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 TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
D D D D D
1.25 Gigabits Per Second (Gbps) Gigabit Ethernet Transceiver Based On the P802.3Z Specification Transmits Serial Data Up to 1.25 Gbps Operates With 3.3-V Supply Voltage 5-V Tolerant on TTL Inputs
D D D D D
Interfaces to Electrical Cables/Backplane or with Optical Modules PECL Voltage Differential Signaling Load, 1 V Typ with 50 - 75 Receiver Differential Input Voltage 200 mV Minimum Low Power Consumption 64-Pin Quad Flat Pack With Thermally Enhanced Package
description
The TNETE2201 Gigabit Ethernet transceiver provides for ultra high-speed bidirectional point-to-point data transmission. This device is based on the timing requirements of the proposed 10-bit interface specification by the P802.3z Gigabit Task Force.
PHD OR PJD PACKAGE (TOP VIEW)
GND_A VCC _A DOUT_TXP DOUT_TXN VCC _A VCC _A GND_CMOS VCC _A GND_A VCC _A DIN_RXP VCC _A DIN_RXN GND_RX GND_CMOS TD0 TD1 TD2 VCC_CMOS TD3 TD4 TD5 TD6 VCC_CMOS TD7 TD8 TD9 GND_CMOS GND_TX TC1
1 2 3 4 5 6 7 8 9
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34
VCC _RX RC1 RC0 SYNC GND_TTL RD0 RD1 RD2 VCC_TTL RD3 RD4 RD5 RD6 VCC_TTL RD7 RD8 RD9 GND_TTL
Copyright (c) 1999, Texas Instruments Incorporated
10 11 12 13 14 15
33 16 1718 19 20 21 22 23 24 25 26 27 28 29 30 31 32
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
TC0 VCC _TX LOOPEN VCC _A GND_A REFCLK VCC _CMOS SYNCEN GND_CMOS RESERVED LCKREFN VCC _A VCC _A RBC1 RBC0 GND_A
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
description (continued)
The intended application of this device is to provide building blocks for developing point-to-point baseband data transmission over controlled-impedance media of approximately 50 to 75 . The transmission media can be printed-circuit board traces, back planes, cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment. The TNETE2201 performs the data serialization and deserialization (SERDES) functions for the gigabit ethernet physical layer interface. The transceiver operates at 1.25 Gbps (typical), providing up to 1000 Mbps of bandwidth over a copper or optical media interface. The serializer/transmitter accepts 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially nonreturn-to-zero (NRZ) at pseudo-ECL (PECL) voltage levels. The deserializer/receiver extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte. The 10-bit data bytes are output with respect to two receive byte clocks (RBC0, RBC1) allowing a protocol device to clock the parallel bytes in RBC clock rising edges. The transceiver automatically locks onto incoming data without the need to prelock. However, the transceiver can be commanded to lock to the externally supplied reference clock (REFCLK) as a reset function, if needed. The TNETE2201 provides an internal loopback capability for self-test purposes. Serial data from the serializer is passed directly to the deserializer allowing the protocol device a functional self-check of the physical interface. The TNETE2201 is characterized for operation from 0C to 70C.
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
functional block diagram
LOOPEN TX+ TX- TD0 - TD9 10 / 10-Bit Register 10 / Shift Register
REFCLK 125 MHz
Clock Multiplier
SYNCEN SYNC
Synchronous Detect
RD0 - RD9
10 /
10-Bit Register
10 /
Shift Register
62.5 MHz RBC0 RBC1 62.5 MHz /2 125 MHz PLL Clock Recovery and Data Retiming 2:1 MUX RX+ RX-
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
I/O structures
PECL inputs (DIN_RXP, DIN_RXN)
VDD 100 DIN_RXP 4 k VCM 4 k DIN_RXN DOUT_TXN + _ VDD DOUT_TXP
PECL outputs (DIN_TXP, DIN_TXN)
VDD
VDD
CMOS inputs (TD0 - TD9, LOOPEN, REFCLK, SYNCEN, LCKREFN)
VDD VDD P R1 120 Input R2 TERMINALS REFCLK, TD0 - TD9 LOOPEN SYNCEN, LCKREFN N R1 R2
Open Circuit Open Circuit Open Circuit 400 k 400 k Open Circuit
CMOS outputs (RD0 - RD9, RBC0, RBC1, SYNC)
VDD P
Output
N
4
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
Terminal Functions
TERMINAL NAME DOUT_TXP DOUT_TXN NO. 62 61 TYPE I/O and DATA Output Differential output transmit. DOUT_TXP and DOUT_TXN are differential serial outputs that interface to a copper or an optical I/F module. These terminals transmit NRZ data at a rate of 1.25 Gbps. DOUT_TXP and DOUT_TXN are held static when LOOPEN is high and are active when LOOPEN is low . Differential input receive. DIN_RXP and DIN_RXN together are the differential serial input interface from a copper or an optical I/F module. These terminals receive NRZ data at a rate of 1.25 Gbps and are active when LOOPEN is held low. Lock to reference. When LCKREFN is asserted low, the receive PLL phase locks to the supplied REFCLK signal. LCKREFN prelocks or resets the receive PLL. Loop enable. When LOOPEN is high (active), the internal loop-back path is activated. The transmitted serial data is directly routed to the inputs of the receiver. This provides a self-test capability in conjunction with the protocol device. The DOUT_TXP and DOUT_TXN outputs are held static during the loop-back test. LOOPEN is held low during standard operational state with external serial outputs and inputs active. Receive byte clock. RBC0 and RBC1 are 62.5-MHz recovered clocks used for synchronizing the 10-bit output data on RD0 - RD9. The 10-bit output data words are valid on the rising edges of RBC0 and RBC1. These clocks are adjusted to half-word boundaries in conjunction with synchronous detect. The clocks are always expanded during data realignment and never slivered or truncated. RBC0 registers bytes 1 and 3 of received data. RBC1 registers bytes 0 and 2 of received data. Receive capacitor. RC0 and RC1 are external capacitor connections used for the receiver internal PLL filter. The recommend value for this external capacitor is 2 nF (a value of 0.1 F can also be used). Receive data. These outputs carry 10-bit parallel data output from the transceiver to the protocol layer. The data is referenced to terminals RBC0 and RBC1. Received data byte 0, which contains the K28.5 character, is byte aligned to the rising edge of RBC1. RD0 is the first bit received. Reference clock. REFCLK is an external 125 MHz input clock that synchronizes the receiver and transmitter interfaces. The transmitter uses this clock to register the 10-bit input data (TD0..TD9) for serialization. REFCLK is also used as a RX PLL preset or reference when LCKREFN is enabled. Synchronous detect. SYNC is asserted high upon detection of the K28.5 character in the serial data path. SYNC is a high level for 1/2 REFCLK period. SYNC pulses are output only when SYNCEN is activated (asserted high). Note: SYNC is active on byte0 and, therefore, active on rising edge of RCB1. Synchronous function enable. When SYNCEN is asserted high, the internal synchronization function is activated. When this function is enabled, the transceiver detects the K28.5 character (0011111010 negative beginning disparity) in the serial data stream and realigns data on byte boundaries if required. When SYNCEN is low, serial input data is unframed in RD0 - RD9. Transmit capacitor. TC0 and TC1 are external capacitor connections used for the transmitter internal PLL filter. The recommended value of this external capacitor is 2 nF. Transmit data. These inputs carry 10-bit parallel data output from a protocol device to the transceiver for serialization and transmission. This 10-bit parallel data is clocked into the transceiver on the rising edge of REFCLK and transmitted as a serial stream with TD0 sent as the first bit. DESCRIPTION
DIN_RXP DIN_RXN LCKREFN LOOPEN
54 52 27 19
Input
Input Input
RBC0 RBC1
31 30
Output
RC1, RC0 RD0 - RD9
49 48 45,44,43,41 40,39,38,36 35,34 22
Analog Output
REFCLK
Input
SYNC
47
Output
SYNCEN
24
Input
TC1 TC0 TD0 - TD9
16 17 2,3,4,6 7,8,9,11 12,13
Analog Input
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
Terminal Functions (Continued)
TERMINAL NAME VCC_A NO. 20,28,29,53 55,57,59,60 63 5,10,23, 50 42,37 18 TYPE POWER Supply Analog power. VCC_A provides a supply reference voltage for the high-speed analog circuits. DESCRIPTION
VCC_CMOS VCC_RX VCC_TTL VCC_TX
Supply Supply Supply Supply
Digital PECL logic power. VCC_CMOS provides an isolated low-noise power supply for the logic circuits. Receiver power. VCC_RX provides a low-noise supply reference voltage for the receiver high-speed analog circuits. TTL power. VCC_TTL provides a supply reference voltage for the receiver TTL circuits. Transmitter power. VCC_TX provides a low-noise supply reference voltage for the transmitter high-speed analog circuits. GROUND
GND_A GND_CMOS GND_RX GND_TTL GND_TX RESERVED
21,32,56,64 1,14, 25,58 51 33,46 15 26
Ground Ground Ground Ground Ground
Analog ground. GND_A provides a ground reference for the high-speed analog circuits. Digital PECL logic ground. GND_CMOS provides an isolated low-noise ground for the logic circuits. Receiver ground. GND_RX provides a ground reference for the receiver circuits. TTL circuit ground. GND_TTL provides a ground for TTL interface circuits. Transmitter ground. GND_TX provides a ground reference for the transmitter circuits. MISCELLANEOUS Reserved. Internally pulled to GND, leave open or assert low.
detailed description
data transmission The transmitter registers incoming 10-bit-wide data words (8b/10b encoded data, TD0..TD9) on the rising edge of REFCLK (125 MHz). The reference clock is also used by the serializer, which multiplies the clock by a factor of 10 providing a 1.25 Gbaud signal that is fed to the shift register. The data is then transmitted differentially at PECL voltage levels. The 8b/10b encoded data is transmitted sequentially bit 0 through 9. transmission latency The data transmission latency of the TNETE2201 is defined as the delay from the initial 10-bit word load to the serial transmission of bit 9. The typical transmission latency is 9 ns. data reception The receiver of the TNETE2201 deserializes 1.25 Gbps differential serial data. The 8b/10b data (or equivalent) is retimed based on an extracted clock from the serial data. The serial data is then aligned to the 10-bit word boundaries and presented to the protocol controller along with two receive byte clocks (RBC0, RBC1). RBC0 and RBC1 are 180 degrees out of phase and are generated by dividing down the recovered 1.25 Gbps (625 MHz) clock by 10 providing for two 62.5-MHz signals. The receiver presents the protocol device byte 0 of the received data valid on the rising edge of RBC1.
NOTE:
This allows the option of byte alignment without the use of the synchronous detection (SYNC) function by the protocol device. The receiver PLL can lock to the incoming 1.25 GHz data without the need for a lock-to-reference preset. The received serial data rate (RX+ and RX-) should be 1.25 Gbps 0.01% (100 ppm) for proper operation.
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data reception (continued) During a bus error condition or word alignment, the receive byte clocks RBC0 and RBC1 are stretched (never truncated). When the incoming serial data does not meet its frequency requirements, then the receive byte clock frequency is maintained at 62.5 MHz. receive PLL operation The receive PLL provides automatic locking to the incoming data. At power-up, the maximum initial lock time is 500 s. The PLL can also be initiated or set to phase lock to the externally supplied reference clock by enabling lock-to-reference (LCKREFN). The lock-to-reference causes the receive PLL to lock to 10x the reference clock (REFCLK) input providing a PLL preset and reset capability. If a transient occurs during normal operation (a transient being defined as any arbitrary phase shift in the incoming data and/or a frequency wander of up to 200 ppm), the PLL recovers lock within 2.4 s. Any condition exceeding these values is considered a power-up scenario with the PLL recovering lock within 500 s. With a 0.1 F capacitor attached, the PLL recovers lock within 10 ms on power up. receiver word alignment The TNETE2201 uses a 10-bit K28.5 character (comma character) word alignment scheme. The following sections explain how this scheme works and how it realigns itself.
comma character on expected boundary
The TNETE2201 provides 10-bit K28.5 character recognition and word alignment. The 10-bit word alignment is enabled by forcing SYCNEN high. This enables the function that examines and compares ten bits of serial input data to the K28.5 synchronization character. The K28.5 character is defined in the fibre channel standard as a pattern consisting of 0011111010 (a negative number beginning disparity) with the 7 MSBs (0011111) referred to as the comma character. The K28.5 character was implemented specifically for aligning data words. As long as the K28.5 character falls within the expected 10-bit word boundary, the received 10-bit data is properly aligned and data realignment is not required. Figure 1 shows the timing characteristics of RBC0, RBC1, SYNC and RD0 - RD9 while synchronized.
NOTE: The K28.5 character is valid on the rising edge of RBC1.
RBC0
RBC1
SYNC
RD0 - RD9
K28.5
Dxx.x
Dxx.x
Dxx.x
K28.5
Dxx.x
Figure 1. Synchronous Timing Characteristics Waveforms
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
comma character not on expected boundary
When synchronization is enabled and a K28.5 character straddles the expected 10-bit word boundary, then word realignment is necessary. Realignment or shifting of the 10-bit word boundary truncates the character following the misaligned K28.5, but the following K28.5 and all subsequent data is aligned properly as shown in Figure 2. The 10b specification requires that RCLK cycles can not be truncated and can only be stretched or stalled in their current state during realignment. With this design the maximum stretch that occurs is an extra 10 bit times. This occurs during a worst case scenario when the K28.5 is aligned to the falling edge of RBC1 instead of the rising edge. This system transmits a minimum of three consecutively ordered K28.5 data sets between frames and ensures that the receiver sees at least two of K28.5 sets (the fabric is allowed to drop one). Figure 2 shows the timing characteristics of the data realignment. Systems that do not require framed data can disable byte alignment by tying SYNCEN low. When a synchronization character is detected, the SYNC signal is asserted high and is aligned with the K28.5 character. The duration of the SYNC-signal pulse is equal to the duration of the data which is half an RCLK period.
Typical Receive Path Latency = 18 ns Serial Rx Data Stream DIN_RxP - DIN_RxN 10 Bit Times 10 Bit Times 20 Bit Times (MAX) RBC1 K28.5 Dxx.x Dxx.x K28.5 Dxx.x Dxx.x Dxx.x K28.5 Dxx.x K28.5
RBC0 Corrupted Data Worst Case Misaligned K28.5 RD0 - RD9 Dxx.x Dxx.x K28.5 Dxx.x Dxx.x K28.5 Misalignment Corrected Dxx.x Dxx.x Dxx.x K28.5
SYNC
Figure 2. Word Realignment Timing Characteristics Waveforms
data reception latency
The serial-to-parallel data latency is the time from when the first bit arrives at the receiver until it is output in the aligned parallel word with RD0 received as first bit. The receive latency is typically 18 ns.
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loop-back testing The transceiver can provide a self-test function by enabling (LOOPEN to high level) the internal loop-back path. Enabling LOOPEN causes serially transmitted data to be routed internally to the receiver. The parallel data output can be compared to the parallel input data for functional verification. The external differential output is held in a static state during loop-back testing.
absolute maximum ratings
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.0 V Input voltage, VI (TTL, PECL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to 4.0 V Output current IO, (TTL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA Output current IO, (PECL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Voltage range at any terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to VCC + 0.5 V Electrostatic discharge, 5-V tolerant input terminals (see Note 2) . . . . . . . . . . . . . . Class 1, A:1 kV, B:150 V Electrostatic discharge, all other terminals (see Note 2) . . . . . . . . . . . . . . . . . . . . . . Class 1, A:2 kV, B:200 V Characterized free-air operating temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential I/O bus voltages, are with respect to network ground. 2. This parameter is tested in accordance with MIL-PRF-38535.
recommended operating conditions
PARAMETER Supply voltage, VCC Supply current, ICC (static) Power Dissipation, PD (static) Supply current, ICC (dynamic) Power Dissipation, PD (dynamic) Static pattern Outputs Open, K28.5 Outputs Open, K28.5 0 static pattern TEST CONDITIONS MIN 3.14 NOM 3.3 180 590 240 790 MAX 3.47 260 900 330 1150 70 UNIT V mA mW mA mW C
Operating free-air temperature, TA Power (static pattern) = 125 MHz to the receiver and 5 ones and 5 zeros to the transmitter.
reference clock (REFCLK) timing requirements over recommended operating conditions (unless otherwise noted)
PARAMETER Frequency Accuracy Duty cycle TEST CONDITIONS MIN TYP - 0.01% -100 40% 50% NOM 125 MAX TYP + 0.01% 100 60% UNIT MHz ppm
Jitter Random and deterministic 40 ps This clock should be crystal referenced to meet the requirements listed in this table. The maximum rate of frequency change specified is valid after 10 seconds from power on.
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
electrical characteristics over recommended operating conditions (unless otherwise noted)
TTL Signals: TD0 .. TD9, REFCLK, LOOPEN, SYNCEN, SYNC, RD0 .. RD9, RBC0, RBC1, LCKREFN
PARAMETER VOH VOL VIH VIL IIH IIL ci High-level output voltage Low-level output voltage High-level input voltage Low-level input voltage Input High current Input Low current Input capacitance REFCLK REFCLK VCC = MAX, VCC = MAX, VCC = MAX, VCC = MAX, VI = 2.4 V VI = 2.4 V VI = 0.4 V VI = 0.4 V -40 -900 4 TEST CONDITIONS VCC = MIN, VCC = MIN, IOH = - 400 A IOL = 1 mA MIN 2.4 2 TYP 3 0.25 0.4 5.5 0.8 40 900 MAX UNIT V V V V A A A A pF
10
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TRANSMITTER SECTION differential electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER VOD VOC Driver differential output voltage (peak-to-peak) (peak to peak) Driver common-mode output voltage TEST CONDITIONS RL = 75 , RL = 50 , RL = 75 See Figure 3 See Figure 3 MIN 1100 1100 2100 TYP MAX 2200 2200 UNIT mV mV
differential switching characteristics over recommended operating conditions (unless otherwise noted).
PARAMETER Serial data deterministic jitter (peak-to-peak) Serial data total jitter (peak-to-peak) tr3 tf3 Differential signal rise time (20% to 80%) Differential signal fall time (20% to 80%) TEST CONDITIONS Differential output jitter Differential output jitter RL = 75 , See Figure 3 S Fi CL = 5 pF, MIN TYP MAX 96 192 300 300 UNIT ps ps ps ps
80% TX+ 50% 20% tr tf
VCC - 0.7 V
VCC - 1.6 V
80% TX- 50% 20% tf tr
VCC - 0.7 V
VCC - 1.6 V
80% VOD 50% 20% tr3 tf3
1 V
-1 V
Figure 3. Differential and Common-Mode Output Voltage Definitions
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transmitter timing requirements over recommended operating conditions (unless otherwise noted)
TEST CONDITIONS tsu1 th1 Setup time, TD0 - TD9 valid to REFCLK Hold time, REFCLK to TD0 - TD9 invalid Parallel-to-serial data latency See Figure 4 See Figure 4 MIN 2 1 9 NOM MAX UNIT ns ns ns
transmit interface timing
The transmit interface is defined in the 10 b spec as the 10-bit parallel data input to the physical layer for serial transmission. The timing values are specified from REFCLK midpoint to valid input signal levels or from valid input signal levels to REFCLK midpoint.
REFCLK
50%
tsu1 th1
TD0 - TD9
12
EEEEEEE EEEEEE EEEEEEEE EEEEEEE EEEEEE EEEEEEEE
Valid Valid
Valid
Figure 4. Transmit 10-Bit Interface Timing Waveforms
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RECEIVER SECTION differential electrical characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER |VID | Differential input voltage (peak-to-peak) TEST CONDITIONS See Figure 5 MIN 400 TYP MAX 2600 UNIT mV
receiver and phase-locked loop performance characteristics over recommended operating conditions (unless otherwise noted)
PARAMETER Jitter tolerance Data acquisition lock time Data relock time UI is the unit interval of a single bit (800 ps). TEST CONDITIONS See P802.3Z specification From power up at 2 nF capacitor value From power up at 0.1 F capacitor value From synchronization loss MIN TYP MAX 74.9% 500 10 2500 UNIT UI s ms ns
receive clock timing requirements over recommended operating conditions (unless otherwise noted)
PARAMETER fclk fclk tr4 tf4 tr5 tf5 t(skew) tsu2 tsu3 tsu4 tsu5 Clock frequency, RBC0 Clock frequency, RBC1 (180 deg out of phase with RBC0) Data Rise time Data Fall time Rise time, single-ended output signal on RBC0 or RBC1 Fall time, single-ended output signal on RBC0 or RBC1 Duty cycle, RBC0 or RBC1 Skew time, RBC1 to RBC0 Setup time, RD0 - RD9, SYNC valid to RBC0 Setup time, RD0 - RD9, SYNC valid to RBC1 Setup time, RBC1 to RD0 - RD9, SYNC invalid Setup time, RBC1 to RD0 - RD9, SYNC invalid Serial-to-parallel data latency See Figure 7 See Figure 7 See Figure 7 See Figure 7 See Figure 7 See Figure 6 See Figure 6 See Figure 6 See Figure 6 0.7 0.7 0.7 0.7 40% 7.5 2.5 2.5 1.5 1.5 18 8 TEST CONDITIONS MIN TYP 62.5 62.5 4 4 2 2 60% 8.5 ns ns ns ns ns MAX UNIT MHz MHz ns ns ns ns
ns t(drift) is the minimum time for RBC0 or RBC1 to drift from 63.5 MHz to 64.5 MHz or from 60 MHz to 59 MHz from the RCLK lock value. This is applicable under all input signal conditions with PLL locked to the REFCLK of DATA signals.
| VID |
0V
| VID |
Figure 5. Differential Input Voltage (Peak-to-Peak) Timing Waveform
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80% Data 50% 20% tr4 tf4
80% Clock 50% 20% tr5 tf5
Figure 6. Receiver Data Measurement Levels
t(skew) RBC0 50% 50%
RBC1
50%
50% tsu2 tsu3 tsu4 tsu5
RD0 - RD9, SYNC
14
EE EE EE EEE EEE EEE EE EE EE EEE EEE EEE
Valid Valid Valid Valid Valid
Figure 7. Receiver Interface Timing Waveforms
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APPLICATION INFORMATION
Ferrite Bead 3.3 V 0.01 F 51 50 VCC_RX 18 VCC_TX 15 Ferrite Bead 5 at 100 MHz 0.01 F 3.3 V
GND_RX GND_TX TNETE2201 DOUT_TXP
62 R(pd) (see Note A)
Controlled Impedance Transmission Line
10 / 22 27 Host Protocol Device 10 / 31,30 19 24 47 2 /
TD0 - TD9 REFCLK LCKREFN LOOPEN SYNCEN SYNC RD0 - RD9 RBC0,RBC1 DOUT_RXP DOUT_TXN
61
Controlled Impedance Transmission Line
54 50 - 75 Vt (see Note B) 50 - 75
Controlled Impedance Transmission Line
DOUT_RXN
52
Controlled Impedance Transmission Line
49 PLL Filter Capacitor = 2.2 nF or 0.1 F
RC1
TC1
16 PLL Filter Capacitor = 2.2 nF or 0.1 F
48
RC0
TC0
17
NOTES: A. R(pd) - This value is set to match the falling edge to rising edge transistion times, typically 150 . to 220 .. B. Vt (termination voltage): Vt = VCC - 1.3 V, if ac coupled Vt = VCC - 2 V, if directly coupled.
Figure 8. Typical Application Circuit
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TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
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MECHANICAL INFORMATION
The TNETE2201 incorporates the latest development in TI's package line. The new patent-pending design, designated the PWP, delivers thermal performance comparative to a heat-spreader design in a true low-profile package. The PWP for the TNETE2201 is designed to maximize heat transfer away from the die through the top of the chip. As seen in Figures 9 and 10 the bottom of the leadframe is deep downset towards the top of the chip, providing a thermal path away from the die and board. All this has been accomplished without exceeding the 1.15 mm height of the TQFP. This package in the 10mm x 10mm TQFP (PJD) provides a thermal resistance RJA of 40C/W and the package in the 14mm x 14mm TQFP (PHD) provides a RJA of 40C/W.
Figure 9. Heat-Spreader Design
Figure 10. Leadframe Downset
16
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* DALLAS, TEXAS 75265
TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
MECHANICAL INFORMATION
PHD (S-PQFP-G64)
0,40 0,30 33
PowerPADTM PLASTIC QUAD FLATPACK (DIE DOWN)
0,80 48
0,20 M
49
32
Thermal Pad (see Note D)
0,13 NOM
64
17 Gage Plane 1 12,00 TYP 14,05 SQ 13,95 16,15 SQ 15,85 1,05 0,95 Seating Plane 16 0,25 0,15 0,05 0,75 0,45 0- 7
1,20 MAX
0,10 4087742/A 12/97
NOTES: A. B. C. D.
All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions include mold flash or protrusions. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments Incorporated.
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
17
TNETE2201 1.25-GIGABIT ETHERNET TRANSCEIVER
SLLS267D - JUNE 1997 - REVISED FEBRUARY 1999
MECHANICAL INFORMATION
PJD (S-PQFP-G64) PowerPADTM PLASTIC QUAD FLATPACK (DIE DOWN)
0,50 48
0,27 0,17 33
0,08 M
49
32 Thermal Pad (See Note D)
64
17 0,13 NOM 1 7,50 TYP 10,20 SQ 9,80 12,20 SQ 11,80 1,05 0,95 Gage Plane 0,25 0,15 0,05 0,75 0,45 Seating Plane 0- 7 16
1,20 MAX
0,08 4147703/A 12/97
NOTES: A. B. C. D.
All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions include mold flash or protrusions. The package thermal performance may be enhanced by attaching an external heat sink to the thermal pad. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. E. Falls within JEDEC MS-026
PowerPAD is a trademark of Texas Instruments Incorporated.
18
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright (c) 1999, Texas Instruments Incorporated


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