprocket Hole Reel Outside Diameter Reel Inner Diameter Feed Hole Diameter Sprocket Hole Position Punch Hole Position Punch Hole Pitch Sprocket Hole Pitch Embossment Center Overall Tape Thickness Tape Width Reel Width Quantity per Reel Symbol A B C d D D1 D2 E F P P0 P1 T W W1 -- 2010 2.80 0.10 (0.110 0.004) 5.00 0.10 (0.197 0.004) 1.55 0.10 (0.061 0.004) 1.55 0.05 (0.061 0.002) 178 (7.008) 80.0 Min. (3.150) 13.0 0.20 (0.512 0.008) 1.75 0.10 (0.069 0.004) 3.50 0.05 (0.138 0.002) 4.00 0.10 (0.157 0.004) 4.00 0.10 (0.157 0.004) 2.00 0.05 (0.079 0.002) 0.20 0.10 (0.008 0.004) 8.00 0.20 (0.315 0.008) 13.5 Max. (0.531) Reliable Electronic Solutions Asia-Pacific: Tel: +886-2 2562-4117 * Fax: +886-2 2562-4116 Europe: Tel: +41-41 768 5555 * Fax: +41-41 768 5510 The Americas: Tel: +1-951 781-5500 * Fax: +1-951 781-5700 www.bourns.com *RoHS Directive 2002/95/EC Jan 27 2003 including Annex Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. COPYRIGHT(c) 2005, BOURNS, INC. LITHO IN U.S.A. IPA0501 04/05 2,500 |
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