View NUF2222FC_1108649.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

NUF2222FC 2 Line USB 1.1 Upstream EMI Filter
This device is a 2 line EMI filter array for USB port protection in wireless applications. Greater than -20 dB attenuation is obtained at frequencies from 900 MHz to 3.0 GHz. It also has 2 lines for dedicated ESD protection. ESD protection is provided across all capacitors.
Features http://onsemi.com
A3 A1 C1 B2 1.3 K 33 R C3
* EMI Filtering and ESD Protection * Integration of 10 Discretes * Provides Protection for IEC61000-4-2 (Level 4) * * *
15 kV (Contact) Flip-Chip Package Moisture Sensitivity Level 1 ESD Rating: Machine Model = C; Human Body Model = 3B
D2 (Gnd Pin) 33 R E1 E3
Benefits
* Reduces EMI/RFI Emissions on a Data Line * Integrated Solution Offers Cost and Space Savings * Reduces Parasitic Inductances Which Offer a More "Ideal" Low Pass * * * * * * *
Filter Response Integrated Solution Improves System Reliability This is a Pb-Free Device EMI Filtering and ESD Protection for Data Lines Cell Phones Handheld Products Notebook Computers MP3 Players
1
MARKING DIAGRAM
1 2222AYWW
Applications
Flip-Chip FC SUFFIX CASE 499AM
2222 A Y WW
= Specific Device Code = Assembly Location = Year = Work Week
MAXIMUM RATINGS (TA = 25C unless otherwise noted)
Rating ESD Discharge IEC61000-4-2 Contact Discharge Symbol VPP TOP TSTG TJ Value 15 -40 to +85 -55 to +150 +125 Unit kV C C C
PIN CONFIGURATION
3 21 A B C D E
Operating Temperature Range Storage Temperature Range Junction Temperature
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ORDERING INFORMATION
Device NUF2222FCT1G Package Flip-Chip Shipping 3000 Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2005
1
June, 2005 - Rev. 0
Publication Order Number: NUF2222FC/D
NUF2222FC
ELECTRICAL CHARACTERISTICS (TA = 25C unless otherwise noted)
Characteristic Maximum Reverse Working Voltage Breakdown Voltage Leakage Current Pull Up Resistance Series Resistance Capacitance Cut-Off Frequency Symbol VRWM VBR IR Rpu RS CLINE f3dB Test Conditions - IR = 1.0 mA VRWM = 3.3 V - - f = 1.0 MHz, 0 Vdc 50 W Source and 50 W Load Termination Min - 6.0 - 1.1 28 - - Typ - - 1.0 1.3 33 36 190 Max 5.6 8.8 100 1.5 38 40 - Unit V V nA kW W pF MHz
http://onsemi.com
2
NUF2222FC
TYPICAL PERFORMANCE CURVES
(TA = 25C unless otherwise specified) 0 -5 -10 S21 (dB) -15 -20 -25 -30 -35 1.0E+6 -50 -60 1.0E+6 S41 (dB) 10E+6 100E+6 FREQUENCY (Hz) 1.0E+9 10E+9 0 -10 -20 -30 -40
10E+6
100E+6 FREQUENCY (Hz)
1.0E+9
10E+9
Figure 1. Typical Insertion Loss Characteristics
34.50 34.00 RESISTANCE (W) 33.50 33.00 32.50 32.00 31.50 -40 RESISTANCE (W) 1350 1340 1330 1320 1310 1300 1290 1280 1270 1260 -15 10 35 60 85 1250 -40
Figure 2. Typical Crosstalk Characteristics
-15
10
35
60
85
TEMPERATURE (C)
TEMPERATURE (C)
Figure 3. Typical Resistance (R33) vs. Temperature
45
Figure 4. Typical Resistance (R1300) vs. Temperature
35 CAPACITANCE (pF)
25
15
0
1
2
3
4
5
REVERSE VOLTAGE (V)
Figure 5. Typical Line Capacitance vs. Reverse Bias Voltage
http://onsemi.com
3
NUF2222FC
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter PCB Pad Size Pad Shape Pad Type Solder Mask Opening Solder Stencil Thickness Stencil Aperture Solder Flux Ratio Solder Paste Type Trace Finish Trace Width Copper Solder mask 500 mm Pitch 300 or 350 mm Solder Ball 250 mm +25 -0 Round NSMD 350 mm "25 125 mm 250 x 250 mm sq. 50/50 No Clean Type 3 or Finer OSP Cu 150 mm Max
NSMD
SMD
Figure 6. NSMD vs. SMD
0- 15 - 30 - 45 - 60 - 75 - 90 - 105 - 119 - 134 - 149 - 165 - 180 - 195 - 209 - 224 - 239 - 254 - 269 - 284 - 299 - 314 - 329 - 344 - 359 - 374 - 389 - 404 - 419 - 434 - 449 - 464 - 479 - 494 -
280 270 260 250 240 230 TL= 217 210 200 190 180 170 160 150 140 130 120 110 100 90 80 70 60 50 40 30 20 10 0
- - - - - - - - - - - - - - - - - - - - - - - - - - - -
Tp = (15-30 sec) Tp = 260C - 5C RAMP-UP
TEMPERATURE (C)
RAMP-DOWN tL (60-90 sec)
PRE-HEAT ZONE
TIME (seconds)
Figure 7. Typical Pb-Free Solder Heating Profile
http://onsemi.com
4
NUF2222FC
PACKAGE DIMENSIONS
8 PIN FLIP-CHIP CASE 499AM-01 ISSUE O
4X
D 0.10 C
A
B
TERMINAL A1 LOCATOR
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. COPLANARITY APPLIES TO SPHERICAL CROWNS OF SOLDER BALLS. MILLIMETERS MIN MAX --- 0.700 0.210 0.270 0.380 0.430 1.270 BSC 1.970 BSC 0.290 0.340 0.700 BSC 1.400 BSC
E
DIM A A1 A2 D E b e E1
TOP VIEW A2 A1 A 0.05 C SIDE VIEW
SEATING PLANE
0.10 C
C
e e/2
E D C B A 123
8X
b
e e/2
E1
0.05 C A B 0.03 C
BOTTOM VIEW
http://onsemi.com
5
NUF2222FC
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: N. American Technical Support: 800-282-9855 Toll Free Literature Distribution Center for ON Semiconductor USA/Canada P.O. Box 61312, Phoenix, Arizona 85082-1312 USA Phone: 480-829-7710 or 800-344-3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2-9-1 Kamimeguro, Meguro-ku, Tokyo, Japan 153-0051 Fax: 480-829-7709 or 800-344-3867 Toll Free USA/Canada Phone: 81-3-5773-3850 Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.
http://onsemi.com
6
NUF2222FC/D

▲Up To Search▲

Price & Availability of NUF2222FC

	To Download NUF2222FC Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .