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| MSS40 THYRISTOR MODULE .V .I .HI .I FEATURES DRM = VRRM UP TO 1400 V T(RMS) = 55 A GH SURGE CAPABILITY NSULATED PACKAGE : INSULATING VOLTAGE 2500 V(RMS) A2 G1 A1 DESCRIPTION The MSS40 family are constitued of two general purpose SCR. Suitable for AC switching and phase control on resistive and inductive load up to 400 Hz. The small volume (7cm3) and weight (29g) of the isotop package are well adapted to new generation of medium size module market applications. PIN CONNECTIONS G2 Screw version ISOTOPTM (Plastic) 1 : Thyristor 2 Anode (A2) 2 : Thyristor 2 Gate (G2) 3 : Thyristor 1 Anode (A1) 4 : Thyristor 1 Gate (G1) ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) ITSM RMS on-state current Non repetitive surge peak on-state current ( Tj initial = 25C ) I2t value for fusing Critical rate of rise of on-state current Gate supply : IG = 400mA - diG/dt = 1A/s Storage temperature range Operating junction temperature range Parameter Tc = 80C tp = 8.3ms tp = 10ms tp = 10ms Value 55 420 400 800 100 - 40 + 150 - 40 + 125 A2s A/s C Unit A A I2t dI/dt Tstg Tj Symbol Parameter -800 MSS40 -1200 1200 -1400 1400 Unit VDRM VRRM Repetitive peak off-state voltage Tj = 125 C 800 V TM : ISOTOP is a trademark of SGS-THOMSON Microelectronics April 1995 1/6 MSS40 THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter DC AC Rth (c-h) Contact (case to heatsink) (4) Value 1 0.6 0.05 C/W Unit C/W (4) With contact grease utilisation GATE CHARACTERISTICS (maximum values) PGM = 50 W (tp = 20 s) PG (AV)= 1 W IFGM = 4 A (tp = 20 s) VRGM = 5V. ELECTRICAL CHARACTERISTICS Symbol IGT VGT VGD tgt IL VD=12V VD=12V (DC) (DC) Test Conditions RL=33 RL=33 Tj=25C Tj=25C Tj=125C Tj=25C Tj=25C MAX MAX MIN TYP TYP MAX IH IT= 0.5A gate open Tj=25C TYP MAX VTM IDRM IRRM tq dV/dt * ITM= 80A tp= 380s VDRM VRRM Rated Rated Tj=25C Tj=25C Tj=125C Tj=125C Tj=125C MAX MAX MAX TYP MIN Value 50 1.5 0.2 2 60 120 40 80 1.7 0.05 10 100 500 s V/s V mA mA Unit mA V V s mA VD=VDRM R L=3.3k VD=VDRM IG = 500mA dIG/dt = 3A/s IG=1.2 IGT IT= 80A VR=75V VD =67%VDRM dI/dt=30A/s dV/dt=20V/s Gate open Linear slope up to VD =67%VDRM gate open * For higher guaranteed values, please consult us. Note : MSS40-1400 - IDRM and IRRM at Tj = 125C is defined at 1200 V - dV/dt at Tj = 125C is defined at 67% of 1200 V 2/6 MSS40 Fig. 1 : Maximun RMS power dissipation versus RMS on-state current. (F= 50 Hz) P(W) Fig. 2 : Correlation between maximum RMS power dissipation and maximum allowable temperature (Tamb) for different thermal resistances heatsink + contact. P (W) Rth=O oC/W Rth=O.75 o C/W Rth=1.0 oC/W Rth=1.5 oC/W Tamb( oC) Fig. 3 : RMS on-state current versus case temperature. Fig. 4: Thermal transient impedance junction to case versus pulse duration. Zth(j-c) (oC/W) I T(RMS)(A) =180 o Tcase( oC) tp(s) Fig. 5 : Relative variation of gate trigger and holding current versus junction temperature. Igt;Ih [Tj] / Igt; Ih [Tj=25oC] Fig. 6 : Non repetitive surge peak on-state current versus number of cycles. I TSM(A) Tj initial = 25 C 0 Igt Ih Tj(oC) Number of cycles 3/6 MSS40 Fig.7 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : tp 10 ms and correspond2 ing value of I t . I TSM(A);I2t(A2s) Tj initial = 25oC I2t Fig. 8 : On-state characteristics . (Maximum values) V TM (V) Tj=125 oC: Rt=11m ITSM Tj initial = 25 o C tp(ms) Tj initial = 125 oC I TM(A) 4/6 MSS40 PACKAGE MECHANICAL DATA ISOTOP plastic : SCREW VERSION M G / OJ O A B / OI / OI D H E F C K L P screw H M4 REF. A B C D E F G H I J K L M O P DIMENSIONS Millimeters Inches Min. Max. Min. Max. 11.80 12.20 0.465 0.480 8.90 9.10 0.350 0.358 1.95 2.05 0.077 0.081 0.75 0.85 0.029 0.034 12.60 12.80 0.496 0.504 25.10 25.50 0.988 1.004 31.50 31.70 1.240 1.248 4.00 0.157 4.10 4.30 0.161 0.169 4.10 4.30 0.161 0.169 14.90 15.10 0.586 0.595 30.10 30.30 1.185 1.193 37.80 38.20 1.488 1.504 7.80 8.20 0.307 0.323 5.50 0.216 Cooling method : C Marking : Type number Weight : 28 g. (without screws) Electrical isolation : 2500V(RMS) Capacitance : < 45 pF Inductance : < 5 nH - Recommended torque value : 1.3 N.m (Max 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or others types of terminals) with a thickness of 0.6 mm min and 2.2 mm max. 5/6 MSS40 Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THO MSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 6/6 |
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