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| SA572 Programmable analog compandor Rev. 03 -- 3 November 1998 Product data 1. Description The SA572 is a dual-channel, high-performance gain control circuit in which either channel may be used for dynamic range compression or expansion. Each channel has a full-wave rectifier to detect the average value of input signal, a linearized, temperature-compensated variable gain cell (G) and a dynamic time constant buffer. The buffer permits independent control of dynamic attack and recovery time with minimum external components and improved low frequency gain control ripple distortion over previous compandors. The SA572 is intended for noise reduction in high-performance audio systems. It can also be used in a wide range of communication systems and video recording applications. 2. Features s s s s s s s s s Independent control of attack and recovery time Improved low frequency gain control ripple Complementary gain compression and expansion with external op amp Wide dynamic rangegreater than 110 dB Temperature-compensated gain control Low distortion gain cell Low noise6 V typical Wide supply voltage range6 to 22 V System level adjustable with external components c c 3. Applications s s s s s s s Dynamic noise reduction system Voltage control amplifier Stereo expandor Automatic level control High-level limiter Low-level noise gate State variable filter Philips Semiconductors SA572 Programmable analog compandor 4. Ordering information Table 1: Ordering information Package Name SA572D SA572N SO16 DIP16 Description plastic small outline package; 16 leads; body width 7.5 mm plastic dual in- line package; 16 leads (300 mil) Version SOT162-1 SOT38-4 Temperature range (C) -40 to +85 -40 to +85 Type number 5. Block diagram R1 (7,9) 6.8k (6,10) 500 GAIN CELL G (5,11) (1,15) (3,13) - + 270 10k RECTIFIER - + BUFFER 10k (16) P.S. (8) (4,12) (2,14) SR00695 Fig 1. Block diagram. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 2 of 22 Philips Semiconductors SA572 Programmable analog compandor 6. Pinning information 6.1 Pinning D, N, Packages TRACK TRIM A RECOV. CAP A 1 2 16 VCC TRACK TRIM B 15 RECT. IN A ATTACK CAP A 3 4 14 RECOV. CAP B RECT. IN B ATTACK CAP B 13 ,G OUT A THD TRIM A 5 6 12 11 ,G OUT B THD TRIM B ,G IN A GND 7 8 10 9 ,G IN B 54$'" (1) D package released in large SO (SOL) package only. Fig 2. Pin configuration. 6.2 Pin description Table 2: Symbol Pin description Pin Description Track trim A Recovery time capacitor A Full-wave rectifier input A Attack capacitor A Linearized temperature-compensated, gain cell OUT A THD trim terminal A Linearized temperature-compensated gain cell IN A Ground Linearized temperature-compensated gain cell IN B THD trim terminal B Linearized temperature-compensated gain cell OUT B Attack capacitor B Full-wave rectifier input B Recovery time capacitor B Track trim B Supply voltage TRACK TRIM A 1 RECOV. CAP A 2 RECT. IN A G OUT A THD TRIM A G IN A GND G IN B THD TRIM B G OUT B RECT. IN B 3 5 6 7 8 9 10 11 13 ATTACK CAP A 4 ATTACK CAP B 12 RECOV. CAP B 14 TRACK TRIM B 15 VCC 16 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 3 of 22 Philips Semiconductors SA572 Programmable analog compandor 7. Functional description 7.1 Audio signal processing IC combines VCA and fast attack/slow recovery level sensor In high-performance audio gain control applications, it is desirable to independently control the attack and recovery time of the gain control signal. This is true, for example, in compandor applications for noise reduction. In high end systems the input signal is usually split into two or more frequency bands to optimize the dynamic behavior for each band. This reduces low frequency distortion due to control signal ripple, phase distortion, high frequency channel overload and noise modulation. Because of the expense in hardware, multiple band signal processing up to now was limited to professional audio applications. With the introduction of the Philips SA572 this high-performance noise reduction concept becomes feasible for consumer hi fi applications. The SA572 is a dual channel gain control IC. Each channel has a linearized, temperature-compensated gain cell and an improved level sensor. In conjunction with an external low noise op amp for current-to-voltage conversion, the VCA features low distortion, low noise and wide dynamic range. The novel level sensor which provides gain control current for the VCA gives lower gain control ripple and independent control of fast attack, slow recovery dynamic response. An attack capacitor CA with an internal 10 k resistor RA defines the attack time tA. The recovery time tR of a tone burst is defined by a recovery capacitor CR and an internal 10 k resistor RR. Typical attack time of 4 ms for the high-frequency spectrum and 40ms for the low frequency band can be obtained with 0.1 F and 1.0 F attack capacitors, respectively. Recovery time of 200 ms can be obtained with a 4.7 F recovery capacitor for a 100 Hz signal, the third harmonic distortion is improved by more than 10 dB over the simple RC ripple filter with a single 1.0 F attack and recovery capacitor, while the attack time remains the same. The SA572 is assembled in a standard 16-pin dual in-line plastic package and in oversized SOL package. It operates over a wide supply range from 6 V to 22 V. Supply current is less than 6 mA. The SA572 is designed for applications from -40 C to +85 C. 8. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Tamb PD Parameter supply voltage operating temperature range power dissipation Conditions Min - -40 - Max 22 +85 500 Unit VDC C mW 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 4 of 22 Philips Semiconductors SA572 Programmable analog compandor 9. Static characteristics Table 4: DC electrical characteristics Standard test conditions (unless otherwise noted) VCC = 15 V, Tamb = 25 C; Expandor mode (see Section 10 "Test circuit"). Input signals at unity gain level (0 dB) = 100 mVRMS at 1 kHz; V1 = V2; R2 = 3.3 k; R3 = 17.3 k. Symbol Parameter VCC ICC VR THD THD THD supply voltage supply current internal voltage reference total harmonic distortion (untrimmed) total harmonic distortion (trimmed) total harmonic distortion (trimmed) no signal output noise DC level shift (untrimmed) unity gain level large-signal distortion tracking error (measured relative to value at unity gain) = [VO-VO (unity gain)]dB -V2dB channel crosstalk PSRR power supply rejection ratio V1 = V2 = 400 mV Rectifier input V2 = +6 dB V1 = 0 dB V2 = -30 dB V1 = 0 dB 200 mVRMS into channel A, measured output on channel B 120 Hz - - 60 - 0.2 0.5 - 70 - -2.5, +1.6 - - dB dB dB dB 1 kHz CA = 1.0 F 1 kHz CR = 10 F 100 Hz Input to V1 and V2 grounded (20-20 kHz) Input change from no signal to 100 mVRMS No signal Test conditions Min 6 - 2.3 - - - - - -1.5 - Typ - - 2.5 0.2 0.05 0.25 6 20 0 0.7 Max 22 6.3 2.7 1.0 - - 25 50 +1.5 3 Unit VDC mA VDC % % % V mV dB % 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 5 of 22 Philips Semiconductors SA572 Programmable analog compandor 10. Test circuit 1F 22F 2.2F V1 (7,9) 6.8k G (5,11) 82k 1% R3 17.3k + 100 -15V - 5 = 10F BUFFER 1k (4,12) (8) + 2.2F (2,14) 2.2k (6,10) + 270pF NE5234 V0 (1,15) 2.2F V2 R2 1% 3.3k (3,13) RECTIFIER (16) + 0.1F 22F +15V SR00696 Fig 3. Test circuit. 11. Application information 11.1 SA572 Basic applications 11.1.1 Description The SA572 consists of two linearized, temperature-compensated gain cells (G), each with a full-wave rectifier and a buffer amplifier as shown in the block diagram. The two channels share a 2.5 V common bias reference derived from the power supply but otherwise operate independently. Because of inherent low distortion, low noise and the capability to linearize large signals, a wide dynamic range can be obtained. The buffer amplifiers are provided to permit control of attack time and recovery time independent of each other. Partitioned as shown in the block diagram, the IC allows flexibility in the design of system levels that optimize DC shift, ripple distortion, tracking accuracy and noise floor for a wide range of application requirements. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 6 of 22 Philips Semiconductors SA572 Programmable analog compandor 11.1.2 Gain cell Figure 4 shows the circuit configuration of the gain cell. Bases of the differential pairs Q1-Q2 and Q3-Q4 are both tied to the output and inputs of OPA A1. The negative feedback through Q1 holds the VBE of Q1-Q2 and the VBE of Q3-Q4 equal. The following relationship can be derived from the transistor model equation in the forward active region. V BE Q3Q4 = BE Q1Q2 (1) ( V BE = V T I IN I C IS ) 1 1 -- I G + -- I O 2 2 ------------------------ - V I VT In Tn IS V IN where I IN = -------R1 R1 = 6.8 k I1 = 140 A I2 = 280 A IO is the differential output current of the gain cell and IG is the gain control current of the gain cell. If all transistors Q1 through Q4 are of the same size, Equation 2 can be simplified to: 2 1 I O = ---- x I IN x I G - ---- ( I 2 - 2I 1 ) x I G I2 I2 (3) 1 1 -- I G - -- I O 2 2 ----------------------- = V I Tn IS I 1 + I IN - V I -----------------Tn IS I 2 - I 1 - I IN -------------------------- IS (2) The first term of Equation 3 shows the multiplier relationship of a linearized two quadrant transconductance amplifier. The second term is the gain control feedthrough due to the mismatch of devices. In the design, this has been minimized by large matched devices and careful layout. Offset voltage is caused by the device mismatch and it leads to even harmonic distortion. The offset voltage can be trimmed out by feeding a current source within 25 A into the THD trim pin. The residual distortion is third harmonic distortion and is caused by gain control ripple. In a compandor system, available control of fast attack and slow recovery improve ripple distortion significantly. At the unity gain level of 100 mV, the gain cell gives THD (total harmonic distortion) of 0.17% typ. Output noise with no input signals is only 6 V in the audio spectrum (10 Hz to 20 kHz). The output current IO must feed the virtual ground input of an operational amplifier with a resistor from output to inverting input. The non-inverting input of the operational amplifier has to be biased at VREF if the output current IO is DC coupled. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 7 of 22 Philips Semiconductors SA572 Programmable analog compandor V+ 1/ I + 1/ I 2G 2O I1 140 A IO + Q3 A1 - Q2 Q4 Q1 R1 6.8 k IG THD TRIM VREF I2 280 A VIN SR00697 Fig 4. Basic gain cell schematic. 11.1.3 Rectifier The rectifier is a full-wave design as shown in Figure 5. The input voltage is converted to current through the input resistor R2 and turns on either Q5 or Q6 depending on the signal polarity. Deadband of the voltage to current converter is reduced by the loop gain of the gain block A2. If AC coupling is used, the rectifier error comes only from input bias current of gain block A2. The input bias current is typically about 70 nA. Frequency response of the gain block A2 also causes second-order error at high frequency. The collector current of Q6 is mirrored and summed at the collector of Q5 to form the full wave rectified output current IR. The rectifier transfer function is V IN - V REF I R = ---------------------------R2 V IN ( AVG ) If VIN is AC-coupled, then the equation will be reduced to: I RAC = -------------------------R2 The internal bias scheme limits the maximum output current IR to be around 300 A. Within a 1 dB error band the input range of the rectifier is about 52 dB. (4) 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 8 of 22 Philips Semiconductors SA572 Programmable analog compandor V+ IR = VIN - V REF R2 VREF + A2 - Q5 D7 Q6 R2 VIN SR00698 Fig 5. Simplified rectifier schematic. 11.1.4 Buffer amplifier In audio systems, it is desirable to have fast attack time and slow recovery time for a tone burst input. The fast attack time reduces transient channel overload but also causes low-frequency ripple distortion. The low-frequency ripple distortion can be improved with the slow recovery time. If different attack times are implemented in corresponding frequency spectrums in a split band audio system, high quality performance can be achieved. The buffer amplifier is designed to make this feature available with minimum external components. Referring to Figure 6, the rectifier output current is mirrored into the input and output of the unipolar buffer amplifier A3 through Q8, Q9 and Q10. Diodes D11 and D12 improve tracking accuracy and provide common-mode bias for A3. For a positive-going input signal, the buffer amplifier acts like a voltage-follower. Therefore, the output impedance of A3 makes the contribution of capacitor CR to attack time insignificant. Neglecting diode impedance, the gain Ga(t) for G can be expressed as follows: -t ----A Ga(t) = ( Ga INT - Ga FNL ) e GaINT = Initial Gain GaFNL = Final Gain + Ga FNL (5) A = RA x CA = 10 k x CA 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 9 of 22 Philips Semiconductors SA572 Programmable analog compandor where A is the attack time constant and RA is a 10k internal resistor. Diode D15 opens the feedback loop of A3 for a negative-going signal if the value of capacitor CR is larger than capacitor CA. The recovery time depends only on CR x RR. If the diode impedance is assumed negligible, the dynamic gain GR (t) for G is expressed as follows. -t ----R G R (t) = ( G RINT - G RFNL )e + G RFNL (6) R = R R x CR = 10k x CR where R is the recovery time constant and RR is a 10 k internal resistor. The gain control current is mirrored to the gain cell through Q14. The low level gain errors due to input bias current of A2 and A3 can be trimmed through the tracking trim pin into A3 with a current source of 3 A. V+ Q8 Q9 Q10 IQ Q17 = 2IR2 IR2 X2 Q16 IR = VIN R - A3 + 10k IR1 D15 D13 10k Q14 X2 Q18 D11 D12 CR CA TRACKING TRIM SR00699 Fig 6. Buffer amplifier schematic. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 10 of 22 Philips Semiconductors SA572 Programmable analog compandor 11.1.5 Basic expandor Figure 7 shows an application of the circuit as a simple expandor. The gain expression of the system is given by V OUT 2 R 3 x V IN ( AVG ) ------------ = ---- x ---------------------------------I1 R2 x R1 V IN (I1 = 140A) Both the resistors R1 and R2 are tied to internal summing nodes. R1 is a 6.8 k internal resistor. The maximum input current into the gain cell can be as large as 140 mA. This corresponds to a voltage level of 140 A x 6.8k = 952 mV peak. The input peak current into the rectifier is limited to 300 A by the internal bias system. Note that the value of R1 can be increased to accommodate higher input level. R2 and R3 are external resistors. It is easy to adjust the ratio of R3/R2 for desirable system voltage and current levels. A small R2 results in higher gain control current and smaller static and dynamic tracking error. However, an impedance buffer A1 may be necessary if the input is voltage drive with large source impedance. The gain cell output current feeds the summing node of the external OPA A2. R3 and A2 convert the gain cell output current to the output voltage. In high-performance applications, A2 has to be low-noise, high-speed and wide band so that the high-performance output of the gain cell will not be degraded. The non-inverting input of A2 can be biased at the low noise internal reference Pin 6 or 10. Resistor R4 is used to bias up the output DC level of A2 for maximum swing. The output DC level of A2 is given by R3 R3 V ODC = V REF 1 + ----- - V B ---- R 4 R4 (8) (7) VB can be tied to a regulated power supply for a dual supply system and be grounded for a single supply system. CA sets the attack time constant and CR sets the recovery time constant. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 11 of 22 Philips Semiconductors SA572 Programmable analog compandor R4 +VB R3 17.3k - CIN1 VIN 2.2F + A1 CIN2 (7,9) R1 6.8k G (5,11) A2 (6,10) R6 VREF 1k (2,14) VOUT R5 100k BUFFER CIN3 2.2F R2 3.3k (3,13) (4,12) C1 2.2F CA 1F CR 10F (8) (16) +VCC SR00700 Fig 7. Basic expandor schematic. 11.1.6 Basic compressor Figure 8 shows the hook-up of the circuit as a compressor. The IC is put in the feedback loop of the OPA A1. The system gain expression is as follows: V OUT ------------ = V IN R2 x R1 I1 ---- x ------------------------------- 2 R 3 x V IN(AVG) (9) RDC1, RDC2, and CDC form a DC feedback for A1. The output DC level of A1 is given by R DC1 + R DC2 R DC1 + R DC2 V ODC = V REF 1 + ------------------------------- - V B x -------------------------------- - R4 R4 The zener diodes D1 and D2 are used for channel overload protection. (10) 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 12 of 22 Philips Semiconductors SA572 Programmable analog compandor R4 RDC1 9.1k CDC 10F C2 .1F RDC2 9.1k CIN1 VIN 2.2F - R3 17.3k + C1 1k R5 (6,10) VREF A1 D1 D2 VOUT G R1 6.8k (7,9) CIN2 2.2F (5,11) (2,14) (4,12) BUFFER CIN3 2.2F 3.3k R2 CR 10F CA 1F (8) VCC (16) (3,13) SR00701 Fig 8. Basic compressor schematic. 11.1.7 Basic compandor system The above basic compressor and expandor can be applied to systems such as tape/disc noise reduction, digital audio, bucket brigade delay lines. Additional system design techniques such as bandlimiting, band splitting, pre-emphasis, de-emphasis and equalization are easy to incorporate. The IC is a versatile functional block to achieve a high performance audio system. Figure 9 shows the system level diagram for reference. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 13 of 22 Philips Semiconductors SA572 Programmable analog compandor 1 2 VRMS COMPRESSION IN INPUT TO G AND RECT 2 REL LEVEL EXPANDOR OUT +29.54 dB ABS LEVEL dBM 3.0V +11.76 547.6MV 400MV +14.77 +12.0 -3.00 -5.78 100MV 0.0 -17.78 10MV -20 -37.78 1MV -40 -57.78 100V -60 -77.78 10V -80 -97.78 SR00702 Fig 9. SA572 system level. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 14 of 22 Philips Semiconductors SA572 Programmable analog compandor 12. Package outline SO16: plastic small outline package; 16 leads; body width 7.5 mm SOT162-1 D E A X c y HE vMA Z 16 9 Q A2 A1 pin 1 index Lp L 1 e bp 8 wM detail X (A 3) A 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 10.5 10.1 0.41 0.40 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.9 0.4 0.035 0.016 0.012 0.096 0.004 0.089 0.019 0.013 0.014 0.009 0.419 0.043 0.055 0.394 0.016 8o 0o Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT162-1 REFERENCES IEC 075E03 JEDEC MS-013 EIAJ EUROPEAN PROJECTION ISSUE DATE 97-05-22 99-12-27 Fig 10. SOT162-1. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 15 of 22 Philips Semiconductors SA572 Programmable analog compandor DIP16: plastic dual in-line package; 16 leads (300 mil) SOT38-4 D seating plane ME A2 A L A1 c Z e b1 b 16 9 b2 MH wM (e 1) pin 1 index E 1 8 0 5 scale 10 mm DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.2 0.17 A1 min. 0.51 0.020 A2 max. 3.2 0.13 b 1.73 1.30 0.068 0.051 b1 0.53 0.38 0.021 0.015 b2 1.25 0.85 0.049 0.033 c 0.36 0.23 0.014 0.009 D (1) 19.50 18.55 0.77 0.73 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.60 3.05 0.14 0.12 ME 8.25 7.80 0.32 0.31 MH 10.0 8.3 0.39 0.33 w 0.254 0.01 Z (1) max. 0.76 0.030 Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-4 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 92-11-17 95-01-14 Fig 11. SOT38-4. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 16 of 22 Philips Semiconductors SA572 Programmable analog compandor 13. Soldering 13.1 Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. 13.2 Surface mount packages 13.2.1 Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. 13.2.2 Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 17 of 22 Philips Semiconductors SA572 Programmable analog compandor * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 13.2.3 Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 13.3 Through-hole mount packages 13.3.1 Soldering by dipping or by solder wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13.3.2 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 18 of 22 Philips Semiconductors SA572 Programmable analog compandor 13.4 Package related soldering information Table 5: Mounting Through-hole mount Surface mount Suitability of IC packages for wave, reflow and dipping soldering methods Package Soldering method Wave DBS, DIP, HDIP, SDIP, SIL suitable [2] BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC [4], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO [1] Reflow [1] Dipping - suitable suitable suitable - - not suitable not suitable [3] suitable not not recommended [4] [5] recommended [6] suitable suitable suitable - - - [2] [3] [4] [5] [6] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 14. Revision history Table 6: 03 Revision history CPCN 853-0813 20294 Description Product specification; third version; supersedes second version SA572_2 of 1998 Nov 03 (9397 750 04749). Modifications: The format of this specification has been redesigned to comply with Philips Semiconductors' new presentation and information standard. 02 19981103 853-0813 20294 Product specification; second version; supersedes first version SA572_1 of 1987 Oct 07. Modifications: Changed prefix from NE to SA. 01 19871007 853-0813 90829 Product specification; initial version. Rev Date 19981103 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 19 of 22 Philips Semiconductors SA572 Programmable analog compandor 15. Data sheet status Data sheet status [1] Objective data Preliminary data Product status [2] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Product data Production [1] [2] Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 16. Definitions Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 17. Disclaimers Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 9397 750 07761 (c) Philips Electronics N.V. 2001 All rights reserved. Product data Rev. 03 -- 3 November 1998 20 of 22 Philips Semiconductors SA572 Programmable analog compandor Philips Semiconductors - a worldwide company Argentina: see South America Australia: Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Tel. +43 160 101, Fax. +43 160 101 1210 Belarus: Tel. +375 17 220 0733, Fax. +375 17 220 0773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Tel. +359 268 9211, Fax. +359 268 9102 Canada: Tel. +1 800 234 7381 China/Hong Kong: Tel. +852 2 319 7888, Fax. +852 2 319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Tel. +45 3 288 2636, Fax. +45 3 157 0044 Finland: Tel. +358 961 5800, Fax. +358 96 158 0920 France: Tel. +33 1 4728 6600, Fax. +33 1 4728 6638 Germany: Tel. +49 40 23 5360, Fax. +49 402 353 6300 Hungary: Tel. +36 1 382 1700, Fax. +36 1 382 1800 India: Tel. +91 22 493 8541, Fax. +91 22 493 8722 Indonesia: see Singapore Ireland: Tel. +353 17 64 0000, Fax. +353 17 64 0200 Israel: Tel. +972 36 45 0444, Fax. +972 36 49 1007 Italy: Tel. +39 039 203 6838, Fax +39 039 203 6800 Japan: Tel. +81 33 740 5130, Fax. +81 3 3740 5057 Korea: Tel. +82 27 09 1412, Fax. +82 27 09 1415 Malaysia: Tel. +60 37 50 5214, Fax. +60 37 57 4880 Mexico: Tel. +9-5 800 234 7381 Middle East: see Italy Netherlands: Tel. +31 40 278 2785, Fax. +31 40 278 8399 New Zealand: Tel. +64 98 49 4160, Fax. +64 98 49 7811 Norway: Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Tel. +63 28 16 6380, Fax. +63 28 17 3474 Poland: Tel. +48 22 5710 000, Fax. +48 22 5710 001 Portugal: see Spain Romania: see Italy Russia: Tel. +7 095 755 6918, Fax. +7 095 755 6919 Singapore: Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: Tel. +27 11 471 5401, Fax. +27 11 471 5398 South America: Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Tel. +34 33 01 6312, Fax. +34 33 01 4107 Sweden: Tel. +46 86 32 2000, Fax. +46 86 32 2745 Switzerland: Tel. +41 14 88 2686, Fax. +41 14 81 7730 Taiwan: Tel. +886 22 134 2451, Fax. +886 22 134 2874 Thailand: Tel. +66 23 61 7910, Fax. +66 23 98 3447 Turkey: Tel. +90 216 522 1500, Fax. +90 216 522 1813 Ukraine: Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Tel. +44 208 730 5000, Fax. +44 208 754 8421 United States: Tel. +1 800 234 7381 Uruguay: see South America Vietnam: see Singapore Yugoslavia: Tel. +381 11 3341 299, Fax. +381 11 3342 553 For all other countries apply to: Philips Semiconductors, Marketing Communications, Building BE, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 272 4825 Internet: http://www.semiconductors.philips.com (SCA72) 9397 750 07761 (c) Philips Electronics N.V. 2001. All rights reserved. Product data Rev. 03 -- 3 November 1998 21 of 22 Philips Semiconductors SA572 Programmable analog compandor Contents 1 2 3 4 5 6 6.1 6.2 7 7.1 8 9 10 11 11.1 11.1.1 11.1.2 11.1.3 11.1.4 11.1.5 11.1.6 11.1.7 12 13 13.1 13.2 13.2.1 13.2.2 13.2.3 13.3 13.3.1 13.3.2 13.4 14 15 16 17 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Audio signal processing IC combines VCA and fast attack/slow recovery level sensor . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 6 SA572 Basic applications . . . . . . . . . . . . . . . . . 6 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Gain cell . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Rectifier. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Buffer amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 9 Basic expandor . . . . . . . . . . . . . . . . . . . . . . . . 11 Basic compressor . . . . . . . . . . . . . . . . . . . . . . 12 Basic compandor system . . . . . . . . . . . . . . . . 13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Surface mount packages . . . . . . . . . . . . . . . . 17 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 17 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18 Through-hole mount packages . . . . . . . . . . . . 18 Soldering by dipping or by solder wave . . . . . 18 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18 Package related soldering information . . . . . . 19 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 (c) Philips Electronics N.V. 2001. Printed in the U.S.A All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 3 November 1998 Document order number: 9397 750 07761 |
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