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| High-Frequency SPDT Switch CXG1199UR Description The CXG1199UR is a SPDT (Single Pole Dual Throw) switch and suitable for middle power wireless communication systems, for example, cellular phones, Bluetooth and WLAN. Low insertion loss is realized by the Sony JPHEMT process. (Applications: Cellular phones, Bluetooth and WLAN) Features Low insertion loss Package Small package: 12-pin UQFN (2.0mm x 2.0mm x 0.6mm (Max.)) Structure GaAs JPHEMT MMIC Absolute Maximum Ratings (Ta = 25C) Control voltage Operating temperature Vctl Topr 5 -35 to +85 -40 to +85 Storage temperature Tstg -65 to +150 V C C C (for general use) (for Bluetooth & WLAN) This IC is ESD sensitive device. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E05X11-PS CXG1199UR Block Diagram and Recommended Circuit RF1 GND CRF GND 6 5 4 GND 7 3 GND F1 RF2 CRF F3 8 F2 2 CRF F4 RF3 GND 9 1 GND 10 Cbypass (100pF) 11 12 Cbypass (100pF) Rctl (1k) Rctl (1k) CTLA GND CTLB When using this IC, the following external components are needed: Rctl: This resistor is for improving ESD performance. 1k is recommended. CRF: This capacitor is for RF decoupling and needed for all applications. Cbypass: This capacitor is for DC line filtering. 100pF is recommended. Truth Table CTLA L H CTLB H L ON Path RF1 - RF2 RF1 - RF3 F1 ON OFF F2 OFF ON F3 OFF ON F4 ON OFF DC Bias Condition (Ta = 25C) Item Vctl Vctl (H)*1 (H)*2 Min. 2.0 1.65 0 Typ. 2.8 1.8 -- Max. 3.6 1.95 0.4 Unit V V V Condition Pin = 15dBm Pin = 5dBm -- Vctl (L) *1 *2 General use Bluetooth & WLAN -2- CXG1199UR Electrical Characteristics 1. Electrical Characteristics for General Use (Ta = 25C) Item Symbol Path Condition 0.5 to 1.0GHz RF1 - RF2 Insertion loss IL RF1 - RF3 1.0 to 2.0GHz 2.0 to 2.5GHz 0.5 to 1.0GHz 1.0 to 2.0GHz 2.0 to 2.5GHz 0.5 to 1.0GHz RF1 - RF2 Isolation ISO. RF1 - RF3 1.0 to 2.0GHz 2.0 to 2.5GHz 0.5 to 1.0GHz 1.0 to 2.0GHz 2.0 to 2.5GHz 0.5 to 1.0GHz VSWR VSWR -- 1.0 to 2.0GHz 2.0 to 2.5GHz Control current Ictl -- Vctl = 2.8V Min. -- -- -- -- -- -- 25 25 20 25 25 20 -- -- -- -- Typ. 0.20 0.25 0.35 0.20 0.25 0.35 32 31 27 32 31 27 1.2 1.2 1.2 2 Max. 0.30 0.35 0.45 0.30 0.35 0.45 -- -- -- -- -- -- 1.5 1.5 1.5 6 Unit dB dB dB dB dB dB dB dB dB dB dB dB -- -- -- A Common condition: Pin = 15dBm, Vctl (H) = 2.8V, Vctl (L) = 0V, All RF ports are 50 terminated. 2. Electrical Characteristics for Bluetooth & WLAN (Ta = 25C) Item Insertion loss Symbol IL Path RF1 - RF2 RF1 - RF3 RF1 - RF2 RF1 - RF3 -- -- -- Condition 2.0 to 2.5GHz 2.0 to 2.5GHz 2.0 to 2.5GHz 2.0 to 2.5GHz 2.0 to 2.5GHz Vctl = 1.8V Min. -- -- 20 20 -- -- -- Typ. 0.35 0.35 27 27 1.2 1 0.1 Max. 0.50 0.50 -- -- 1.5 3 1 Unit dB dB dB dB -- A s Isolation VSWR Control current Switching speed ISO. VSWR Ictl TSW Common condition: Pin = 5dBm, Vctl (H) = 1.8V, Vctl (L) = 0V, All RF ports are 50 terminated. -3- CXG1199UR Package Outline (Unit: mm) 12PIN UQFN (PLASTIC) x4 0.1 2.0 0.55 0.05 0.4 0.1 0.6 9 10 7 6 2.0 0. S A-B C 4-R0.2 C B A 12 1 3 4 0.4 PIN 1 INDEX 0.18 0.07 0.25 0.05 M S A-B C 0.14 26 0.05 S S Solder Plating + 0.09 0.14 - 0.03 + 0.09 0.25 - 0.03 MAX0.02 SPEC. S TERMINAL SECTION Note:Cutting burr of lead are 0.05mm MAX. SONY CODE EIAJ CODE JEDEC CODE UQFN-12P-01 PACKAGE STRUCTURE PACKAGE MATERIAL LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.01g LEAD PLATING SPECIFICATIONS ITEM LEAD MATERIAL SOLDER COMPOSITION PLATING THICKNESS COPPER ALLOY Sn-Bi Bi:1-4wt% 5-18m -4- Sony Corporation |
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