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| PD-9.1425 TARGET IRGCC50FE IRGCC50FE IGBT Die in Wafer Form C G E 600 V Size 5 Fast Speed 5" Wafer Electrical Characteristics ( Wafer Form ) Parameter VCE (on) V(BR)CES VGE(th) ICES IGES Description Collector-to-Emitter Saturation Voltage Colletor-to-Emitter Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Collector Current Gate-to-Emitter Leakage Current Guaranteed (Min/Max) Test Conditions 2.0V Max. IC = 20A, TJ = 25C, V GE = 15V 600V Min. TJ = 25C, ICES = 250A, VGE = 0V 3.0V Min., 5.5V Max. V GE = VCE , TJ =25C, IC =250A 250 A Max. TJ = 25C, VCE = 600V 500 nA Max. TJ = 25C, VGE = +/- 20V Mechanical Data Norminal Backmetal Composition, Thickness: Norminal Front Metal Composition, Thickness: Dimensions: Wafer Diameter: Wafer thickness: Relevant Die Mechanical Dwg. Number Minimum Street Width Reject Ink Dot Size Ink Dot Location Recommended Storage Environment: Reference Standard IR packaged part ( for design ) : IRGPC50F Cr-Ni-Ag ( 1kA-4kA-6kA ) 99% Al, 1% Si (3 microns) 0.257" x 0.260" 125mm, with std. < 100 > flat .015" + / -.003" 01-5103 100 Microns 0.25mm Diameter Minimum See Die Outline drawing below Store in original container, in dessicated nitrogen, with no contamination Die Outline INK DOT LOCATION 3.69 (.145 ) NOT ES : 1. ALL DIMENSIONS ARE SHOW N IN MILLIMETERS ( INCHES ) 2. CONTROLLING DIMENSION : ( INCH ) 3. LET TER DESIGNATION : S = SOURCE G = G ATE 4. DIMENSIONAL TOLERANCES BONDING PADS : < 0.635 TOLERANCE = +/- 0.013 WIDTH < (.0250 ) TOLERANCE =+/- (.0005 ) & > 0.635 TOLERANCE = +/- 0.025 LENGTH > (.0250 ) TOLERANCE = +/- (.0010 ) OVERALL DIE < 1.270 TOLERANCE = +/- 0.102 WIDTH < (.050 ) TOLERANCE = +/- (.004 ) & > 0.635 TOLERANCE = +/- 0.203 LENGTH > (.050 ) TOLERANCE = +/- (.008 ) 5. UNLESS OTHERWISE NOTED ALL DIE ARE GEN III 1.62 (.064 ) EMITTER 6.60 (.260 ) 0.61 (.024 ) G 6.53 (.257 ) 0.64 (.025 ) |
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