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| Transistor 2SB0956 (2SB956) Silicon PNP epitaxial planer type For low-frequency power amplification Complementary to 2SD1280 Unit: mm I Features G G G 4.50.1 1.60.2 1.50.1 1.0-0.2 +0.1 Large collector power dissipation PC. Low collector to emitter saturation voltage VCE(sat). Mini Power type package, allowing downsizing of the equipment and automatic insertion through the tape packing and the magazine packing. (Ta=25C) Ratings -20 -20 -5 -2 -1 1 150 -55 ~ +150 Unit V V V A A W C C 2.60.1 0.4max. 45 0.40.08 0.50.08 1.50.1 3.00.15 3 2 1 4.0-0.20 0.40.04 I Absolute Maximum Ratings Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power dissipation Junction temperature Storage temperature * Symbol VCBO VCEO VEBO ICP IC PC* Tj Tstg marking 1:Base 2:Collector 3:Emitter EIAJ:SC-62 Mini Power Type Package Marking symbol : H Printed circuit board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion I Electrical Characteristics Parameter Collector cutoff current Collector to emitter voltage Emitter to base voltage Forward current transfer ratio Collector to emitter saturation voltage Base to emitter saturation voltage Transition frequency Collector output capacitance (Ta=25C) Symbol ICBO VCEO VEBO hFE1*1 hFE2 VCE(sat) VBE(sat) fT Cob Conditions VCB = -10V, IE = 0 IC = -1mA, IB = 0 IE = -10A, IC = 0 VCE = -2V, IC = -500mA*2 VCE = -2V, IC = -1.5A*2 IC = -1A, IB = -50mA*2 IC = -500mA, IB = -50mA VCB = -6V, IE = 50mA, f = 200MHz VCB = -6V, IE = 0, f = 1MHz 200 40 *2 min typ max -1 Unit A V V -20 -5 130 50 - 0.5 -1.2 280 MHz pF Pulse measurement *1h FE1 Rank classification Rank hFE1 R 130 ~ 210 HR S 180 ~ 280 HS Note.) The Part number in the Parenthesis shows conventional part number. Marking Symbol 2.50.1 +0.25 V V 1 Transistor PC -- Ta 1.4 2SB0956 IC -- VCE Collector to emitter saturation voltage VCE(sat) (V) -1.2 Ta=25C -1.0 -10 -3 -1 25C Ta=75C VCE(sat) -- IC IC/IB=20 Collector power dissipation PC (W) 1.2 Printed circut board: Copper foil area of 1cm2 or more, and the board thickness of 1.7mm for the collector portion. Collector current IC (A) IB=-5.0mA -4.5mA -4.0mA -3.5mA -3.0mA -2.5mA -2.0mA -1.5mA -1.0mA - 0.5mA 1.0 - 0.8 - 0.3 - 0.1 -25C 0.8 - 0.6 0.6 - 0.4 - 0.03 - 0.01 0.4 0.2 - 0.2 - 0.003 - 0.001 - 0.01 - 0.03 - 0.1 - 0.3 0 0 20 40 60 80 100 120 140 160 0 0 -1 -2 -3 -4 -5 -6 -1 -3 -10 Ambient temperature Ta (C) Collector to emitter voltage VCE (V) Collector current IC (A) VBE(sat) -- IC -10 hFE -- IC IC/IB=10 600 VCE=-2V 500 450 500 fT -- I E VCB=-6V Ta=25C Base to emitter saturation voltage VBE(sat) (V) 25C -1 Ta=-25C 75C Transition frequency fT (MHz) -1 -3 -10 -3 Forward current transfer ratio hFE 400 350 300 250 200 150 100 50 400 - 0.3 - 0.1 300 Ta=75C 25C - 0.03 - 0.01 200 -25C 100 - 0.003 - 0.001 - 0.01 - 0.03 - 0.1 - 0.3 -1 -3 -10 0 - 0.01 - 0.03 - 0.1 - 0.3 0 10 30 100 300 1000 Collector current IC (A) Collector current IC (A) Emitter current IE (mA) Cob -- VCB 120 Area of safe operation (ASO) IE=0 f=1MHz Ta=25C 10 3 Single pulse Ta=25C ICP t=10ms 1 IC t=1s Collector output capacitance Cob (pF) 100 80 60 40 20 - 0.003 0 -1 - 0.001 - 0.1 - 0.3 -3 -10 -30 -100 Collector current IC (A) - 0.3 - 0.1 - 0.03 - 0.01 -1 -3 -10 -30 -100 Collector to base voltage VCB (V) Collector to emitter voltage VCE (V) 2 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company. Please read the following notes before using the datasheets A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited. 2001 MAR |
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