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| 05158 LC0406FC3.3C thru Only One Name Means ProT ek'TionTM LC0406FC24C LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Available in Six Voltage Types Ranging From 3.3V to 24V 200 Watts Peak Pulse Power per Line (tp = 8/20s) Low Clamping Voltage Bidirectional Configuration & Monolithic Structure Protects 3 to 5 Lines LOW CAPACITANCE LOW LEAKAGE CURRENT MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0406 Weight 0.73 milligrams (Approximate) Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel Top Contacts: Solder Bump 0.004" in Height (Nominal) 0406 (Single Chip Shown) PIN CONFIGURA TION 05158.R3 8/03 1 www.protekdevices.com LC0406FC3.3C thru LC0406FC24C DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Peak Pulse Power (tp = 8/20s) - See Figure 1 Operating Temperature Storage Temperature SYMBOL PPP TJ TSTG VALUE 200 -55C to 150C -55C to 150C UNITS Watts C C ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM CLAMPING VOLTAGE (See Fig. 2) @ IP = 1A VC VOLTS 7.0 11.0 13.2 19.8 25.4 37.2 MAXIMUM CLAMPING VOLTAGE (See Fig. 2) MAXIMUM LEAKAGE CURRENT (See Note 2) @VWM ID A 75* 10** 1 1 1 1 TYPICAL CAPACITANCE V WM VOLTS LC0406FC3.3C LC0406FC05C LC0406FC08C LC0406FC12C LC0406FC15C LC0406FC24C 3.3 5.9 8.0 12.0 15.0 24.0 @ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 @8/20s VC @ IPP 12.5V @ 16A 13V @ 15A 18V @ 11A 26.9V @ 7.4A 34.5V @ 5.8A 50.6V @ 4A 0V @ 1 MHz C pF 70 35 32 30 25 20 Note 1: All devices are bidirectional. Electrical characteristics apply in both directions. Note 2: *Maximum leakage current < 5A @ 2.8V. **Maximum leakage current <500nA @ 3.3V. FIGURE 1 PEAK PULSE POWER VS PULSE TIME 10,000 IPP - Peak Pulse Current - % of IPP PPP - Peak Pulse Current - Watts 120 100 80 60 40 20 0 tf FIGURE 2 PULSE WAVE FORM Peak Value IPP TEST WAVEFORM PARAMETERS tf = 8s td = 20s 1,000 200W, 8/20s Waveform 100 e-t td = t I /2 PP 10 0.01 1 10 100 td - Pulse Duration - s 1,000 10,000 0 5 10 15 t - Time - s 20 25 30 05158.R3 8/03 2 www.protekdevices.com LC0406FC3.3C thru LC0406FC24C GRAPHS FIGURE 3 POWER DERATING CURVE Peak Pulse Power 8/20s 225C 5-10 sec 60 200C Instantaneous to 200C 100 80 % Of Rated Power FIGURE 4 REFLOW SOLDER PROFILE 40 20 Average Power 0 0 25 50 75 100 125 TL - Lead Temperature - C 150 Pre-Heat Time Soldering Time Cool Down Time 100C 1-2 Minutes to 150C 1-2 Minutes to 25C Note: This reflow profile does not take into account the printed circuit board (PCB) material heating time. Additional time may be required for the preheat time and cool down time upon the PCB or board material. FIGURE 5 OVERSHOOT & CLAMPING VOLTAGE FOR LC0406FC05C 35 5 Volts per Division 25 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 6 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR LC0406FC05C 14 12 10 8 6 4 2 0 0 5 10 IPP - Peak Pulse Current - Amps 05158.R3 8/03 3 www.protekdevices.com 15 20 VC - Clamping Voltage - Volts LC0406FC3.3C thru LC0406FC24C PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE PACKAGE DIMENSIONS DIM A B C MILLIMETERS 0.56 NOM 0.86 NOM 0.99 0.0254 0.15 SQ 1.5 0.0254 0.15 NOM 0.127 MAX 0.076 MIN I 0.406 NOM INCHES 0.022 NOM 0.034 NOM 0.039 0.001 0.006 SQ 0.059 0.001 0.006 NOM 0.005 MAX 0.003 MIN 0.016 NOM A B C TOP SIDE E F G H G E F H NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). END I MOUNTING PAD LA YOUT - Option 1 DIM C A D A C D E F G H I NOTE: PAD DIMENSIONS MILLIMETERS 0.51 0.30 0.46 0.20 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.012 0.018 0.008 0.006 SQ 0.028 0.039 0.020 DIE SOLDER BUMPS E H G 1. Preferred: Using 0.1mm (0.004") stencil. I SOLDER PADS SOLDER PRINT 0.010" - 0.012" DIA. SOLDER MASK F Outline & Dimensions: Rev 3 - 11/02, 06023 05158.R3 8/03 4 www.protekdevices.com LC0406FC3.3C thru LC0406FC24C PACKAGE OUTLINE & DIMENSIONS MOUNTING PAD LA YOUT - Option 2 PACKAGE DIMENSIONS DIM A MILLIMETERS 0.51 0.15 SQ 0.71 0.99 0.51 INCHES 0.020 0.006 SQ 0.028 0.039 0.020 COPPER CONTACTS 0.009" [0.23] DIA. A F G H I DIE SOLDER BUMPS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 3 - 11/02, 06023 H G I T APE & REEL ORIENT TION A SOLDER PRINT 0.014" [0.36] DIA. SOLDER MASK F Triple Die - 0406 NOTE: 1. Top view of tape. Solder bumps are face down in tape package. TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., LC0406FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., LC0406FC05C-T75-2). COPYRIGHT (c) ProTek Devices 2003 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05158.R3 8/03 5 www.protekdevices.com |
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