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| (R) STPS5H100B HIGH VOLTAGE POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS s 5A 100 V 175 C 0.61 V K A NC s s s s NEGLIGIBLE SWITCHING LOSSES HIGH JUNCTION TEMPERATURE CAPABILITY LOW LEAKAGE CURRENT GOOD TRADE OFF BETWEEN LEAKAGE CURRENT AND FORWARD VOLTAGE DROP AVALANCHE CAPABILITY SPECIFIED DPAK DESCRIPTION Schottky barrier rectifier designed for high frequency miniature Switched Mode Power Supplies such as adaptators and on board DC to DC converters. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM PARM Tstg Tj dV/dt *: Parameter Repetitive peak reverse voltage RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Repetitive peak avalanche power Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage Tc = 165C = 0.5 Value 100 10 5 75 1 2 7200 - 65 to + 175 175 10000 Unit V A A A A A W C C V/s tp = 10 ms sinusoidal tp = 2 s square F = 1kHz tp = 100 s square tp = 1s Tj = 25C dPtot 1 thermal runaway condition for a diode on its own heatsink < dTj Rth( j - a ) 1/4 July 2003 - Ed: 6B STPS5H100B THERMAL RESISTANCES Symbol Rth (j-c) Junction to case Parameter Value 2.5 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * Parameter Reverse leakage current Tests Conditions Tj = 25C Tj = 125C VF ** Forward voltage drop Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 5 ms, < 2% ** tp = 380 s, < 2% Min. Typ. Max. 3.5 Unit A mA V VR = VRRM 1.3 IF = 5 A IF = 5 A IF = 10 A IF = 10 A 0.66 0.57 4.5 0.73 0.61 0.85 0.71 To evaluate the maximum conduction losses use the following equation : P = 0.51 x IF(AV) + 0.02 x IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. PF(av)(W) 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 IF(av) (A) =tp/T tp T Fig. 2: Average forward current versus ambient temperature (=0.5). IF(av)(A) = 0.1 = 0.05 = 0.2 6 = 0.5 Rth(j-a)=Rth(j-c) 5 =1 4 Rth(j-a)=80C/W 3 2 1 0 0 =tp/T T tp 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Tamb(C) 60 80 100 120 140 160 180 20 40 Fig. 3: Normalized avalanche power derating versus pulse duration. PARM(tp) PARM(1s) 1 Fig. 4: Normalized avalanche power derating versus junction temperature. PARM(tp) PARM(25C) 1.2 1 0.1 0.8 0.6 0.01 0.4 0.2 0.001 0.01 0.1 1 tp(s) 10 100 1000 Tj(C) 0 0 25 50 75 100 125 150 2/4 STPS5H100B Fig. 5: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 120 110 100 90 80 70 60 50 40 30 IM 20 10 0 1E-3 Fig. 6: Relative variation of thermal impedance junction to case versus pulse duration. Zth(j-c)/Rth(j-c) 1.0 0.8 Tc=50C 0.6 0.4 0.2 = 0.5 Tc=75C Tc=125C t = 0.2 = 0.1 Single pulse T =0.5 t(s) 1E-2 1E-1 1E+0 0.0 1E-3 1E-2 tp(s) 1E-1 =tp/T tp 1E+0 Fig. 7: Reverse leakage current versus reverse voltage applied. IR(A) 5E+3 1E+3 1E+2 1E+1 1E+0 1E-1 1E-2 0 10 Tj=25C Tj=125C Fig. 8: Junction capacitance versus reverse voltage applied (typical values). C(pF) 1000 F=1MHz Tj=25C 100 VR(V) 20 30 40 50 60 70 80 90 100 VR(V) 10 1 10 100 Fig. 9: Forward voltage drop versus forward current (maximum values). Fig. 10: Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4, copper thickness: 35m). Rth(j-a) (C/W) 100 90 80 70 60 50 40 30 20 10 0 IFM(A) 50.0 Tj=125C 10.0 Tj=25C 1.0 0.1 0.0 VFM(V) 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 S(Cu) (cm) 0 2 4 6 8 10 12 14 16 18 20 3/4 STPS5H100B PACKAGE MECHANICAL DATA DPAK DIMENSIONS REF. A A1 A2 B B2 C C2 D E G H L2 L4 V2 FOOT PRINT (in millimeters) 6.7 Millimeters Min. 2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35 0.80 0.60 0 1.00 0.023 8 0 Typ. Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10 Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Inches Typ. Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.031 0.039 8 6.7 6.7 3 1.6 2.3 2.3 1.6 Ordering type STPS5H100B STPS5H100B-TR s Marking S5H100 S5H100 Package DPAK DPAK Weight 0.30g 0.30g Base qty 75 2500 Delivery mode Tube Tape & reel EPOXY MEETS UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 4/4 |
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