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W24L011A 128K x 8 HIGH SPEED CMOS STATIC RAM
GENERAL DESCRIPTION
The W24L011A is a high speed, low power CMOS static RAM organized as 131072 x 8 bits that operates on a single 3.3-volt power supply. This device is manufactured using Winbond's high performance CMOS technology.
FEATURES
* High speed access time: 10/12/15 nS * Single +3.3V power supply * Center power/ground pin configuration * Fully static operation * All inputs and outputs directly TTL compatible * Three-state outputs * Available packages: 32-pin 300 mil SOJ, Small
TSOP-I (8 x 13.4 mm), TSOP-I (8 x 20 mm) and 400 mil SOJ
PIN CONFIGURATIONS
A0 A1 A2 A3 CS# I/O1 I/O2 Vcc Vss I/O3 I/O4 WE# A4 A5 A6 A7 A16 A15 A14 A13 OE# I/O8 I/O7 Vss Vcc I/O6 I/O5 A12 A11 A10 A9 A8
BLOCK DIAGRAM
VDD
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
VSS A0 . . A16
DECODER
CORE ARRAY
CS OE WE CONTROL DATA I/O
I/O1 . . I/O8
PIN DESCRIPTION
SYMBOL
32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17
A16 A15 A14 A13 OE# I/O8 I/O7 Vss Vcc I/O6 I/O5 A12 A11 A10 A9 A8
DESCRIPTION Address Inputs Data Inputs/Outputs Chip Select Inputs Write Enable Input Output Enable Input Power Supply Ground
A0 A1 A2 A4 CS# I/O1 I/O2 Vcc Vss I/O3 I/O4 WE# A4 A5 A6 A7
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
A0 - A16 I/O1 - I/O8 CS WE OE VDD VSS
32-pin TSOP
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Publication Release Date: April 26, 2002 Revision A3
W24L011A
TRUTH TABLE
CS H L L L OE X H L X WE X H H L MODE Not Selected Output Disable Read Write I/O1 - I/O8 High Z High Z Data Out Data In VDD CURRENT ISB, ISB1 IDD IDD IDD
DC CHARACTERISTICS
Absolute Maximum Ratings
PARAMETER Supply Voltage to VSS Potential Input/Output to VSS Potential Allowable Power Dissipation Storage Temperature Operating Temperature RATING -0.5 to +4.6 -0.5 to VDD +0.5 1.0 -65 to +150 0 to +70 UNIT V V W C C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability of the device.
Operating Characteristics
(VDD = 3.3V 5%, VSS = 0V, TA = 0 to 70 C)
PARAMETER Input Low Voltage Input High Voltage Input Leakage Current Output Leakage Current Output Low Voltage Output High Voltage Operating Power Supply Current
SYM. VIL VIIH ILI ILO VOL VOH IDD
TEST CONDITIONS VIN = VSS to VDD VI/O = VSS to VDD, CS = VIH (min.) or OE = VIH (min.) or WE = VIL (max.) IOL = +8.0 mA IOH = -4.0 mA CS = VIL (max.), I/O = 0 mA Cycle = mim., Duty = 100% 10 12 15
MIN. -0.5 +2.0 -10
TYP. -
MAX. 0.8 VDD +0.5 +10
UNIT V V A A V V
-10 2.4 -
-
+10 0.4 130 120 100 15 5
mA
Standby Power Supply Current
ISB ISB1
CS = VIH (min.) CS VDD -0.2V
mA mA
Note: Typical characteristics are at VDD = 3.3V, TA = 25 C.
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W24L011A
CAPACITANCE
(VDD = 3.3V, TA = 25 C, f = 1 MHz)
PARAMETER Input Capacitance Input/Output Capacitance
SYM. CIN CI/O
CONDITIONS VIN = 0V VOUT = 0V
MAX. 8 10
UNIT pF pF
Note: These parameters are sampled but not 100% tested.
AC CHARACTERISTICS
AC Test Conditions
PARAMETER Input Pulse Levels Input Rise and Fall Times Input and Output Timing Reference Level Output Load 0V to 3V 3 nS 1.5V CL = 30 pF, IOH/IOL = -4 mA/8 mA CONDITIONS
AC Test Loads and Waveform
R1 320 ohm R1 320 ohm 3.3V OUTPUT OUTPUT 30 pF Including Jig and Scope R2 350 ohm 5pF Including Jig and Scope R2 350 ohm 3.3V
(For TCLZ, TOLZ, TCHZ, TOHZ, TWHZ, TOW )
3.0V
90% 10% 3 nS 10%
90%
0V
3 nS
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Publication Release Date: April 26, 2002 Revision A3
W24L011A
AC Characteristics, continued (VDD = 3.3V 5%, VSS = 0V, TA = 0 to 70)
Read Cycle
PARAMETER SYM. W24L011A-10 MIN. Read Cycle Time Address Access Time Chip Select Access Time Output Enable to Output Valid Chip Selection to Output in Low Z Output Enable to Output in Low Z Chip Deselection to Output in High Z Output Disable to Output in High Z Output Hold from Address Change TRC TAA TACS TAOE TCLZ TOLZ* TCHZ TOHZ* TOH 10 3 0 3 MAX. 10 10 5 5 5 W24L011A-12 MIN. 12 3 0 3 MAX. 12 12 6 6 6 W24L011A-15 MIN. 15 3 8 8 MAX. 15 15 8 3 nS nS nS nS nS nS nS nS nS UNIT
* These parameters are sampled but not 100% tested.
Write Cycle
PARAMETER SYM. W24L011A-10 MIN. Write Cycle Time Chip Selection to End of Write Address Valid to End of Write Address Setup Time Write Pulse Width Write Recovery Time Data Valid to End of Write Data Hold from End of Write Write to Output in High Z Output Disable to Output in High Z Output Active from End of Write CS , WE TWC TCW TAW TAS TWP TWR TDW TDH TWHZ* TOHZ* TOW 10 9 9 0 9 0 5 0 0 MAX. 5 5 W24L011A-12 MIN. 12 10 10 0 10 0 7 0 0 MAX. 6 6 W24L011A-15 MIN. 15 12 12 0 12 0 9 0 0 MAX. 8 8 nS nS nS nS nS nS nS nS nS nS nS UNIT
* These parameters are sampled but not 100% tested.
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W24L011A
TIMING WAVEFORMS Read Cycle 1
(Address Controlled, CS = OE = VIL, WE = VIH)
TRC Address TAA TOH
TOH D OUT
Read Cycle 2
(Chip Select Controlled)
T RC Address
CS T ACS TCLZ D OUT TCHZ
Read Cycle 3
(Output Enable Controlled)
TRC Address TAA OE TAOE TOLZ CS TACS TCLZ DOUT TCHZ TOH
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Publication Release Date: April 26, 2002 Revision A3
W24L011A
Timing Waveforms, continued
Write Cycle 1
(OE Clock)
T WC Address TWR OE TCW CS TAW WE TAS TOHZ D OUT TDW D IN TDH (1, 4) TWP
Write Cycle 2
(OE = VIL Fixed)
TWC Address TCW CS TAW WE TAS TWP TWHZ (1, 4) DOUT TDW DIN TDH TOH TOW (2) (3) TWR
Notes: 1. During this period, I/O pins are in the output state, so input signals of opposite phase to the outputs should not be applied. 2. The data output from DOUT are the same as the data written to DIN during the write cycle. 3. DOUT provides the read data for the next address. 4. Transition is measured 200 mV from steady state with CL = 5 pF. This parameter is guaranteed but not 100% tested.
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W24L011A
ORDERING INFORMATION
PART NO. W24L011AJ-10 W24L011AJ-12 W24L011AJ-15 W24L011AI-10 W24L011AI-12 W24L011AI-15 W24L010AT-10 W24L010AT-12 W24L010AT-15 W24L010AQ-10 W24L010AQ-12 W24L010AQ-15 ACCESS TIME (nS) 10 12 15 10 12 15 10 12 15 10 12 15 OPERATING CURRENT MAX. (mA) 130 120 110 130 120 110 130 120 110 130 120 110 STANDBY CURRENT MAX. (mA) 10 10 10 10 10 10 10 10 10 10 10 10 OPERATION TEMPERATURE (C) 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 0 to +70 PACKAGE 300 mil SOJ 300 mil SOJ 300 mil SOJ 400 mil SOJ 400 mil SOJ 400 mil SOJ TSOP (8 x 20 mm) TSOP (8 x 20 mm) TSOP (8 x 20 mm) TSOP (8 x 13.4 mm) TSOP (8 x 13.4 mm) TSOP (8 x 13.4 mm)
Notes: 1. Winbond reserves the right to make changes to its products without prior notice. 2. Purchasers are responsible for performing appropriate quality assurance testing on products intended for use in applications where personal injury might occur as a consequence of product failure.
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Publication Release Date: April 26, 2002 Revision A3
W24L011A
PACKAGE DIMENSIONS
32-pin SOJ (300 mil)
Dimension in Inches Dimension in mm
32
17
Symbol A A1 A2 B
E He
Min.
__ 0.020 0.095 0.026 0.016 0.008 0.815 0.295 0.044 0.247 0.325 0.080 __ __ 0
Nom.
__ __ 0.100 0.028 0.018 0.010 0.825 0.300 0.050 0.267 0.335 __ __ __ __
Max.
0.140 __ 0.105 0.032 0.022 0.014 0.835 0.305 0.056 0.287 0.345 __ 0.045 0.004 10
Min.
__ 0.508 2.413 0.660 0.406 0.203 20.701 7.493 1.118 6.274 8.255 2.032 __ __ 0
Nom.
__ __ 2.540 0.711 0.457 0.254 20.955 7.620 1.270 6.782 8.509 __ __ __ __
Max.
3.556 __ 2.667 0.813 0.559 0.356 21.209 7.747 1.422 7.290 8.763 __ 1.143 0.102 10
b c D E e e1
1
16
He L S Y
D
A2
A L
c
e1
S B b
e
A1
Y
Seating Plane
32-pin SOJ (400 mil)
Dimension in inches
Dimension in mm
Symbol
32 17
Min. Nom. Max. Min. Nom. Max.
0.131 0.138 0.145 0.025 0.105 0.110 0.115 0.026 0.028 0.032 0.016 0.018 0.006 0.008 0.820 0.825 0.395 0.400 0.044 0.050 0.360 0.37 0.435 0.440 0.082 0.045 0.004 -5 2 6 -5 2 0.020 0.011 0.830 0.405 0.056 0.380 3.33 0.635 2.67 0.66 0.41 0.15 2.79 0.71 0.46 0.20 2.91 0.81 0.51 0.28 3.51 3.68
E
HE
1
16
D c A2 A s Seating Plane b b1 e A1 y L
A A1 A2 b1 b c D E e e1 HE L S y
Notes:
20.83 20.96 21.08 10.03 10.16 10.29 1.12 9.15 1.27 9.40 1.42 9.65 11.31 1.14 0.10 6
0.445 11.05 11.18 2.08
e1
1. Dimension D Max & S include mold flash or tie bar burrs. 2. Dimension b does not include dambar protrusion/intrusion. 3. Dimension D & E include mold mismatch and are determined at the mold parting line. 4. Controlling dimension: Inches 5. General appearance spec. should be based on final visual inspection spec.
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W24L011A
Package Dimensions, continued
32-pin TSOP
HD
Symbol
Dimension in Inches Min. Nom. Max.
0.047 0.006 0.041 0.009 0.007
Dimension in mm Min. Nom. Max.
1.20 0.15 1.05 0.23 0.17 18.50 8.10 20.20
D c
A A1 A2
__
0.002 0.037 0.007
__ __
0.039 0.008
__
0.05 0.95 0.17 0.12
__ __
1.00 0.20 0.15
M
e E
b c D E HD e L L1
A A2
0.005 0.006 0.720 0.311 0.780 0.724 0.315 0.787 0.020 0.020 0.031
0.10(0.004)
0.728 18.30 18.40 0.319 0.795 7.90 19.80 8.00 20.00 0.50 0.50 0.80
b
__
0.016
__
0.024
__
0.40
__
0.60
__
0.000 1
__
0.004 5
__
0.00 1
__
0.10 5
Y Y
__
3
__
3
L L1
A1
Note:
Controlling dimension: Millimeter
32-Lead Small Type One TSOP (8 x 13.4)
HD
Symbol
Dimension in Inches Min. Nom. Max. 0.049 0.002
Dimension in mm Min. Nom. Max. 1.25 0.15 1.00 0.20 0.15 1.05 0.27 0.16
D c
1
A A1 A2 b c D E HD e L L1
0.006 0.05 0.95 0.17
e
E
0.037 0.039 0.041 0.007 0.008 0.009
0.0056 0.0059 0.0062 0.14
b
0.461 0.465 0.469 11.70 11.80 11.90 0.311 0.315 0.319 7.90 8.00 8.10
0.520 0.528 0.536 13.20 13.40 13.60 0.020 0.012 0.020 0.028 0.027 0.000 0 3 0.004 5 0.30 0.675 0.00 0 3 0.10 5 0.50 0.50 0.70
A A
2
L L1
A1
Y
Y
Controlling dimension: Millimeters
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Publication Release Date: April 26, 2002 Revision A3
W24L011A
VERSION HISTORY
VERSION A1 A2 A3 DATE Aug. 1997 Aug. 1999 Apr. 26, 2002 PAGE 1, 2, 4, 7 1, 2, 7, 9 Initial Issued Add 15 nS specification Add TSOP package and change (IDD, ISB & ISBC) current DESCRIPTION
Headquarters
No. 4, Creation Rd. III, Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62365998
Taipei Office
9F, No.480, Rueiguang Rd., Neihu Chiu, Taipei, 114, Taiwan, R.O.C. TEL: 886-2-8177-7168 FAX: 886-2-8751-3579
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18 Shinyokohama Kohoku-ku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064
Please note that all data and specifications are subject to change without notice. All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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