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Preliminary SGP02N120 SGB02N120, SGD02N120 Fast S-IGBT in NPT-technology * 40% lower Eoff compared to previous generation * Short circuit withstand time - 10 s * Designed for: - Motor controls - Inverter - SMPS * NPT-Technology offers: - very tight parameter distribution - high ruggedness, temperature stable behaviour - parallel switching capability C G E Type SGP02N120 SGB02N120 SGD02N120 SGI02N120 Maximum Ratings Parameter VCE 1200V IC 2A Eoff 0.11mJ Tj 150C Package TO-220AB TO-263AB(D2PAK) TO-252AA(DPAK) TO-262 Ordering Code Q67040-S4270 Q67040-S4271 Q67040-S4269 Q67040-S4291 Symbol VCE IC Value 1200 6.2 2.8 Unit V A Collector-emitter voltage DC collector current TC = 25C TC = 100C Pulsed collector current, tp limited by Tjmax Turn off safe operating area VCE 1200V, Tj 150C Gate-emitter voltage Avalanche energy, single pulse IC = 2A, VCC = 50V, RGE = 25, start at Tj = 25C Short circuit withstand time Power dissipation TC = 25C Operating junction and storage temperature Soldering temperature, 1.6mm (0.063 in.) from case for 10s 1) ICpul s VGE EAS tSC Ptot Tj , Tstg - 9.6 9.6 20 10 10 62 -55...+150 260 V mJ s W C VGE = 15V, 100V VCC 1200V, Tj 150C 1) Allowed number of short circuits: <1000; time between short circuits: >1s. 1 Mar-00 Power Semiconductors Preliminary SGP02N120 SGB02N120, SGD02N120 Thermal Resistance Parameter Characteristic IGBT thermal resistance, junction - case Thermal resistance, junction - ambient SMD version, device on PCB 1) Symbol Conditions Max. Value Unit RthJC RthJA RthJA TO-220AB TO-263AB(D2PAK) 2.0 62 40 K/W Electrical Characteristic, at Tj = 25 C, unless otherwise specified Parameter Static Characteristic Collector-emitter breakdown voltage Collector-emitter saturation voltage V ( B R ) C E S V G E = 0V , I C = 1 00 A VCE(sat) V G E = 15 V , I C = 2 A T j =2 5 C T j =1 5 0 C Gate-emitter threshold voltage Zero gate voltage collector current VGE(th) ICES I C = 10 0 A , V C E = V G E V C E = 12 0 0V , V G E = 0V T j =2 5 C T j =1 5 0 C Gate-emitter leakage current Transconductance Dynamic Characteristic Input capacitance Output capacitance Reverse transfer capacitance Gate charge Internal emitter inductance measured 5mm (0.197 in.) from case Short circuit collector current 2) Symbol Conditions Value min. 1200 2.5 3 typ. 3.1 3.7 4 1.5 205 28 17 11 7 24 max. 3.6 4.3 5 Unit V A 25 100 100 250 34 21 nC nH A nA S pF IGES gfs Ciss Coss Crss QGate LE IC(SC) V C E = 12 0 0V , V G E = 0V V C E = 20 V , I C = 2 A V C E = 25 V , V G E = 0V , f= 1 MH z V C C = 96 0 V, I C =2 A V G E = 15 V T O - 22 0A B V G E = 15 V ,t S C 10 s 10 0 V V C C 12 0 0 V, T j 15 0 C Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6cm (one layer, 70m thick) copper area for collector connection. PCB is vertical without blown air. 2) Allowed number of short circuits: <1000; time between short circuits: >1s. 1) 2 Power Semiconductors 2 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 Switching Characteristic, Inductive Load, at Tj=25 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =2 5 C , V C C = 80 0 V, I C = 2 A, V G E = 15 V /0 V , R G = 91 , Energy losses include "tail" and diode reverse recovery. 23 16 260 61 0.16 0.06 0.22 30 21 340 80 0.21 0.08 0.29 mJ ns Symbol Conditions Value min. typ. max. Unit Switching Characteristic, Inductive Load, at Tj=150 C Parameter IGBT Characteristic Turn-on delay time Rise time Turn-off delay time Fall time Turn-on energy Turn-off energy Total switching energy td(on) tr td(off) tf Eon Eoff Ets T j =1 5 0 C V C C = 80 0 V, I C = 2 A, V G E = 15 V /0 V , R G = 91 Energy losses include "tail" and diode reverse recovery. 26 14 290 85 0.27 0.11 0.38 31 17 350 102 0.33 0.15 0.48 mJ ns Symbol Conditions Value min. typ. max. Unit Power Semiconductors 3 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 12A Ic 10A tp=10s 10A IC, COLLECTOR CURRENT IC, COLLECTOR CURRENT 8A TC=80C 6A TC=110C 4A 50s 1A 150s 500s 0.1A 20ms DC 2A Ic 0.01A 0A 10Hz 100Hz 1kHz 10kHz 100kHz 1V 10V 100V 1000V f, SWITCHING FREQUENCY Figure 1. Collector current as a function of switching frequency (Tj 150C, D = 0.5, VCE = 800V, VGE = +15V/0V, RG = 91) VCE, COLLECTOR-EMITTER VOLTAGE Figure 2. Safe operating area (D = 0, TC = 25C, Tj 150C) 7A 60W 6A 50W 5A 4A 3A 2A 1A 0A 25C 40W 30W 20W 10W 0W 25C IC, COLLECTOR CURRENT Ptot, POWER DISSIPATION 50C 75C 100C 125C 50C 75C 100C 125C TC, CASE TEMPERATURE Figure 3. Power dissipation as a function of case temperature (Tj 150C) TC, CASE TEMPERATURE Figure 4. Collector current as a function of case temperature (VGE 15V, Tj 150C) Power Semiconductors 4 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 7A 6A 5A 4A 3A 2A 1A 0A 0V 7A 6A 5A 4A 3A 2A 1A 0A 0V IC, COLLECTOR CURRENT 1V 2V 3V 4V 5V 6V 7V IC, COLLECTOR CURRENT VGE=17V 15V 13V 11V 9V 7V VGE=17V 15V 13V 11V 9V 7V 1V 2V 3V 4V 5V 6V 7V VCE, COLLECTOR-EMITTER VOLTAGE Figure 5. Typical output characteristics (Tj = 25C) VCE, COLLECTOR-EMITTER VOLTAGE Figure 6. Typical output characteristics (Tj = 150C) 6A 5A 4A 3A 2A 1A 0A 3V Tj=+150C Tj=+25C Tj=-40C VCE(sat), COLLECTOR-EMITTER SATURATION VOLTAGE 7A 6V 5V IC=4A 4V IC=2A 3V IC=1A 2V IC, COLLECTOR CURRENT 1V 5V 7V 9V 11V 0V -50C 0C 50C 100C 150C VGE, GATE-EMITTER VOLTAGE Figure 7. Typical transfer characteristics (VCE = 20V) Tj, JUNCTION TEMPERATURE Figure 8. Typical collector-emitter saturation voltage as a function of junction temperature (VGE = 15V) Power Semiconductors 5 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 td(off) td(off) t, SWITCHING TIMES 100ns t, SWITCHING TIMES tf 100ns tf td(on) tr td(on) tr 10ns 0A 2A 4A 6A 8A 10ns 0 50 100 150 IC, COLLECTOR CURRENT Figure 9. Typical switching times as a function of collector current (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, RG = 9 1) RG, GATE RESISTOR Figure 10. Typical switching times as a function of gate resistor (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, IC = 2A) 6V td(off) VGE(th), GATE-EMITTER THRESHOLD VOLTAGE 5V max. t, SWITCHING TIMES 100ns 4V tf 3V typ. td(on) 2V min. 1V tr 10ns -50C 0C 50C 100C 150C 0V -50C 0C 50C 100C 150C Tj, JUNCTION TEMPERATURE Figure 11. Typical switching times as a function of junction temperature (inductive load, VCE = 800V, VGE = +15V/0V, IC = 2A, RG = 9 1) Tj, JUNCTION TEMPERATURE Figure 12. Gate-emitter threshold voltage as a function of junction temperature (IC = 0.3mA) Power Semiconductors 6 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 2.0mJ *) Eon and Ets include losses due to diode recovery. 0.5mJ Ets* *) Eon and Ets include losses due to diode recovery. E, SWITCHING ENERGY LOSSES 1.5mJ E, SWITCHING ENERGY LOSSES 0.4mJ Ets* 0.3mJ 1.0mJ Eon* Eon* 0.2mJ 0.5mJ Eoff 0.1mJ Eoff 0.0mJ 0A 2A 4A 6A 8A 0.0mJ 0 50 100 150 IC, COLLECTOR CURRENT Figure 13. Typical switching energy losses as a function of collector current (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, RG = 9 1) RG, GATE RESISTOR Figure 14. Typical switching energy losses as a function of gate resistor (inductive load, Tj = 150C, VCE = 800V, VGE = +15V/0V, IC = 2A) 0.4mJ *) Eon and Ets include losses due to diode recovery. ZthJC, TRANSIENT THERMAL IMPEDANCE Ets* D=0.5 10 K/W 0.2 0.1 0.05 10 K/W 0.02 0.01 R1 R2 -1 0 E, SWITCHING ENERGY LOSSES 0.3mJ Eon* 0.2mJ R,(K/W) 0.66735 0.70472 0.62778 , (s)= 0.04691 0.00388 0.00041 0.1mJ Eoff 10 K/W single pulse C 1 = 1 / R 1 C 2 = 2 /R 2 -2 0.0mJ -50C 0C 50C 100C 150C 1s 10s 100s 1ms 10ms 100ms 1s Tj, JUNCTION TEMPERATURE Figure 15. Typical switching energy losses as a function of junction temperature (inductive load, VCE = 800V, VGE = +15V/0V, IC = 2A, RG = 9 1) tp, PULSE WIDTH Figure 16. IGBT transient thermal impedance as a function of pulse width (D = tp / T) Power Semiconductors 7 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 20V Ciss VGE, GATE-EMITTER VOLTAGE 15V C, CAPACITANCE 100pF 10V UCE=960V 5V Coss Crss 0V 0nC 5nC 10nC 15n 10pF 0V 10V 20V 30V QGE, GATE CHARGE Figure 17. Typical gate charge (IC = 2A) VCE, COLLECTOR-EMITTER VOLTAGE Figure 18. Typical capacitance as a function of collector-emitter voltage (VGE = 0V, f = 1MHz) 30s 40A tsc, SHORT CIRCUIT WITHSTAND TIME 25s IC(sc), SHORT CIRCUIT COLLECTOR CURRENT 11V 12V 13V 14V 15V 30A 20s 15s 20A 10s 10A 5s 0s 10V 0A 10V 12V 14V 16V 18V 20V VGE, GATE-EMITTER VOLTAGE Figure 19. Short circuit withstand time as a function of gate-emitter voltage (VCE = 1200V, start at Tj = 25C) VGE, GATE-EMITTER VOLTAGE Figure 20. Typical short circuit collector current as a function of gate-emitter voltage (100V VCE 1200V, TC = 25C, Tj 150C) Power Semiconductors 8 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 TO-220AB symbol dimensions [mm] min max 10.30 15.95 0.86 3.89 3.00 6.80 14.00 4.75 0.65 1.32 min [inch] max 0.4055 0.6280 0.0339 0.1531 0.1181 0.2677 0.5512 0.1870 0.0256 0.0520 A B C D E F G H K L M N P T 9.70 14.88 0.65 3.55 2.60 6.00 13.00 4.35 0.38 0.95 0.3819 0.5858 0.0256 0.1398 0.1024 0.2362 0.5118 0.1713 0.0150 0.0374 2.54 typ. 4.30 1.17 2.30 4.50 1.40 2.72 0.1 typ. 0.1693 0.0461 0.0906 0.1772 0.0551 0.1071 TO-263AB (D2Pak) symbol dimensions [mm] min max 10.20 1.30 1.60 1.07 min [inch] max 0.4016 0.0512 0.0630 0.0421 A B C D E F G H K L M N P Q R S T U V W X Y Z 9.80 0.70 1.00 1.03 0.3858 0.0276 0.0394 0.0406 2.54 typ. 0.65 0.85 0.1 typ. 0.0256 0.0335 5.08 typ. 4.30 1.17 9.05 2.30 4.50 1.37 9.45 2.50 0.2 typ. 0.1693 0.0461 0.3563 0.0906 0.1772 0.0539 0.3720 0.0984 15 typ. 0.00 4.20 2.40 0.40 10.80 1.15 6.23 4.60 9.40 16.15 0.20 5.20 3.00 0.60 0.5906 typ. 0.0000 0.1654 0.0945 0.0157 0.0079 0.2047 0.1181 0.0236 8 max 8 max 0.4252 0.0453 0.2453 0.1811 0.3701 0.6358 Power Semiconductors 9 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 TO-252AA (DPak) symbol [mm] dimensions [inch] min A B C D E F G H K L M N P R S T U 2.19 0.76 0.90 5.97 9.40 0.46 0.87 0.51 5.00 4.17 0.26 6.40 5.25 (0.65) 0.63 2.28 max 6.73 5.50 (1.15) 0.89 min 0.2520 0.2067 max 0.2650 0.2165 (0.0256) (0.0453) 0.0248 0.0350 0.2520 2.39 0.98 1.21 6.23 10.40 0.58 1.15 1.02 0.0862 0.0299 0.0354 0.2350 0.3701 0.0181 0.0343 0.0201 0.1969 0.1642 0.0102 0.0941 0.0386 0.0476 0.2453 0.4094 0.0228 0.0453 0.0402 - Power Semiconductors 10 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 i,v diF /dt tr r =tS +tF Qr r =QS +QF tr r IF tS QS tF 10% Ir r m t VR Ir r m QF dir r /dt 90% Ir r m Figure C. Definition of diodes switching characteristics 1 Tj (t) p(t) 2 r2 r1 n rn r1 r2 rn Figure A. Definition of switching times TC Figure D. Thermal equivalent circuit Figure B. Definition of switching losses Power Semiconductors 11 Mar-00 Preliminary SGP02N120 SGB02N120, SGD02N120 Published by Infineon Technologies AG i Gr., Bereich Kommunikation St.-Martin-Strasse 53, D-81541 Munchen (c) Infineon Technologies AG 1999 All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as warranted characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Infineon Technologies is an approved CECC manufacturer. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Power Semiconductors 12 Mar-00 This datasheet has been download from: www..com Datasheets for electronics components. |
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