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| Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation GENERAL DESCRIPTION Passivated guaranteed commutation triacs in a plastic envelope suitable for surface mounting intended for use in motor control circuits or with other highly inductive loads. These devices balance the requirements of commutation performance and gate sensitivity. The "sensitive gate" E series and "logic level" D series are intended for interfacing with low power drivers, including micro controllers. BTA212B series D, E and F QUICK REFERENCE DATA SYMBOL PARAMETER BTA212BBTA212BBTA212BRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current MAX. 600D 600E 600F 600 12 95 MAX. 800E 800F 800 12 95 UNIT VDRM IT(RMS) ITSM V A A PINNING - SOT404 PIN 1 2 3 mb DESCRIPTION main terminal 1 main terminal 2 gate main terminal 2 PIN CONFIGURATION mb SYMBOL T2 2 1 3 T1 G LIMITING VALUES Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current full sine wave; Tmb 99 C full sine wave; Tj = 25 C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 20 A; IG = 0.2 A; dIG/dt = 0.2 A/s CONDITIONS MIN. -600 6001 12 MAX. -800 800 UNIT V A I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature - 95 105 45 100 2 5 5 0.5 150 125 A A A2s A/s A V W W C C over any 20 ms period -40 - 1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s. February 2000 1 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation THERMAL RESISTANCES SYMBOL Rth j-mb Rth j-a PARAMETER CONDITIONS BTA212B series D, E and F MIN. - TYP. 55 MAX. 1.5 2.0 - UNIT K/W K/W K/W Thermal resistance full cycle junction to mounting base half cycle Thermal resistance in free air junction to ambient STATIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL IGT PARAMETER Gate trigger current 2 CONDITIONS BTA212BVD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A T2+ G+ T2+ GT2- GVD = 12 V; IGT = 0.1 A IT = 17 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 C VD = VDRM(max); Tj = 125 C MIN. TYP. ...D ...D 5 5 5 15 25 25 15 ...D, E, F MAX. ...E 10 10 10 25 30 30 25 1.6 1.5 0.5 ...F 25 25 25 30 40 40 30 UNIT 0.25 - 1.0 2.2 3.3 6 6 9 3.8 1.3 0.7 0.4 0.1 mA mA mA mA mA mA mA V V V mA IL Latching current IH VT VGT ID Holding current On-state voltage Gate trigger voltage Off-state leakage current DYNAMIC CHARACTERISTICS Tj = 25 C unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate of rise of off-state voltage Critical rate of change of commutating current Critical rate of change of commutating current CONDITIONS BTA212BVDM = 67% VDRM(max); Tj = 110 C; exponential waveform; gate open circuit VDM = 400 V; Tj = 110 C; IT(RMS) = 12 A; dVcom/dt = 20V/s; gate open circuit VDM = 400 V; Tj = 110 C; IT(RMS) = 12 A; dVcom/dt = 0.1V/s; gate open circuit ...D 20 MIN. ...E 60 ...F 70 TYP. ...D 30 V/s MAX. UNIT dIcom/dt 1.8 3.5 5 3 - A/ms dIcom/dt 5 16 19 100 - A/ms ...D, E, F tgt Gate controlled turn-on time ITM = 12 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s 2 s 2 Device does not trigger in the T2-, G+ quadrant. February 2000 2 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F 20 Ptot / W Tmb(max) / C 95 = 180 15 IT(RMS) / A BT138 15 1 120 90 60 99 C 102.5 10 110 5 10 30 5 117.5 0 0 5 IT(RMS) / A 10 125 15 0 -50 0 50 Tmb / C 100 150 Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where = conduction angle. Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb. IT(RMS) / A 1000 ITSM / A 25 20 dI T /dt limit 100 15 10 IT T 10 10us I TSM time 5 Tj initial = 25 C max 100us 1ms T/s 10ms 100ms 0 0.01 0.1 1 surge duration / s 10 Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 20ms. ITSM / A IT 80 T ITSM time Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb 99C. VGT(Tj) VGT(25 C) 100 1.6 1.4 1.2 1 Tj initial = 25 C max 60 40 0.8 20 0.6 0.4 -50 0 1 10 100 Number of cycles at 50Hz 1000 0 50 Tj / C 100 150 Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz. Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj. February 2000 3 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation BTA212B series D, E and F IGT(Tj) IGT(25C) 3 T2+ G+ T2+ GT2- G- 40 IT / A Tj = 125 C Tj = 25 C typ max 2.5 30 Vo = 1.175 V Rs = 0.0316 Ohms 2 1.5 20 1 10 0.5 0 -50 0 0 Tj/C 50 100 150 0 0.5 1 1.5 VT / V 2 2.5 3 Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj. IL(Tj) IL(25 C) Fig.10. Typical and maximum on-state characteristic. 10 Zth j-mb (K/W) 3 2.5 2 1.5 1 1 unidirectional bidirectional 0.1 P D tp 0.01 0.5 0 -50 0.001 10us 0.1ms 1ms 10ms tp / s 0.1s 1s t 0 50 Tj / C 100 150 10s Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj. IH(Tj) IH(25C) Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp. dIcom/dt (A/ms) 100 F TYPE E TYPE D TYPE 3 2.5 2 10 1.5 1 0.5 0 -50 1 0 50 Tj / C 100 150 20 40 60 80 Tj/C 100 120 140 Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj. Fig.12. Minimum, critical rate of change of commutating current dIcom/dt versus junction temperature, dVcom/dt = 20V/s. February 2000 4 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation MECHANICAL DATA Dimensions in mm Net Mass: 1.4 g 10.3 max BTA212B series D, E and F 4.5 max 1.4 max 11 max 15.4 2.5 0.85 max (x2) 2.54 (x2) 0.5 Fig.13. SOT404 : centre pin connected to mounting base. MOUNTING INSTRUCTIONS Dimensions in mm 11.5 9.0 17.5 2.0 3.8 5.08 Fig.14. SOT404 : minimum pad sizes for surface mounting. Notes 1. Plastic meets UL94 V0 at 1/8". February 2000 5 Rev 1.000 Philips Semiconductors Product specification Three quadrant triacs guaranteed commutation DEFINITIONS Data sheet status Objective specification Product specification Limiting values BTA212B series D, E and F This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. February 2000 6 Rev 1.000 |
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