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 Data sheet acquired from Cypress Semiconductor Corporation. Data sheet modified to remove devices not offered.
CY74FCT2541T
SCCS041A - September 1994 - Revised June 2000
8-Bit Buffer/Line Driver
* Extended commercial temp. range of -40C to +85C * Three-state outputs
Features
* Function and pinout compatible with FCT and F logic * FCT-C speed at 4.1 ns max. FCT-A speed at 4.8 ns max. * 25 output series to reduce transmission line reflection noise * Reduced VOH (typically = 3.3V) versions of equivalent FCT functions * Edge-rate control circuitry for significantly improved noise characteristics * Power-off disable feature * ESD > 2000V * Matched rise and fall times * Fully compatible with TTL input and output logic levels * Sink current 12 mA Source current 15 mA
Functional Description
The FCT2541T is an octal buffer and line driver designed to be employed as a memory address driver, clock driver, and bus-oriented transmitter/receiver. On-chip termination resistors have been added to the outputs to reduce system noise caused by reflections. The FCT2541T can be used to replace the FCT541T to reduce noise in an existing design. The speed of the FCT2541T is comparable to bipolar logic counterparts while reducing power dissipation. The input and output voltage levels allow direct interface with TTL and CMOS devices without external components. The outputs are designed with a power-off disable feature to allow for live insertion of boards.
Logic Block Diagram
OEA OE B
Pin Configurations
SOIC/QSOP Top View
OEA D0 D1 D2 D3 D4 D5 D6 D7 GND 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 VCC OE B O0 O1 O2 O3 O4 O5 O6 O7
D0 D1 D2 D3 D4 D5 D6 D7
O0 O1 O2 O3 O4 O5 O6 O7 FCT2541T-3
FCT2541T-2
]
Function Table[1]
Inputs OEA L L H OEB L L H D L H X Output L H Z
Note: 1. H = HIGH Voltage Level L = LOW Voltage Level X = Don't Care Z = High Impedance
Copyright
(c) 2000, Texas Instruments Incorporated
CY74FCT2541T
Maximum Ratings[2,3]
(Above which the useful life may be impaired. For user guidelines, not tested.) Storage Temperature ..................................... -65C to +150C Ambient Temperature with Power Applied .................................................. -65C to +135C Supply Voltage to Ground Potential..................-0.5V to +7.0V DC Input Voltage .................................................-0.5V to +7.0V DC Output Voltage ..............................................-0.5V to +7.0V DC Output Current (Maximum Sink Current/Pin) ...... 120 mA Power Dissipation .......................................................... 0.5W Static Discharge Voltage............................................>2001V (per MIL-STD-883, Method 3015)
Operating Range
Range Commercial Ambient Temperature -40C to +85C VCC 5V 5%
Electrical Characteristics Over the Operating Range
Parameter VOH VOL ROUT VIH VIL VH VIK II IIH IIL IOZH IOZL IOS IOFF Description Output HIGH Voltage Output LOW Voltage Output Resistance Input HIGH Voltage Input LOW Voltage Hysteresis[6] Input Clamp Diode Voltage Input HIGH Current Input HIGH Current Input LOW Current Off State HIGH-Level Output Current Off State LOW-Level Output Current Output Short Circuit Current[7] Power-Off Disable All inputs VCC = Min., IIN = -18 mA VCC = Max., VIN = VCC VCC = Max., VIN = 2.7V VCC = Max., VIN = 0.5V VCC = Max., VOUT = 2.7V VCC = Max., VOUT = 0.5V VCC = Max., VOUT = 0.0V VCC = 0V, VOUT = 4.5V -60 -120 0.2 -0.7 -1.2 5 1 1 15 -15 -225 1 Test Conditions VCC = Min., IOH = -15 mA VCC = Min., IOL = 12 mA VCC = Min., IOL = 12 mA 20 2.0 0.8 Min. 2.4 Typ.[5] 3.3 0.3 25 0.55 40 Max. Unit V V V V V V A A A A A mA A
Capacitance[6]
Parameter CIN COUT Input Capacitance Output Capacitance Description Typ.[5] 5 9 Max. 10 12 Unit pF pF
Notes: 2. Unless otherwise noted, these limits are over the operating free-air temperature range. 3. Unused inputs must always be connected to an appropriate logic voltage level, preferably either VCC or ground. 4. TA is the "instant on" case temperature. 5. Typical values are at VCC=5.0V, TA=+25C ambient. 6. This parameter is specified but not tested. 7. Not more than one output should be shorted at a time. Duration of short should not exceed one second. The use of high-speed test apparatus and/or sample and hold techniques are preferable in order to minimize internal chip heating and more accurately reflect operational values. Otherwise prolonged shorting of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parametric tests. In any sequence of parameter tests, IOS tests should be performed last.
2
CY74FCT2541T
Power Supply Characteristics
Parameter ICC ICC ICCD Description Quiescent Power Supply Current Quiescent Power Supply Current (TTL inputs) Dynamic Power Supply Current[9] Test Conditions VCC=Max., VIN0.2V, VINVCC-0.2V VCC=Max., VIN=3.4V,[8] f1=0, Outputs Open VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling, OEA=OEB=GND, VIN0.2V or VINVCC-0.2V VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OEA=OEB=GND, VIN0.2V or VINVCC-0.2V VCC=Max., 50% Duty Cycle, Outputs Open, One Bit Toggling at f1=10 MHz, OEA=OEB=GND, VIN=3.4V or VIN=GND VCC=Max., 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f1=2.5 MHz, OEA=OEB=GND, VIN0.2V or VINVCC-0.2V VCC=Max., 50% Duty Cycle, Outputs Open, Eight Bits Toggling at f1=2.5 MHz, OEA=OEB=GND, VIN=3.4V or VIN=GND Typ.[5] 0.1 0.5 0.06 Max. 0.2 2.0 0.12 Unit mA mA mA/ MHz
IC
Total Power Supply Current[10]
0.7
1.4
mA
1.0
2.4
mA
1.3
2.6[11]
mA
3.3
10.6[11]
mA
Switching Characteristics Over the Operating Range[12]
CY74FCT2541T Parameter tPLH tPHL tPZH tPZL tPHZ tPLZ Description Propagation Delay Data to Output Output Enable Time Output Disable Time Min. 1.5 1.5 1.5 Max. 8.0 10.0 9.5 CY74FCT2541AT Min. 1.5 1.5 1.5 Max. 4.8 6.2 5.6 CY74FCT2541CT Min. 1.5 1.5 1.5 Max. 4.1 5.8 5.2 ns ns ns 1, 3 1, 7, 8 1, 7, 8 Unit Fig. No.[13]
Notes: 8. Per TTL driven input (VIN=3.4V); all other inputs at VCC or GND. 9. This parameter is not directly testable, but is derived for use in Total Power Supply calculations. = IQUIESCENT + IINPUTS + IDYNAMIC 10. IC IC = ICC+ICCDHNT+ICCD(f0/2 + f1N1) ICC = Quiescent Current with CMOS input levels ICC = Power Supply Current for a TTL HIGH input (VIN=3.4V) = Duty Cycle for TTL inputs HIGH DH = Number of TTL inputs at DH NT ICCD = Dynamic Current caused by an input transition pair (HLH or LHL) = Clock frequency for registered devices, otherwise zero f0 = Input signal frequency f1 = Number of inputs changing at f1 N1 All currents are in milliamps and all frequencies are in megahertz. 11. Values for these conditions are examples of the ICC formula. These limits are specified but not tested. 12. Minimum limits are specified but not tested on Propagation Delays. 13. See "Parameter Measurement Information" in the General Information section.
3
CY74FCT2541T
Ordering Information
Speed (ns) 4.1 4.8 8.0 Ordering Code CY74FCT2541CTQCT CY74FCT2541CTSOC/SOCT CY74FCT2541ATQCT CY74FCT2541ATSOC/SOCT CY74FCT2541TQCT CY74FCT2541TSOC/SOCT Document #: 38-00342-A Package Name Q5 S5 Q5 S5 Q5 S5 Package Type 20-Lead (150-Mil) QSOP 20-Lead (300-Mil) Molded SOIC 20-Lead (150-Mil) QSOP 20-Lead (300-Mil) Molded SOIC 20-Lead (150-Mil) QSOP 20-Lead (300-Mil) Molded SOIC Commercial Commercial Operating Range Commercial
4
CY74FCT2541T
Package Diagrams
20-Lead Quarter Size Outline Q5
20-Lead (300-Mil) Molded SOIC S5
5
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright (c) 2000, Texas Instruments Incorporated


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