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CM1415 3 Channel Headset EMI Filter with ESD Protection
Features
* * * * * * * * * * Functionally and pin compatible with California Micro Device's CSPEMI205 OptiguardTM coated for improved reliability at assembly Three channels of EMI filtering, two for earpiece speakers and one for a microphone Pi-style EMI filters in a capacitor-resistor-capacitor (C-R-C) network Greater than 30dB relative attenuation in the 8002700MHz range +8kV ESD protection on each channel (IEC 61000-4-2 Level 4, contact discharge) +15kV ESD protection on each channel (HBM) 8-bump, 1.41mm X 1.45mm footprint Chip Scale Package (CSP) Chip Scale Package features extremely low parasitic inductance for optimum filter performance Lead-free version available
Product Description
The CM1415 is a low-pass filter array integrating three pi-style filters (C-R-C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This device is custom-designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30dB attenuation in the 800-2700 MHz range. These pi-style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals, enabling audio signals to pass through without distortion. In addition, the CM1415 provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins are designed and characterized to safely dissipate ESD strikes of +8kV, the maximum requirement of the IEC 61000-4-2 international standard. Using the MILSTD-883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than +15kV. The CM1415 is particularly well suited for portable electronics (e.g., cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CM1415 incorporates OptiguardTM coating which results in improved reliability at assembly. The CM1415 is available in a space-saving, low-profile Chip Scale Package with optional lead-free finishing.
Applications
* * * * * * EMI filtering and ESD protection for headset microphone and speaker Cellular / Mobile Phones Notebooks and Personal Computers Handheld PCs / PDAs / Tablets Wireless Handsets Digital Camcorders
Electrical Schematic
10 Earpiece 1 A1 Input 100pF 100pF C1 Earpiece 1 Output Microphone A5 Input 47pF 47pF 68 C5 Microphone Output
10 Earpiece 2 A3 Input 100pF 100pF C3 Earpiece 2 Output GND GND B2 B4
(c) 2004 California Micro Devices Corp. All rights reserved. 05/13/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
CM1415
PACKAGE / PINOUT DIAGRAMS
TOP VIEW (Bumps Down View)
Orientation Marking (se note 2)
BOTTOM VIEW (Bumps Up View)
MIC_IN EAR2_IN EAR1_IN
12345 A B C
CM1415
A5 A3
GND GND
A1 B2
A1
Orientation Marking
CD
B4 C5 C3
MIC_OUT EAR2_OUT EAR1_OUT
C1
Note: CSP Package 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PIN DESCRIPTIONS
PIN A1 A3 A5 B2 B4 C1 C3 C5 NAME EAR1_IN EAR2_IN MIC_IN GND GND EAR1_OUT EAR2_OUT MIC_OUT DESCRIPTION Earpiece Input 1 (from audio circuitry) Earpiece Input 2 (from audio circuitry) Microphone Input (from microphone) Device Ground Device Ground Earpiece Output 1 (to earpiece) Earpiece Output 2 (to earpiece) Microphone Output (to audio circuitry)
Ordering Information
PART NUMBERING INFORMATION
Standard Finish Ordering Part Bumps 8 Package CSP Number1 CM1415-03CS Part Marking CD Lead-free Finish 2 Ordering Part Number1 CM1415-03CP Part Marking CD
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2004 California Micro Devices Corp. All rights reserved.
2
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
05/13/04
CM1415
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER Storage Temperature Range DC Power per Resistor DC Package Power Rating RATING -65 to +150 100 300 UNITS C mW mW
STANDARD OPERATING CONDITIONS
PARAMETER Operating Temperature Range RATING -40 to +85 UNITS C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL R1 R2 C1 C2 ILEAK VSIG PARAMETER Resistance Resistance Capacitance Capacitance Diode Leakage Current Signal Voltage Positive Clamp Negative Clamp In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Cut-off frequency 1; Note 6 Cut-off frequency 2; Note 6 VIN=5.0V ILOAD = 10mA 5 -5 Notes 2,4 and 5 15 8 Notes 2,3,4 and 5 +15 -19 R = 10, C = 100pF R = 68, C = 47pF 34 63 V V MHz MHz kV kV 7 -10 15 -15 V V CONDITIONS MIN 9 54 80 38 TYP 10 68 100 47 MAX 11 75 120 57 1.0 UNITS pF pF A
VESD
VCL
fC1 fC2
Note 1: TA=25C unless otherwise specified. Note 2: ESD applied to input and output pins with respect to GND, one at a time. Note 3: Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1. Note 4: Unused pins are left open Note 5: The parameters are guaranteed by design. Note 6: ZSOURCE=50, ZLOAD =50
(c) 2004 California Micro Devices Corp. All rights reserved. 05/13/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
CM1415
Performance Information
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 1. Earpiece Circuit (A1-C1) EMI Filter Performance
Figure 2. Earpiece Circuit (A3-C3) EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
05/13/04
CM1415
Performance Information (cont'd)
Typical Filter Performance (nominal conditions unless specified otherwise, 50 Ohm Environment)
Figure 3. Microphone Circuit (A5-C5) EMI Filter Performance
(c) 2004 California Micro Devices Corp. All rights reserved. 05/13/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
CM1415
Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices.
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER Pad Size on PCB Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Flux Ratio Solder Paste Type Pad Protective Finish Tolerance -- Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask defined pads 0.325mm Round 0.125 - 0.150mm 0.330mm Round 50/50 by volume No Clean OSP (Entek Cu Plus 106A) +50m +20m 60 seconds 260C
Non-Solder Mask Defined Pad 0.275mm DIA.
Solder Stencil Opening 0.330mm DIA.
Solder Mask Opening 0.325mm DIA.
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
250
Temperature (C)
200 150 100 50 0 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0
Figure 5. Eutectic (SnPb) Solder Ball Reflow Profile
(c) 2004 California Micro Devices Corp. All rights reserved.
Figure 6. Lead-free (SnAgCu) Solder Ball Reflow Profile
Fax: 408.263.7846
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
www.calmicro.com
05/13/04
CM1415
Mechanical Details
CSP Mechanical Specifications CM1415 devices are packaged in a custom Chip Scale Package (CSP). Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B1 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min 1.405 1.365 0.495 0.245 0.430 0.430 0.175 0.220 0.600 0.394 Nom 1.450 1.410 0.500 0.250 0.435 0.435 0.225 0.270 0.670 0.445 Max 1.495 1.455 0.505 0.255 0.440 0.440 0.275 0.320 0.739 0.495 Min Custom CSP 8 Inches Nom Max 0.0553 0.0571 0.0589 0.0537 0.0555 0.0573 0.0195 0.0197 0.0199 0.0096 0.0098 0.0100 0.0169 0.0171 0.0173 0.0169 0.0171 0.0173 0.0069 0.0089 0.0108 0.0087 0.0106 0.0126 0.0236 0.0264 0.0291 0.0155 0.0175 0.0195 3500 pieces
C A2 B A 12345 C2
0.30 DIA. 63/37 Sn/Pb (Eutectic) or 95.5/3.8/0.7 Sn/Ag/Cu (Lead-free) SOLDER BUMPS
D1 D2
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Package Dimensions for CM1415 Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
POCKET SIZE (mm) B0 X A0 X K0 1.55 X 1.52 X 0.71
Po Top Cover Tape
PART NUMBER CM1415
CHIP SIZE (mm) 1.45 X 1.41 X 0.6
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches cumulative tolerance on tape 0.2 mm
Ao W Bo
Ko For tape feeder reference only including draft. Concentric around B.
Embossment
P1 User direction of feed
Center lines of cavity
Figure 7. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 05/13/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7

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