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| (R) STTH1R06 TURBO 2 ULTRAFAST HIGH VOLTAGE RECTIFIER Table 1: Main Product Characteristics IF(AV) VRRM IR (max) Tj VF (typ) trr (max) FEATURES AND BENEFITS 1A 600 V 75 A 175C 1.0 V 25 ns DO-41 STTH1R06 SMA STTH1R06A Ultrafast switching Low reverse recovery current Low thermal resistance Reduces switching & conduction losses DESCRIPTION The STTH1R06, which is using ST Turbo 2 600V technology, is specially suited as boost diode in power factor correction circuitry. The device is also intended for use as a free wheeling diode in power supplies and other power switching applications. Table 2: Order Codes Part Number STTH1R06 STTH1R06RL Marking STTH1R06 STTH1R06 Part Number STTH1R06A STTH1R06U Marking HR6 BR6 SMB STTH1R06U Table 3: Absolute Ratings (limiting values) Symbol VRRM IF(RMS) IF(AV) RMS forward voltage Average forward current Parameter Repetitive peak reverse voltage DO-41 SMA / SMB DO-41 SMA SMB IFSM Tstg Tj Surge non repetitive forward current Storage temperature range Maximum operating junction temperature REV. 3 Value 600 10 7 Tc = 100C Tc = 125C Tc = 135C = 0.5 = 0.5 = 0.5 25 20 -65 to + 175 175 1 Unit V A A A C C 1/9 DO-41 SMA / SMB tp = 10ms sinusoidal February 2005 STTH1R06 Table 4: Thermal Resistance Symbol Rth(j-l) Junction to lead Parameter L = 10mm DO-41 SMA SMB Rth(j-a) Junction to ambient (1) 2 Value (max). 45 30 25 70 Unit C/W L = 10mm DO-41 C/W Note 1: Rth(j-a) is measured with a copper area S = Scm (see figure12). Table 5: Static Electrical Characteristics Symbol IR VF Parameter Test conditions VR = VRRM 10 IF = 1A 1.0 2 Min. Typ Max. 1 75 1.7 1.25 Unit A Reverse leakage current Tj = 25C Tj = 150C Forward voltage drop Tj = 25C Tj = 150C V To evaluate the conduction losses use the following equation: P = 1.03 x IF(AV) + 0.27 IF (RMS) Table 6: Dynamic Characteristics Symbol trr tfr VFP Parameter Reverse recovery time Forward recovery time Forward recovery voltage Tj = 25C Tj = 25C Tj = 25C Test conditions IF = 0.5A Irr = 0.25A IR =1A IF = 1A dIF/dt = -50 A/s VR =30V IF = 1A dIF/dt = 100 A/s VFR = 1.1 x VFmax IF = 1A dIF/dt = 100 A/s VFR = 1.1 x VFmax 30 Min. Typ Max. Unit 25 45 100 10 ns V ns 2/9 STTH1R06 Figure 1: Conduction losses versus average forward current P(W) 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Figure 2: Forward voltage drop versus forward current IFM(A) 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0 0 = 0.1 = 0.05 = 0.2 = 0.5 Tj=125C (maximum values) Tj=25C (maximum values) Tj=125C (typical values) =1 T IF(AV)(A) =tp/T tp VFM(V) 1 2 3 4 5 Figure 3: Relative variation of thermal impedance junction to case versus pulse duration (DO-41) Zth(j-c)/Rth(j-c) 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 Single pulse = 0.2 = 0.1 = 0.5 Figure 4: Relative variation of thermal impedance junction to case versus pulse duration (SMA) Zth(j-c)/Rth(j-c) 1.0 S = 1cm2 0.9 0.8 0.7 0.6 0.5 0.4 0.3 = 0.5 T 0.2 0.1 = 0.2 = 0.1 T tp(s) 1.E+01 0.0 1.E-01 =tp/T 1.E+02 tp 0.0 Single pulse tp(s) 1.E+00 1.E+01 =tp/T 1.E+02 tp 1.E+03 1.E+00 1.E+03 1.E-01 Figure 5: Relative variation of thermal impedance junction to case versus pulse duration (SMB) Zth(j-c)/Rth(j-c) 1.0 S = 1cm2 Figure 6: Peak reverse recovery current versus dI F /dt (typical values) IRM(A) 9 8 7 IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) 0.9 0.8 0.7 0.6 0.5 = 0.5 6 IF=0.5 x IF(AV) 5 4 IF=0.25 x IF(AV) 0.4 0.3 = 0.2 3 T 2 1 0 1.E+00 1.E+01 1.E+02 1.E+03 0 50 100 150 200 250 300 350 400 450 500 0.2 0.1 0.0 1.E-01 = 0.1 Single pulse tp(s) =tp/T tp dIF/dt(A/s) 3/9 STTH1R06 Figure 7: Reverse recovery time versus dIF/dt (typical values) trr(ns) 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0 50 100 150 200 250 300 350 400 450 500 75 50 IF=IF(AV) IF=0.5 x IF(AV) IF=2 x IF(AV) VR=400V Tj=125C Figure 8: Reverse recovery charges versus dIF/dt (typical values) Qrr(nC) 250 225 200 175 150 IF=IF(AV) VR=400V Tj=125C IF=2 x IF(AV) 125 100 IF=0.5 x IF(AV) dIF/dt(A/s) 25 0 0 50 100 150 dIF/dt(A/s) 200 250 300 350 400 450 500 Figure 9: Reverse recovery softness factor versus dIF/dt (typical values) S factor 6 IF=IF(AV) VR=400V Tj=125C Figure 10: Relative variations of dynamic parameters versus junction temperature 1.0 0.9 0.8 IRM S factor 5 4 0.7 0.6 3 0.5 0.4 QRR 2 0.3 1 0.2 dIF/dt(A/s) 0 0 50 100 150 200 250 300 350 400 450 500 0.1 0.0 25 50 Tj(C) 75 IF=IF(AV) VR=400V Reference: Tj=125C 100 125 Figure 11: Transient peak forward voltage versus dIF/dt (typical values) VFP(V) 25 IF=IF(AV) Tj=125C Figure 12: Forward recovery time versus dIF/dt (typical values) tfr(ns) 200 180 160 140 IF=IF(AV) VFR=1.1 x VF max. Tj=125C 20 15 120 100 10 80 60 5 40 dIF/dt(A/s) 0 0 20 40 60 80 100 120 140 160 180 200 20 0 0 20 40 60 dIF/dt(A/s) 80 100 120 140 160 180 200 4/9 STTH1R06 Figure 13: Junction capacitance versus reverse voltage applied (typical values) Figure 14: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35m) (DO-41, SMB) Rth(j-a)(C/W) 110 C(pF) 100 F=1MHz VOSC=30mV Tj=25C 100 90 80 70 60 SMB DO-41 Lleads = 10mm 10 50 40 30 20 VR(V) 1 1 10 100 1000 10 0 0 1 2 3 4 S(cm) 5 6 7 8 9 10 Figure 15: Thermal resistance junction to ambient versus copper surface under each lead (epoxy FR4, eCU=35m) (SMA) Rth(j-a)(C/W) 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 SMA S(cm) 5/9 STTH1R06 Figure 16: SMA Package Mechanical Data DIMENSIONS E1 REF. D Millimeters Min. Max. 2.03 0.20 1.65 0.41 5.60 4.60 2.95 1.60 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.080 0.008 0.065 0.016 0.220 0.181 0.116 0.063 A1 A2 b E c E A1 E1 D b C L A2 L Figure 17: SMA Foot Print Dimensions (in millimeters) 2.30 1.50 2.30 1.75 6.10 6/9 STTH1R06 Figure 18: SMB Package Mechanical Data DIMENSIONS E1 REF. D Millimeters Min. Max. 2.45 0.20 2.20 0.41 5.60 4.60 3.95 1.60 Inches Min. 0.075 0.002 0.077 0.006 0.201 0.159 0.130 0.030 Max. 0.096 0.008 0.087 0.016 0.220 0.181 0.156 0.063 A1 A2 1.90 0.05 1.95 0.15 5.10 4.05 3.30 0.75 E b c A1 E E1 b C L A2 D L Figure 19: SMB Foot Print Dimensions (in millimeters) 2.3 1.52 2.75 1.52 7/9 STTH1R06 Figure 20: DO-41 Package Mechanical Data C A C / OB OD / OD / DIMENSIONS REF. A B C D Millimeters Min. Max. 4.07 5.20 2.04 2.71 28 0.712 0.863 Inches Min. 0.160 0.080 1.102 0.028 Max. 0.205 0.107 0.034 Table 7: Ordering Information Ordering type STTH1R06 STTH1R06RL STTH1R06A STTH1R06B Marking STTH1R06 STTH1R06 AR6 BR6 Package DO-41 DO-41 SMA SMB Weight 0.34 g 0.34 g 0.068 g 0.11 g Base qty 2000 5000 5000 2500 Delivery mode Ammopack Tape & reel Tape & reel Tape & reel Epoxy meets UL94, V0 Table 8: Revision History Date Apr-2003 07-Sep-2004 24-Feb-2005 Revision 1 2 3 First issue DO-41 and SMA packages added SMA package dimensions update. Reference A1 max. changed from 2.70mm (0.106inc.) to 2.03mm (0.080). Description of Changes 8/9 STTH1R06 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 9/9 |
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