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TS982
RAIL TO RAIL HIGH OUTPUT CURRENT
DUAL OPERATIONAL AMPLIFIER
s Operating from Vcc=2.5V to 5.5V s 200mA output current on each amplifier s High dissipation package s Rail to Rail input and output s Unity-Gain Stable
DESCRIPTION The TS982 is a dual operational amplifier able to drive 200mA down to voltages as low as 2.7V. The SO8 Exposed-Pad package allows high current output at high ambiant temperatures making it a reliable solution for automotive and industrial applications. The TS982 is stable with a unity gain. APPLICATIONS
DW SO8 Exposed-Pad (Plastic Micropackage)
s Hall Sensor Compensation Coil s Servo Amplifier s Motor Driver s Industrial s Automotive
ORDER CODE
Part Number TS982DW TS982DWT Temperature Range Package
PIN CONNECTIONS (top view)
Output1 1 Inverting Input1 2 Non Inverting Input1 3 VCC - 4
8 VCC +
+
7 Output2
-40C, +125C SO8 Exposed-Pad
+
6 Inverting Input2 5 Non Inverting Input2
DW = SO8 Exposed Pad available in Tray) DWT = SO8 Exposed Pad available in Tape & Reel
Cross Section View Showing Exposed-Pad This pad can be connected to a (-Vcc) copper area on the PCB
May 2003
1/15
TS982
ABSOLUTE MAXIMUM RATINGS
Symbol VCC Vi Toper Tstg Tj Rthja Rthjc ESD ESD ESD Latch-up Supply voltage Input Voltage Operating Free Air Temperature Range Storage Temperature Maximum Junction Temperature Thermal Resistance Junction to Ambient2) Thermal Resistance Junction to Case Human Body Model (HBM) Charge Device Model (CDM) Machine Model (MM) Latch-up Immunity (All pins) Lead Temperature (soldering, 10sec) Output Short-Circuit Duration
1)
Parameter
Value 6 -0.3v to VCC +0.3v -40 to + 125 -65 to +150 150 45 10 2 1.5 200 200 250 see note 3)
Unit V V C C C C/W C/W kV kV V mA C
1. All voltage values are measured with respect to the ground pin. 2. With two sides, two planes PCB following EIA/JEDEC JESD51-7 standard. 3. Short-circuits can cause excessive heating. Destructive dissipation can result from a short-circuit on one or two amplifiers simultaneously.
OPERATING CONDITIONS
Symbol VCC VICM CL Supply Voltage Common Mode Input Voltage Range Load Capacitor RL < 100 RL > 100 Parameter Value 2.5 to 5.5 GND to VCC 400 100 Unit V V pF
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TS982
ELECTRICAL CHARACTERISTICS VCC = +5V, VCC- = 0V, Tamb = 25C (unless otherwise specified)
Symbol ICC VIO VIO IIB IIO Supply Current No input signal, no load Input Offset Voltage (VICM = VCC/2) Input Offset Voltage Drift Input Bias Current VICM = VCC/2 Input Offset Current VICM = VCC/2 High Level Output Voltage RL = 16 Iout = 200mA Low Level Output Voltage RL = 16 Iout = 200mA Large Signal Voltage Gain RL = 16 Gain Bandwith Product RL = 32ohms Common Mode Rejection Ratio Supply Voltage Rejection Ratio Slew Rate, Unity Gain Inverting RL = 16 Phase Margin at Unit Gain RL = 16, CL = 400pF Gain Margin RL = 16, CL = 400pF Equivalent Input Noise Voltage F = 1 kHz Channel Separation RL = 16, F = 1kHz 0.45 1.35 4.2 Parameter Min. Typ. 5.5 1 2 200 10 500 Max. 7.2 5 Unit mA mV V/C nA nA
VOH
4.4 4 0.55 1 95 2.2 80 95 0.7 56 18 0.65
V
VOL
V
AVD GBP CMR SVR SR m Gm en Crosstalk
dB MHz dB dB V/s degrees dB
17
nV ----------Hz
dB
100
3/15
TS982
ELECTRICAL CHARACTERISTICS VCC = +3.3V, VCC- = 0V, Tamb = 25C (unless otherwise specified)1)
Symbol ICC VIO VIO IIB IIO Parameter Supply Current No input signal, no load Input Offset Voltage (VICM = VCC/2) Input Offset Voltage Drift Input Bias Current VICM = VCC/2 Input Offset Current VICM = VCC/2 High Level Output Voltage RL = 16 Iout = 200mA Low Level Output Voltage RL = 16 Iout = 200mA Large Signal Voltage Gain RL = 16 Gain Bandwith Product RL = 32ohms Common Mode Rejection Ratio Supply Voltage Rejection Ratio Slew Rate, Unity Gain Inverting RL = 16 Phase Margin at Unit Gain RL = 16, CL = 400pF Gain Margin RL = 16, CL = 400pF Equivalent Input Noise Voltage F = 1 kHz Channel Separation RL = 16, F = 1kHz 0.45 1.2 2.68 Min. Typ. 5.3 1 2 200 10 500 Max. 7.2 5 Unit mA mV V/C nA nA
VOH
2.85 2.3 0.45 1 92 2 75 95 0.7 57 16 0.52
V
VOL
V
AVD GBP CMR SVR SR m Gm en Crosstalk
dB MHz dB dB V/s degrees dB
17
nV ----------Hz
dB
100
1) All electrical values are guaranteed by correlation with measurements at 2.7V and 5V.
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TS982
ELECTRICAL CHARACTERISTICS VCC = +2.7V, VCC- = 0V, Tamb = 25C (unless otherwise specified)1)
Symbol ICC VIO VIO IIB IIO Parameter Supply Current No input signal, no load Input Offset Voltage (VICM = VCC/2 Input Offset Voltage Drift Input Bias Current VICM = VCC/2 Input Offset Current VICM = VCC/2 High Level Output Voltage RL = 16 Iout = 200mA Low Level Output Voltage RL = 16 Iout = 200mA Large Signal Voltage Gain RL = 16 Gain Bandwith Product RL = 32ohms Common Mode Rejection Ratio Supply Voltage Rejection Ratio Vcc = TBD to TBD V Slew Rate, Unity Gain Inverting RL = 16 Phase Margin at Unit Gain RL = 16, CL = 400pF Gain Margin RL = 16, CL = 400pF Equivalent Input Noise Voltage F = 1 kHz Channel Separation RL = 16, F = 1kHz 0.42 1.2 1.97 Min. Typ. 5 1 2 200 10 500 Max. 7.2 5 Unit mA mV V/C nA nA
VOH
2.15 1.7 0.35 1 90 2 75 95 0.65 57 16 0.45
V
VOL
V
AVD GBP CMR SVR SR m Gm en Crosstalk
dB MHz dB dB V/s degrees dB
17
nV ----------Hz
dB
100
1) All electrical values are guaranteed by correlation with measurements at 2.7V and 5V.
5/15
TS982
Current Consumption vs Supply Voltage Voltage Drop vs Output Sourcing Current
No load
Ta=125 C Ta=25 C Ta=-40 C
Vcc = 2.7V to 5V Vicm = Vcc/2 Vid = 100mV Output Sourcing Testboard PCB
Voltage Drop vs Output Sinking Current
Voltage Drop vs Supply Voltage (Sourcing))
Vcc = 2.7V to 5V Vicm = Vcc/2 Vid = 100mV Output Sinking Testboard PCB
Vicm = Vcc/2 Vid = 100mV Isource = 200mA Testboard
Voltage Drop vs Supply Voltage (Sinking)
Voltage Drop vs Temperature (Iout=50mA)
Vicm = Vcc/2 Vid = 100mV Isink = 200mA Testboard
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 50mA
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TS982
Voltage Drop vs Temperature (Iout=100mA) Voltage Drop vs Temperature (Iout=200mA)
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 100mA
Vcc = 5V Vicm = Vcc/2 Vid = 100mV Iout= 200mA
Open Loop Gain and Phase vs Frequency
Open Loop Gain and Phase vs Frequency
80 Gain 60 40
Gain (dB)
180 Vcc = 2.7V RL = 8 Tamb = 25C 160 140 120
Gain (dB)
80 Gain 60 40
Phase (Deg)
180 Vcc = 5V RL = 8 Tamb = 25C 160 140 120 100 Phase
Phase (Deg) Phase (Deg)
100 20 0 -20 -40 0.1 Phase 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
20 0 -20 -40 0.1
80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
Open Loop Gain and Phase vs Frequency
Open Loop Gain and Phase vs Frequency
180 80 60
Gain (dB)
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 16 Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 16 Tamb = 25C
160 140 120
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
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TS982
Open Loop Gain and Phase vs Frequency Open Loop Gain and Phase vs Frequency
180 80 60
Gain (dB)
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 32 Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 32 Tamb = 25C
160 140 120 100
Phase (Deg) Phase (Deg) Phase (Deg)
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
Open Loop Gain and Phase vs Frequency
Open Loop Gain and Phase vs Frequency
180 80 60 Gain Vcc = 5V RL = 600 Tamb = 25C 160 140 120
180 80 60
Gain (dB)
Gain
Vcc = 2.7V RL = 600 Tamb = 25C
160 140 120
Phase (Deg)
40 20 0 -20 -40 0.1 Phase
Gain (dB)
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 1000 Frequency (kHz) 10000 -20
Open Loop Gain and Phase vs Frequency
Open Loop Gain and Phase vs Frequency
180 80 60
Gain (dB)
180 80 60
Phase (Deg) Gain (dB)
Gain
Vcc = 2.7V RL = 5k Tamb = 25C
160 140 120
Gain
Vcc = 5V RL = 5k Tamb = 25C
160 140 120
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 Frequency (kHz) 1000 10000 -20
40 20 0 -20 -40 0.1 Phase
100 80 60 40 20 0 1 10 100 1000 Frequency (kHz) 10000 -20
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TS982
Phase Margin vs Supply Voltage Gain Margin vs Supply Voltage
50 RL=8 Tamb=25C 40
Phase Margin (Deg)
50 RL=8 Tamb=25C 40
30
Gain Margin (dB)
30
20
CL= 0 to 500pF
20
CL=0 to 500pF
10
10
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
Phase Margin vs Power Supply Voltage
Gain Margin vs Power Supply Voltage
50
50 RL=16 Tamb=25C
40
Phase Margin (Deg)
40
30
Gain Margin (dB)
CL= 0 to 500pF
30
20
20
CL=0 to 500pF
10 RL=16 Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
10
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
Phase Margin vs Power Supply Voltage
Gain Margin vs Power Supply Voltage
50
50 RL=32 Tamb=25C
40
Phase Margin (Deg)
40 CL= 0 to 500pF
Gain Margin (dB)
30
30
20
20 CL=0 to 500pF 10
10 RL=32 Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
0 2.0
2.5
3.0 3.5 4.0 Power Supply Voltage (V)
4.5
5.0
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TS982
Phase Margin vs Power Supply Voltage Gain Margin vs Power Supply Voltage
70 60
Phase Margin (Deg)
20
CL=0pF CL=100pF CL=200pF
CL=0pF 40 30 20 10 RL=600 Tamb=25C 2.5
CL=500pF
Gain Margin (dB)
50
10
CL=500pF
RL=600 Tamb=25C 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
0 2.0
Phase Margin vs Power Supply Voltage
Gain Margin vs Power Supply Voltage
70 60
Phase Margin (Deg)
20
CL=0pF
Gain Margin (dB)
50 40 30 20 10 0 2.0 RL=5k Tamb=25C 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0 CL=0pF CL=300pF CL=500pF
CL=100pF
10
CL=200pF
CL=500pF
RL=5k Tamb=25C 0 2.0 2.5 3.0 3.5 4.0 Power Supply Voltage (V) 4.5 5.0
Distortion vs Output Voltage
Distortion vs Output Voltage
RL = 2 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
RL = 4 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
Vcc=3.3V
Vcc=3.3V
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TS982
Distortion vs Output Voltage Distortion vs Output Voltage
RL = 8 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
RL = 16 F = 1kHz Av = +1 BW < 80kHz Tamb = 25C
Vcc=2.7V
Vcc=5V
Vcc=3.3V
Vcc=3.3V
Crosstalk vs Frequency
Crosstalk vs Frequency
100
100
80
ChB to ChA ChA to ChB
Crosstalk (dB)
80
ChB to ChA ChA to ChB
Crosstalk (dB)
60 RL=8 Vcc=5V Pout=100mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
60 RL=16 Vcc=5V Pout=90mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
40
40
20
20
Crosstalk vs Frequency
Crosstalk vs Frequency
120
100
100
80 ChB to ChA & ChA to Chb
Crosstalk (dB)
60 RL=32 Vcc=5V Pout=60mW Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
Crosstalk (dB)
80 60 40 20 0
ChB to ChA & ChA to Chb
40
20
RL=600 Vcc=5V Vout=1.4Vrms Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k
11/15
TS982
Crosstalk vs Frequency Equivalent Input Noise Voltage vs Frequency
Equivalent Input Noise Voltage (nv/ Hz)
120 100 80 60 40 20 0 RL=5k Vcc=5V Vout=1.5Vrms Av=-1 Bw < 125kHz Tamb=25C 20 100 1000 Frequency (Hz) 10000 20k ChB to ChA & ChA to Chb
25 Vcc=5V Rs=100 Tamb=25C 20
Crosstalk (dB)
15
10
5 0.02
0.1
1 Frequency (kHz)
10
Power Supply Rejection Ratio vs Frequency
Vcc=5V
Vcc=3.3V
Vcc=2.7V
Gain = +1 pins 3 & 5 tied to Vcc/2 RL >= 8 Vin=70mVrms Vripple on pin8=100mVpp Tamb=25C
20
12/15
TS982
APPLICATION INFORMATION Exposed Pad Package Description The dual operational amplifier TS982 is housed in an SO8 Exposed-Pad plastic package. As shown in the figure below, the die is mounted and glued on a leadframe. This leadframe is exposed as a thermal pad on the underside of the package. The thermal contact is direct with the die and therefore, offers an excellent thermal performance in comparison with usual SO packages. The thermal contact between the die and the Exposed Pad is characterized using the parameter Rthjc . Exposed Pad Electrical Connection In the SO8Epad package, the silicon die is mounted on the thermal pad (see the figure above). The silicon substrate is not directly connected to the pad because of the glue. Therefore, the copper area of the Exposed Pad must be connected to the substrate voltage (Vcc-) pin4. Thermal Management Benefits A good thermal design is important to maintain the temperature of the silicon junction below Tj=150C as given in the Absolute Maximum Ratings and also to maintain the operating power level. Another effect of temperature is that the life expectancy of an integrated circuit decreases exponentially at extended high temperature operation. Using one rule-of-thumb, the chip failure rates double for every 10 to 20C. This demonstrates that reducing the junction temperature is also important to improve the reliability of the amplifier. Thanks to the high dissipation capability of the SO8 Epad package, the dual OpAmpTS982 allows lower junction temperature at high current applications in high ambient temperatures. As 90% of the heat is removed through the pad, the thermal dissipation of the circuit is directly linked to the copper area soldered to the pad. In other words, the Rthja depends on the copper area and the number of layers of the printed circuit board under the pad.
TS982 Testboard layout: 6 cm2 of copper topside:
Thermal Management Guideline The following guidelines are a simple procedure to determine the PCB you should use in order to get the best from the SO8 Exposed Pad package:
u The first step is to determine the total power Ptotal to be dissipated by the IC. Ptotal = Iccx Vcc + Pamp1 + Vdrop2xIout2
x
Pamp2 Iout1+
Iccx Vcc is the DC power needed by the TS982 for operating with no load. You could refer to the curve 'Current Consumption vs Supply Voltage' to determine Icc versus Vcc and versus temperature. Pamp1 is the power dissipated by the 1st operational amplifier to output a signal. If the output signal can be assimilated to a DC signal, you could simply calculate the dissipated power using the Voltage drop curves versus output current, supply voltage, temperature.
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TS982
Pamp2 is the power dissipated by the second operational amplifier. u Specify the maximum operating temperature, (Ta)of the TS982. u Specify the maximum junction temperature (Tj) at the maximum output power. As discussed above, Tj must be below 150C and as low as possible for reliability considerations. u The maximum thermal resistance between junction and ambient Rthja is then: Rthja = (Tj-Ta)/Ptotal Different PCBs can give the right Rthja for one application. The following curve gives the Rthja of the SO8Epad versus the copper area of a top side PCB.
Rthja of the TS982 vs Top Side Copper Area
The ultimate Rthja of the package on a 4 layers PCB under natural convection conditions, is 45C/ W by using two power planes and metallized holes. Parallel Operation Using the two amplifiers of the TS982 in parallel mode allows higher output current: 400 mA.
Parallel Operation: 400mA Output Current
10K
10K Input
TS981-1
400 mA Output Current
+
Load
TS981-2
+
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TS982
PACKAGE MECHANICAL DATA 8 PINS - PLASTIC MICROPACKAGE (SO Exposed-Pad)
Millimeters Dim. Min. A A1 A2 B C D D1 E E1 e H h L k ddd 1.350 0.000 1.100 0.330 0.190 4.800 3.10 3.800 2.41 1.270 5.800 0.250 0.400 0d 6.200 0.500 1.270 8d 0.100 0.228 0.010 0.016 0d 4.000 0.150 Typ. Max. 1.750 0.250 1.650 0.510 0.250 5.000 Min. 0.053 0.001 0.043 0.013 0.007 0.189
Inches Typ. Max. 0.069 0.010 0.065 0.020 0.010 0.197 0.122 0.157 0.095 0.050 0.244 0.020 0.050 8d 0.004
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. (c) The ST logo is a registered trademark of STMicroelectronics 2003 STMicroelectronics - All Rights Reserved STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States http://www.st.com
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