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| (R) ESDA6V1-5P6 TRANSILTM ARRAY FOR ESD PROTECTION Application Specific Discretes A.S.D. MAIN APPLICATIONS Where transient overvoltage protection in ESD sensitive equipment is required, such as : Computers Printers Communication systems and cellular phones Video equipment This device is particularly adpated to the protection of symmetrical signals. s s s s FEATURES 5 UNIDIRECTIONAL TRANSILTM FUNCTIONS. BREAKDOWN VOLTAGE VBR = 6.1V MIN LOW LEAKAGE CURRENT < 500 nA VERY SMALL PCB AREA < 2.6 mm2 s s s s SOT-666 DESCRIPTION The ESDA6V1-5P6 is a monolithic array designed to protect up to 5 lines against ESD transients. This device is ideal for applications where board space saving is required. FUNCTIONAL DIAGRAM I/O1 GND I/O5 I/O4 I/O3 BENEFITS High ESD protection level. High integration. Suitable for high density boards. s s s I/O2 COMPLIES WITH THE FOLLOWING STANDARDS : s s IEC61000-4-2 level 4: 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883E-Method 3015-7: class 3 25kV HBM (Human Body Model) March 2003 - Ed: 2A 1/5 ESDA6V1-5P6 ABSOLUTE MAXIMUM RATINGS (Tamb = 25C) Symbol VPP PPP Tj Tstg TL Top Parameter Test conditions Value 15 8 150 125 - 55 to + 150 260 - 40 to + 150 Unit kV W C C C C ESD discharge - IEC61000-4-2 air discharge IEC61000-4-2 contact discharge Peak pulse power (8/20 s) (see note 1) Junction temperature Storage temperature range Maximum lead temperature for soldering during 10s at 5mm for case Operating temperature range Tj initial = Tamb Note 1: for a surge greater than the maximum values, the diode will fail in short-circuit. THERMAL RESISTANCES Symbol Rth(j-a) Parameter Junction to ambient on printed circuit on recommended pad layout Value 220 Unit C/W ELECTRICAL CHARACTERISTICS (Tamb = 25C) Symbol VRM VBR VCL IRM IPP T VF C Rd Parameter Stand-off voltage Breakdown voltage Clamping voltage Leakage current Peak pulse current Voltage tempature coefficient Forward voltage drop Capacitance per line Dynamic resistance Slope: 1/Rd IPP VCL VBR VRM IRM VF V IF I Types min. VBR @ max. IR IRM max. @ VRM Rd typ. T max. C typ. @ 0V V V 7.2 mA 1 A 0.5 V 3 1.5 10 /C 4.5 -4 pF 70 ESDA6V1-5P6 6.1 2/5 ESDA6V1-5P6 Fig. 1: Relative variation of peak pulse power versus initial junction temperature. PPP[Tj initial] / PPP[Tj initial=25C) Fig. 2: Peak pulse power versus exponential pulse duration. PPP(W) 1.1 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0 25 50 75 100 125 150 Tj(C) 1000 Tj initial=25C 100 Tp(s) 10 1 10 100 Fig. 3: Clamping voltage versus peak pulse current (typical values, rectangular waveform). IPP(A) Fig. 4: Forward voltage drop versus peak forward current (typical values). IFM(A) 100.0 tp=2.5s Tj initial=25C 1.E+00 Tj=125C 10.0 1.E-01 Tj=25C 1.0 1.E-02 VCL(V) VFM(V) 0.1 0 10 20 30 40 50 60 70 1.E-03 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 Fig. 5: Junction capacitance versus reverse voltage applied (typical values). C(pF) Fig. 6: Relative variation of leakage current versus junction temperature (typical values). IR[Tj] / IR[Tj=25C] 80 70 60 50 40 30 20 10 0 0 1 2 VR(V) F=1MHz VOSC=30mVRMS Tj=25C 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 Tj(C) VR=3V 3 4 5 6 25 50 75 100 125 3/5 ESDA6V1-5P6 Fig. 7: ESD response @ VPP=8kV contact. Fig. 8: ESD response @ VPP=15kV contact. IEC61000-4-2: VPP=8kV Contact IEC61000-4-2: VPP=15kV Contact ORDER CODE ESDA 6V1 5 P6 ESD ARRAY VBR min 5 lines PACKAGE: SOT-666 Ordering type ESDA6V1-5P6 Marking C Package SOT-666 Weight 2.9 mg. Base qty 3000 Delivery mode Tape & reel 4/5 ESDA6V1-5P6 PACKAGE MECHANICAL DATA SOT-666 DIMENSIONS REF. Millimeters Min. A bp bp e1 e Inches Min. 0.020 0.007 0.003 0.060 0.043 Max. 0.024 0.011 0.007 0.067 0.051 Max. 0.60 0.27 0.18 1.70 1.30 1.00 0.50 0.50 0.17 0.08 1.50 1.10 c D E e D E 0.040 0.020 1.70 0.30 0.059 0.004 0.067 0.012 A Lp He e1 U He Lp 1.50 0.10 FOOT PRINT (in millimeters) 0.36 0.30 0.62 2.30 0.84 0.20 0.20 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 2003 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore Spain - Sweden - Switzerland - United Kingdom - United States. http://www.st.com 5/5 |
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