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HB56D236 Series
2,097,152-word x 36-bit High Density Dynamic RAM Module
Description
The HB56D236 is a 2M x 36-bit dynamic RAM module, mounted 16 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 4 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D236 is 72-pin single in-line package. Therefore, the HB56D236 makes high density mounting possible without surface mount technology. The HB56D236 provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ but only on the one side of its module board.
Features
* 72-pin Lead pitch: 1.27 mm * Single 5 V (5%) supply * High speed Access time: 60 ns/70 ns/80 ns (max) * Low power dissipation Active mode: 5.73 W/5.20 W/4.68 W (max) Standby mode: 210 mW (max) 10.5 mW (max) (L-version) * Fast page mode capability * 1,024 refresh cycle: 16 ms 1,024 refresh cycle: 128 ms (L-version) * 3 variations of refresh RAS only refresh CAS-before-RAS refresh Hidden refresh * TTL compatible
HB56D236 Series
Ordering Information
Type No. HB56D236BW-6C HB56D236BW-7C HB56D236BW-8C HB56D236BW-6CL HB56D236BW-7CL HB56D236BW-8CL HB56D236SBW-6C HB56D236SBW-7C HB56D236SBW-8C HB56D236SBW-6CL HB56D236SBW-7CL HB56D236SBW-8CL Access Time 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 72-pin SIP socket type Solder Package 72-pin SIP socket type Contact Pad Gold
Note: The specification of this device is subject to change without notice. Please contact your nearest Hitachi's Sales Dept. regarding specification.
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