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TC4423/TC4424/TC4425
3A Dual High-Speed Power MOSFET Drivers
Features
* High Peak Output Current: 3A * Wide Input Supply Voltage Operating Range: - 4.5V to 18V * High Capacitive Load Drive Capability: - 1800 pF in 25 ns * Short Delay Times: <40 ns (typ) * Matched Rise/Fall Times * Low Supply Current: - With Logic `1' Input - 3.5 mA (Max) - With Logic `0' Input - 350 A (Max) * Low Output Impedance: 3.5 (typ) * Latch-Up Protected: Will Withstand 1.5A Reverse Current * Logic Input Will Withstand Negative Swing Up To 5V * ESD Protected: 4 kV * Pin compatible with the TC1426/TC1427/TC1428, TC4426/TC4427/TC4428 and TC4426A/ TC4427A/TC4428A devices. * Space-saving 8-Pin 6x5 DFN Package
General Description
The TC4423/TC4424/TC4425 devices are a family of 3A, dual-output buffers/MOSFET drivers. Pin compatible with the TC1426/27/28, TC4426/27/28 and TC4426A/27A/28A dual 1.5A driver families, the TC4423/24/25 family has an increased latch-up current rating of 1.5A, making them even more robust for operation in harsh electrical environments. As MOSFET drivers, the TC4423/TC4424/TC4425 can easily charge 1800 pF gate capacitance in under 35 nsec, providing low enough impedances in both the on and off states to ensure the MOSFET's intended state will not be affected, even by large transients. The TC4423/TC4424/TC4425 inputs may be driven directly from either TTL or CMOS (2.4V to 18V). In addition, the 300 mV of built-in hysteresis provides noise immunity and allows the device to be driven from slowly rising or falling waveforms.
Applications
* Switch Mode Power Supplies * Pulse Transformer Drive * Line Drivers
Package Types(1) 8-Pin PDIP TC4423 TC4424 TC4425
NC IN A GND IN B
1 8 2 TC4423 7 3 TC4424 6 4 TC4425 5
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
16-Pin SOIC (Wide) TC4423 TC4424 TC4425
NC IN A NC GND GND NC IN B NC
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9
8-Pin DFN
NC
1
(2) TC4423 TC4424 TC4425
8
TC4423 TC4424 TC4425
NC OUT A VDD OUT B
NC OUT A VDD OUT B
NC OUT A VDD OUT B
IN A 2 GND
3
TC4423 TC4424 TC4425
7 6 5
NC OUT A OUT A VDD VDD OUT B OUT B NC
NC OUT A OUT A VDD VDD OUT B OUT B NC
NC OUT A OUT A VDD VDD OUT B OUT B NC
IN B 4
Note 1: Duplicate pins must both be connected for proper operation. 2: Exposed pad of the DFN package is electrically isolated.
2004 Microchip Technology Inc.
DS21421D-page 1
TC4423/TC4424/TC4425
Functional Block Diagram(1)
VDD
Inverting 750 A 300 mV
Output
Input Effective Input C = 20 pF (Each Input) GND 4.7V
Non-inverting
TC4423 Dual Inverting TC4424 Dual Non-inverting TC4425 One Inverting, One Non-inverting
Note 1: Unused inputs should be grounded.
DS21421D-page 2
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Supply Voltage ................................................................+22V Input Voltage, IN A or IN B ................................................ (VDD + 0.3V) to (GND - 5V) Package Power Dissipation (TA 70C) DFN ......................................................................... Note 2 PDIP .......................................................................730 mW SOIC.......................................................................470 mW Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, TA = +25C, with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current Note 1: 2: IS -- -- 1.5 0.15 2.5 0.25 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 -- -- -- -- 23 25 33 38 35 35 75 75 ns ns ns ns Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 2.8 3.5 3 >1.5 -- 0.025 5 5 -- -- V V A A Duty cycle 2%, t 300 sec. IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN 2.4 -- -1 -- -- -- -- 0.8 1 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Switching times ensured by design. Package power dissipation is dependent on the copper pad area on the PCB.
2004 Microchip Technology Inc.
DS21421D-page 3
TC4423/TC4424/TC4425
DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)
Electrical Specifications: Unless otherwise indicated, operating temperature range with 4.5V VDD 18V. Parameters Input Logic `1', High Input Voltage Logic `0', Low Input Voltage Input Current Output High Output Voltage Low Output Voltage Output Resistance, High Output Resistance, Low Peak Output Current Latch-Up Protection Withstand Reverse Current Switching Time (Note 1) Rise Time Fall Time Delay Time Delay Time Power Supply Power Supply Current IS -- -- 2.0 0.2 3.5 0.3 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) tR tF tD1 tD2 -- -- -- -- 28 32 32 38 60 60 100 100 ns ns ns ns Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF Figure 4-1, Figure 4-2, CL = 1800 pF VOH VOL ROH ROL IPK IREV VDD - 0.025 -- -- -- -- -- -- -- 3.7 4.3 3.0 >1.5 -- 0.025 8 8 -- -- V V A A Duty cycle 2%, t 300 sec IOUT = 10 mA, VDD = 18V IOUT = 10 mA, VDD = 18V VIH VIL IIN 2.4 -- -10 -- -- -- -- 0.8 +10 V V A 0V VIN VDD Sym Min Typ Max Units Conditions
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V VDD 18V. Parameters Temperature Ranges Specified Temperature Range (C) Specified Temperature Range (E) Specified Temperature Range (V) Maximum Junction Temperature Storage Temperature Range Package Thermal Resistances Thermal Resistance, 8L-6x5 DFN Thermal Resistance, 8L-PDIP Thermal Resistance, 16L-SOIC JA JA JA -- -- -- 33.2 125 155 -- -- -- C/W C/W C/W Typical four-layer board with vias to ground plane TA TA TA TJ TA 0 -40 -40 -- -65 -- -- -- -- -- +70 +85 +125 +150 +150 C C C C C Sym Min Typ Max Units Conditions
DS21421D-page 4
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
100
4700 pF
80
100
4700 pF
80
tFALL (nsec)
tRISE (nsec)
60
3300 pF 2200 pF
60
3300 pF 2200 pF
40
40
20
470 pF
0
1500 pF 1000 pF
20
470 pF
0
1500 pF 1000 pF
4
6
8
10 12 VDD (V)
14
16
18
4
6
8
10 12 VDD (V)
14
16
18
FIGURE 2-1: Voltage.
100
Rise Time vs. Supply
FIGURE 2-4: Voltage.
100
Fall Time vs. Supply
5V 80
80
tFALL (nsec)
5V
tRISE (nsec)
60
10V 15V
60
10V 15V
40
40
20
20
0 100
1000
CLOAD (pF)
10,000
0 100
1000 CLOAD (pF)
10,000
FIGURE 2-2: Load.
32 30 28
Time (nsec)
Rise Time vs. Capacitive
FIGURE 2-5: Load.
100
Fall Time vs. Capacitive
CLOAD = 2200 pF
tFALL
Delay Time (nsec)
80
CLOAD = 2200 pF VDD = 10V
tD1
26 24 22 20 18 -55
tFALL
tRISE
60
tRISE
40
20
tD2
-35
-15
5
25 45 TA (C)
65
85
105 125
0
1
2
3
4
567 Input (V)
8
9
10 11 12
FIGURE 2-3: Temperature.
Rise and Fall Times vs.
FIGURE 2-6: Amplitude.
Propagation Delay vs. Input
2004 Microchip Technology Inc.
DS21421D-page 5
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
50
CLOAD = 2200 pF
50
CLOAD = 2200 pF
45
45
tD2
Delay Time (nsec)
Delay Time (nsec)
40 35 30 25 20 4 6 8 10 12 VDD (V) 14 16 18
tD2 tD1
40 35 30 25 20 -55
tD1
-35
-15
5
25 45 TA (C)
65
85
105 125
FIGURE 2-7: Supply Voltage.
TA = 25C
Propagation Delay Time vs.
FIGURE 2-10: Temperature.
1.4
Propagation Delay Time vs.
1
IQUIESCENT (mA)
Both Inputs = 1
IQUIESCENT (mA)
1.2 1.0 0.8 0.6 0.4 0.2 Both Inputs = 0 -35 -15 5 25 45 TA (C) 65 85 105 125
Both Inputs = 1
0.1
Both Inputs = 0
0.01 4 6 8 10 12 VDD (V) 14 16 18
0.0 -55
FIGURE 2-8: Supply Voltage.
14 12 10 8 6 4 2 4 6 8
Quiescent Current vs.
FIGURE 2-11: Temperature.
14 12
Quiescent Current vs.
Worst Case @ TJ = +150C
RDS(ON) ()
RDS(ON) ()
10 8 6 4 2
Worst Case @ TJ = +150C
Typical @ TA = +25C
Typical @ TA = +25C
10 12 VDD (V)
14
16
18
4
6
8
10 12 VDD (V)
14
16
18
FIGURE 2-9: Output Resistance (Output High) vs. Supply Voltage.
FIGURE 2-12: Output Resistance (Output Low) vs. Supply Voltage.
DS21421D-page 6
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
Note: Load on single output only
60
VDD = 18V
60
VDD = 18V
3300 pF 1000 pF
50 634 kHz 40 30 355 kHz 20 200 kHz 10 112.5 kHz 0 100 63.4 kHz 35.5 kHz 20 kHz 1000 CLOAD (pF) 10,000
50 40 30 20 10 0
ISUPPLY (mA)
ISUPPLY (mA)
10,000 pF 100 pF
10
100 Frequency (kHz)
1000
FIGURE 2-13: Capacitive Load.
90 80 70
ISUPPLY (mA)
Supply Current vs.
FIGURE 2-16: Frequency.
90
Supply Current vs.
VDD = 12V
80 70
VDD = 12V
3300 pF 1000 pF
2 MHz
60 50 1.125 MHz 40 30 20 10 0 100 1000 CLOAD (pF) 634 kHz 355 kHz 200 kHz 112.5 kHz 63.4 kHz 20 kHz 10,000
ISUPPLY (mA)
60 50 40 30 20 10 0 10 100 Frequency (kHz) 1000 10,000 pF 100 pF
FIGURE 2-14: Capacitive Load.
120
VDD = 6V
Supply Current vs.
FIGURE 2-17: Frequency.
120
VDD = 6V
Supply Current vs.
4700 pF 10,000 pF
100 80 1.125 MHz 60 3.55 MHz 40 2 MHz 20 0 100 634 kHz 355 kHz
ISUPPLY (mA)
100 80
ISUPPLY (mA)
2200 pF 60 1000 pF 40 20 100 pF
112.5 kHz 20 kHz 1000 CLOAD (pF) 10,000
0 10
100 Frequency (kHz)
1000
FIGURE 2-15: Capacitive Load.
Supply Current vs.
FIGURE 2-18: Frequency.
Supply Current vs.
2004 Microchip Technology Inc.
DS21421D-page 7
TC4423/TC4424/TC4425
Typical Performance Curves (Continued)
10-7 8 6 4 2 A * sec 10-8 8 6 4 2 10-9 0 2 4 6 8 10 12 14 16 18
VIN (V)
Note:
The values on this graph represent the loss seen by both drivers in a package during one complete cycle. For a single driver, divide the stated values by 2. For a single transition of a single driver, divide the stated value by 4.
FIGURE 2-19:
TC4423 Crossover Energy.
DS21421D-page 8
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
3.0 PIN DESCRIPTIONS
PIN FUNCTION TABLE (1)
8-Pin DFN 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 PAD 16-Pin SOIC (Wide) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 -- Symbol NC IN A NC GND GND NC IN B NC NC OUT B OUT B VDD VDD OUT A OUT A NC NC No connection Input A No connection Ground Ground No connection Input B No connection No connection Output B Output B Supply input Supply input Output A Output A No connection Exposed Metal Pad Description The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
8-Pin PDIP 1 2 -- 3 -- -- 4 -- -- 5 -- 6 -- 7 -- 8 -- Note 1:
Duplicate pins must be connected for proper operation.
3.1
Inputs A and B
3.4
Ground (GND)
Inputs A and B are TTL/CMOS compatible inputs that control outputs A and B, respectively. These inputs have 300 mV of hysteresis between the high and low input levels, allowing them to be driven from slow rising and falling signals, and to provide noise immunity.
Ground is the device return pin. The ground pin(s) should have a low-impedance connection to the bias supply source return. High peak currents will flow out the ground pin(s) when the capacitive load is being discharged.
3.2
Outputs A and B
3.5
Exposed Metal Pad
Outputs A and B are CMOS push-pull outputs that are capable of sourcing and sinking 3A peaks of current (VDD = 18V). The low output impedance ensures the gate of the external MOSFET will stay in the intended state even during large transients. These outputs also have a reverse current latch-up rating of 1.5A.
The exposed metal pad of the 6x5 DFN package is not internally connected to any potential. Therefore, this pad can be connected to a ground plane or other copper plane on a printed circuit board to aid in heat removal from the package.
3.3
Supply Input (VDD)
VDD is the bias supply input for the MOSFET driver and has a voltage range of 4.5V to 18V. This input must be decoupled to ground with a local ceramic capacitor. This bypass capacitor provides a localized lowimpedance path for the peak currents that are to be provided to the load.
2004 Microchip Technology Inc.
DS21421D-page 9
TC4423/TC4424/TC4425
4.0 APPLICATIONS INFORMATION
VDD = 18V 1 F WIMA MKS-2 Input 1 2 0.1 F Ceramic Output CL = 1800 pF Input 1 2 VDD = 18V 1 F WIMA MKS-2 0.1 F Ceramic Output CL = 1800 pF
TC4423 (1/2 TC4425)
Input: 100 kHz, square wave, tRISE = tFALL 10 ns +5V Input 0V 18V Output 0V 10% 10% 10% tD1 90% tF tD2 0V tR 90% 18V Output 0V 90% +5V Input 10%
TC4424 (1/2 TC4425)
Input: 100 kHz, square wave, tRISE = tFALL 10 ns 90%
tD1 90% 10%
tR
tD2
90% tF 10%
FIGURE 4-1: Time.
Inverting Driver Switching
FIGURE 4-2: Switching Time.
Non-inverting Driver
DS21421D-page 10
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
5.0
5.1
PACKAGING INFORMATION
Package Marking Information
8-Lead DFN Example:
XXXXXXX XXXXXXX XXYYWW NNN
TC4423 EMF 0420 256
8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW
Example: TC4423 CPA256 0420
16-Lead SOIC (300 mil)
Example:
XXXXXXXXXXX XXXXXXXXXXX XXXXXXXXXXX YYWWNNN
TC4423COE 0420256
Legend:
XX...X YY WW NNN
Customer specific information* Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code
Note:
In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line thus limiting the number of available characters for customer specific information.
*
Standard marking consists of Microchip part number, year code, week code, traceability code (facility code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office.
2004 Microchip Technology Inc.
DS21421D-page 11
TC4423/TC4424/TC4425
8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) - Saw Singulated
DS21421D-page 12
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
8-Lead Plastic Dual In-line (P) - 300 mil (PDIP)
E1
D 2 n 1 E
A
A2
c
L A1
eB
B1 p B
Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
Units Dimension Limits n p A A2 A1 E E1 D L c B1 B eB
MIN
INCHES* NOM 8 .100 .155 .130 .313 .250 .373 .130 .012 .058 .018 .370 10 10
MAX
MIN
.140 .115 .015 .300 .240 .360 .125 .008 .045 .014 .310 5 5
.170 .145 .325 .260 .385 .135 .015 .070 .022 .430 15 15
MILLIMETERS NOM 8 2.54 3.56 3.94 2.92 3.30 0.38 7.62 7.94 6.10 6.35 9.14 9.46 3.18 3.30 0.20 0.29 1.14 1.46 0.36 0.46 7.87 9.40 5 10 5 10
MAX
4.32 3.68 8.26 6.60 9.78 3.43 0.38 1.78 0.56 10.92 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018
2004 Microchip Technology Inc.
DS21421D-page 13
TC4423/TC4424/TC4425
16-Lead Plastic Small Outline (SO) - Wide, 300 mil (SOIC)
E p E1
D
2 n B h 1
45
c A A2
Units Dimension Limits n p A A2 A1 E E1 D h L c B
L A1 INCHES* NOM 16 .050 .099 .091 .008 .407 .295 .406 .020 .033 4 .011 .017 12 12 MILLIMETERS NOM 16 1.27 2.36 2.50 2.24 2.31 0.10 0.20 10.01 10.34 7.39 7.49 10.10 10.30 0.25 0.50 0.41 0.84 0 4 0.23 0.28 0.36 0.42 0 12 0 12
MIN
MAX
MIN
MAX
Number of Pins Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter Significant Characteristic
.093 .088 .004 .394 .291 .398 .010 .016 0 .009 .014 0 0
.104 .094 .012 .420 .299 .413 .029 .050 8 .013 .020 15 15
2.64 2.39 0.30 10.67 7.59 10.49 0.74 1.27 8 0.33 0.51 15 15
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side. JEDEC Equivalent: MS-013 Drawing No. C04-102
DS21421D-page 14
2004 Microchip Technology Inc.
TC4423/TC4424/TC4425
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device X Temperature Range XX Package XXX Tape & Reel X PB Free Examples:
a) TC4423COE: 3A Dual Inverting MOSFET Driver,
0C to +70C,
16LD SOIC package.
3A Dual MOSFET Driver, Inverting 3A Dual MOSFET Driver, Non-Inverting 3A Dual MOSFET Driver, Complementary
Device:
TC4423: TC4424: TC4425:
b)
TC4423CPA:
3A Dual Inverting MOSFET Driver,
0C to +70C,
8LD PDIP package. c) TC4423VMF: 3A Dual Inverting MOSFET Driver,
Temperature Range:
C E V
= = =
0C to +70C (PDIP & SOIC Only) -40C to +85C -40C to +125C
-40C to +125C,
8LD DFN package. a) TC4424COE713: 3A Dual Non-Inverting, MOSFET Driver,
Package:
MF = Dual, Flat, No-Lead (6x5 mm Body), 8-lead MF713 = Dual, Flat, No-Lead (6x5 mm Body), 8-lead (Tape and Reel) OE = SOIC (Wide), 16-pin OE713 = SOIC (Wide), 16-pin (Tape and Reel) PA = Plastic DIP, (300 mil body), 8-lead
0C to +70C,
16LD SOIC package, Tape and Reel. b) TC4424EPA: 3A Dual Non-Inverting, MOSFET Driver,
PB Free:
G
= Lead-Free device * = Blank
-40C to +85C,
8LD PDIP package. a) TC4425EOE: 3A Dual Complementary, MOSFET Driver,
* Available on selected packages. Contact your local sales representative for availability.
-40C to +85C,
16LD SOIC package. b) TC4425CPA: 3A Dual Complementary, MOSFET Driver,
0C to +70C,
PDIP package.
Sales and Support
Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. 3. Your local Microchip sales office The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2004 Microchip Technology Inc.
DS21421D-page 15
TC4423/TC4424/TC4425
NOTES:
DS21421D-page 16
2004 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
*
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip's products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2004, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company's quality system processes and procedures are for its PICmicro(R) 8-bit MCUs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
2004 Microchip Technology Inc.
DS21421D-page 17
WORLDWIDE SALES AND SERVICE
AMERICAS
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ASIA/PACIFIC
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ASIA/PACIFIC
India - Bangalore Tel: 91-80-2229-0061 Fax: 91-80-2229-0062 India - New Delhi Tel: 91-11-5160-8632 Fax: 91-11-5160-8632 Japan - Kanagawa Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4816 Fax: 886-7-536-4817 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4420-9895 Fax: 45-4420-9910 France - Massy Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Ismaning Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 England - Berkshire Tel: 44-118-921-5869 Fax: 44-118-921-5820
08/24/04
DS21421D-page 18
2004 Microchip Technology Inc.

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