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FDP15N65 / FDPF15N65 650V N-Channel MOSFET February 2006 UniFET FDP15N65 / FDPF15N65 650V N-Channel MOSFET Features * 15A, 650V, RDS(on) = 0.44 @VGS = 10 V * Low gate charge ( typical 48.5 nC) * Low Crss ( typical 23.6 pF) * Fast switching * 100% avalanche tested * Improved dv/dt capability TM Description These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, planar stripe, DMOS technology. This advanced technology has been especially tailored to minimize on-state resistance, provide superior switching performance, and withstand high energy pulse in the avalanche and commutation mode. These devices are well suited for high efficient switched mode power supplies and active power factor correction. D G GDS TO-220 FDP Series GD S TO-220F FDPF Series S Absolute Maximum Ratings Symbol VDSS ID IDM VGSS EAS IAR EAR dv/dt PD TJ, TSTG TL Drain-Source Voltage Drain Current Drain Current Gate-Source voltage Single Pulsed Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Power Dissipation (TC = 25C) - Derate above 25C (Note 2) (Note 1) (Note 1) (Note 3) Parameter - Continuous (TC = 25C) - Continuous (TC = 100C) - Pulsed (Note 1) FDP15N65 15 9.5 60 FDPF15N65 650 15* 9.5* 60* Unit V A A A V mJ A mJ V/ns 30 637 15 25.0 4.5 250 2.0 -55 to +150 300 73.5 0.59 W W/C C C Operating and Storage Temperature Range Maximum Lead Temperature for Soldering Purpose, 1/8" from Case for 5 Seconds * Drain current limited by maximum junction termperature. Thermal Characteristics Symbol RJC RCS RJA Parameter Thermal Resistance, Junction-to-Case Thermal Resistance, Case-to-Sink Thermal Resistance, Junction-to-Ambient FDP15N65 0.5 0.5 62.5 FDPF15N65 1.7 -62.5 Unit C/W C/W C/W (c)2006 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FDP15N65 / FDPF15N65 Rev. A FDP15N65 / FDPF15N65 650V N-Channel MOSFET Package Marking and Ordering Information Device Marking FDP15N65 FDPF15N65 Device FDP15N65 FDPF15N65 Package TO-220 TO-220F TC = 25C unless otherwise noted Reel Size --- Tape Width --- Quantity 50 50 Electrical Characteristics Symbol Off Characteristics BVDSS BVDSS / TJ IDSS IGSSF IGSSR VGS(th) RDS(on) gFS Ciss Coss Crss td(on) tr td(off) tf Qg Qgs Qgd IS ISM VSD trr Qrr NOTES: Parameter Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage Current, Forward Gate-Body Leakage Current, Reverse Gate Threshold Voltage Static Drain-Source On-Resistance Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge Conditions VGS = 0V, ID = 250A, TJ = 25C ID = 250A, Referenced to 25C VDS = 650V, VGS = 0V VDS = 520V, TC = 125C VGS = 30V, VDS = 0V VGS = -30V, VDS = 0V VDS = VGS, ID = 250A VGS = 10V, ID = 7.5A VDS = 40V, ID = 7.5A VDS = 25V, VGS = 0V, f = 1.0MHz (Note 4) Min 650 -----3.0 ------ Typ -0.65 -----0.36 19.2 2380 295 23.6 65 125 105 65 48.5 14.0 21.2 Max Units --1 10 100 -100 5.0 0.44 -3095 385 35.5 140 260 220 140 63.0 --V V/C A A nA nA V S pF pF pF ns ns ns ns nC nC nC On Characteristics Dynamic Characteristics Switching Characteristics VDD = 325V, ID = 15A RG = 21.7 (Note 4, 5) ------(Note 4, 5) VDS = 520V, ID = 15A VGS = 10V -- Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Maximum Pulsed Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge VGS = 0V, IS = 15A VGS = 0V, IS = 15A dIF/dt =100A/s (Note 4) ------ ---496 5.69 15 60 1.4 --- A A V ns C 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. L = 5.23mH, IAS = 15A, VDD = 50V, RG = 25, Starting TJ = 25C 3. ISD 15A, di/dt 200A/s, VDD BVDSS, Starting TJ = 25C 4. Pulse Test: Pulse width 300s, Duty Cycle 2% 5. Essentially Independent of Operating Temperature Typical Characteristics FDP15N65 / FDPF15N65 Rev. A 2 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Typical Performance Characteristics Figure 1. On-Region Characteristics Figure 2. Transfer Characteristics ID, Drain Current [A] ID, Drain Current [A] 10 1 VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top : 10 1 150 C 25 C -55 C Notes : 1. VDS = 40V 2. 250 s Pulse Test o o o 10 0 10 -1 Notes : 1. 250 s Pulse Test 2. TC = 25 -1 10 0 10 10 0 10 1 2 4 6 8 10 12 VDS, Drain-Source Voltage [V] VGS, Gate-Source Voltage [V] Figure 3. On-Resistance Variation vs. Drain Current and Gate Voltage Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperatue 1.0 RDS(ON) [ ], Drain-Source On-Resistance 0.8 0.6 VGS = 10V IDR, Reverse Drain Current [A] 10 1 0.4 150 25 VGS = 20V 0.2 Note : TJ = 25 Notes : 1. VGS = 0V 2. 250 s Pulse Test 0.0 0 10 20 30 40 50 10 0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 ID, Drain Current [A] VSD, Source-Drain voltage [V] Figure 5. Capacitance Characteristics 5000 Figure 6. Gate Charge Characteristics 12 VGS, Gate-Source Voltage [V] 4000 Coss Ciss Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 10 VDS = 130V VDS = 325V VDS = 520V Capacitances [pF] 8 3000 6 2000 Note ; 1. VGS = 0 V 2. f = 1 MHz 4 1000 Crss 2 Note : ID = 15A 0 -1 10 10 0 10 1 0 0 10 20 30 40 50 VDS, Drain-Source Voltage [V] QG, Total Gate Charge [nC] FDP15N65 / FDPF15N65 Rev. A 3 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 7. Breakdown Voltage Variation vs. Temperature 1.2 Figure 8. On-Resistance Variation vs. Temperature 3.0 3.0 BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.1 1.0 0.9 Notes : 1. VGS = 0 V 2. ID = 250 A RDS(ON), (Normalized) RDS(ON), On-Resistance Drain-Source(Normalized) Drain-Source On-Resistance 2.5 2.5 2.0 2.0 1.5 1.5 1.0 1.0 * Notes : Notes : = 10 V 1. VGS 1. 2.GS = 10 VA V I = 5.5 D 2. ID = 7.5 A 0.5 0.5 0.8 -100 -50 0 50 100 o 150 200 0.0 0.0 -100 -100 -50 -50 00 50 50 100 100 o 150 150 200 200 TJ, Junction Temperature [ C] o TTJ, Junction Temperature [C] , Junction Temperature [ C] J Figure 9-1. Safe Operating Area for FDP15N65 Figure 9-2. Safe Operating Area for FDPF15N65 10 2 10 s 100 s 10 2 10 s ID, Drain Current [A] 10 1 1 ms 10 ms 100 ms DC ID, Drain Current [A] 100 s 10 1 1 ms 10 ms 100 ms DC Notes : 10 0 Operation in This Area is Limited by R DS(on) 10 0 Operation in This Area is Limited by R DS(on) Notes : 10 -1 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o o 10 -1 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse o o 10 -2 10 0 10 1 10 2 10 3 10 -2 VDS, Drain-Source Voltage [V] 10 0 10 1 10 2 10 3 VDS, Drain-Source Voltage [V] Figure 10. Maximum Drain Current vs. Case Temperature 18 15 ID, Drain Current [A] 12 9 6 3 0 25 50 75 100 125 150 TC, Case Temperature [] FDP15N65 / FDPF15N65 Rev. A 4 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Typical Performance Characteristics (Continued) Figure 11-1. Transient Thermal Response Curve for FDP15N65 10 0 Z JC Thermal Response (t), D = 0 .5 0 .2 0 .1 0 .0 5 0 .0 2 0 .0 1 s in g le p u ls e N o te s : 1 .PDM ( t) = 0 .5 /W M a x . Z JC 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P D M * Z q J C ( t) t 1 10 -1 10 -2 t2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a re W a v e P u ls e D u ra tio n [s e c ] Figure 11-2. Transient Thermal Response Curve for FDPF15N65 10 0 D = 0 .5 0 .2 0 .1 Z JC Thermal Response (t), 10 -1 0 .0 5 0 .0 2 0 .0 1 10 -2 s in g le p u ls e N o te s : 1 . ZPDM = 1 .7 /W M a x . ( t) JC 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P t1 * Z q J C ( t) DM t2 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ] FDP15N65 / FDPF15N65 Rev. A 5 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Gate Charge Test Circuit & Waveform Resistive Switching Test Circuit & Waveforms Unclamped Inductive Switching Test Circuit & Waveforms FDP15N65 / FDPF15N65 Rev. A 6 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Peak Diode Recovery dv/dt Test Circuit & Waveforms FDP15N65 / FDPF15N65 Rev. A 7 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Mechanical Dimensions TO-220 9.90 0.20 1.30 0.10 2.80 0.10 (8.70) o3.60 0.10 (1.70) 4.50 0.20 1.30 -0.05 +0.10 9.20 0.20 (1.46) 13.08 0.20 (1.00) (3.00) 15.90 0.20 1.27 0.10 1.52 0.10 0.80 0.10 2.54TYP [2.54 0.20] 2.54TYP [2.54 0.20] 10.08 0.30 18.95MAX. (3.70) ) (45 0.50 -0.05 +0.10 2.40 0.20 10.00 0.20 Dimensions in Millimeters FDP15N65 / FDPF15N65 Rev. A 8 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET Mechanical Dimensions (Continued) TO-220F 3.30 0.10 10.16 0.20 (7.00) o3.18 0.10 2.54 0.20 (0.70) 6.68 0.20 15.80 0.20 (1.00x45) MAX1.47 9.75 0.30 0.80 0.10 (3 ) 0 0.35 0.10 2.54TYP [2.54 0.20] #1 0.50 -0.05 2.54TYP [2.54 0.20] 4.70 0.20 +0.10 2.76 0.20 9.40 0.20 Dimensions in Millimeters FDP15N65 / FDPF15N65 Rev. A 9 15.87 0.20 www.fairchildsemi.com FDP15N65 / FDPF15N65 650V N-Channel MOSFET TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FACT Quiet SeriesTM FAST(R) FASTrTM FPSTM FRFETTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM DISCLAIMER ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM UltraFET(R) UniFETTM VCXTM WireTM FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I17 Preliminary No Identification Needed Full Production Obsolete Not In Production 10 FDP15N65 / FDPF15N65 Rev. A www.fairchildsemi.com |
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