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INTEGRATED CIRCUITS
DATA SHEET
74HC3G07; 74HCT3G07 Buffer with open-drain outputs
Product specification 2003 Oct 15
Philips Semiconductors
Product specification
Buffer with open-drain outputs
FEATURES * Wide supply voltage range from 2.0 to 6.0 V * High noise immunity * Low power dissipation * ESD protection: HBM EIA/JESD22-A114-A exceeds 2000 V MM EIA/JESD22-A115-A exceeds 200 V. * Multiple package options * Specified from -40 to +85 C and -40 to +125 C. DESCRIPTION
74HC3G07; 74HCT3G07
The 74HC3G/HCT3G07 is a high-speed Si-gate CMOS device. Specified in compliance with JEDEC standard no. 7A. The 74HC3G/HCT3G07 provides three non-inverting buffers. The outputs of the 74HC3G/HCT3G07 devices are open drains and can be connected to other open-drain outputs to implement active-LOW, wired-OR or active-HIGH wired-AND functions. For digital operation this device must have a pull-up resistor to establish a logic HIGH-level.
QUICK REFERENCE DATA GND = 0 V; Tamb = 25 C; tr = tf 6.0 ns. TYPICAL SYMBOL tPZL tPLZ CI CPD Notes 1. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD x VCC2 x fi x N + (CL x VCC2 x fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; (CL x VCC2 x fo) = sum of outputs. 2. For 74HC3G07 the condition is VI = GND to VCC. For 74HCT3G07 the condition is VI = GND to VCC - 1.5 V. PARAMETER propagation delay nA to nY propagation delay nA to nY input capacitance power dissipation capacitance notes 1 and 2 CONDITIONS HC3G CL = 50 pF; VCC = 4.5 V CL = 50 pF; VCC = 4.5 V 9 11 1.5 4 HCT3G 11 10 1.5 4 ns ns pF pF UNIT
2003 Oct 15
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Philips Semiconductors
Product specification
Buffer with open-drain outputs
FUNCTION TABLE See note 1. INPUT nA L H Note 1. H = HIGH voltage level; L = LOW voltage level; Z = high-impedance OFF-state. ORDERING INFORMATION PACKAGES TYPE NUMBER TEMPERATURE RANGE 74HC3G07DP 74HCT3G07DP 74HC3G07DC 74HCT3G07DC PINNING PIN 1 2 3 4 5 6 7 8 1A 3Y 2A GND 2Y 3A 1Y VCC SYMBOL data input data output data input ground (0 V) data output data input data output supply voltage -40 to +125 C -40 to +125 C -40 to +125 C -40 to +125 C PINS 8 8 8 8 PACKAGE TSSOP8 TSSOP8 VSSOP8 VSSOP8
74HC3G07; 74HCT3G07
OUTPUT nY L Z
MATERIAL plastic plastic plastic plastic
CODE SOT505-2 SOT505-2 SOT765-1 SOT765-1
MARKING H07 T07 H07 T07
DESCRIPTION
2003 Oct 15
3
Philips Semiconductors
Product specification
Buffer with open-drain outputs
74HC3G07; 74HCT3G07
handbook, halfpage
1
handbook, halfpage
1A
1Y
7
1A 1 3Y 2
8 VCC 7 1Y 3A 2Y 6 3A 3Y 2 3 2A 2Y 5
07
2A GND 3 4
MNB135 MNB136
6 5
Fig.1 Pin configuration.
Fig.2 Logic symbol.
handbook, halfpage
1A
1
1
7
1Y
handbook, halfpage
Y
2A
3
1
5
2Y A
3A
6
1
GND 2 3Y
MNA591
MNB137
Fig.3 IEC logic symbol.
Fig.4 Logic diagram (one driver).
2003 Oct 15
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Philips Semiconductors
Product specification
Buffer with open-drain outputs
RECOMMENDED OPERATING CONDITIONS 74HC3G07 SYMBOL VCC VI VO Tamb PARAMETER supply voltage input voltage output voltage operating ambient temperature input rise and fall times CONDITIONS MIN. 2.0 0 0 see DC and AC -40 characteristics per device VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V - - - TYP. 5.0 - - +25
74HC3G07; 74HCT3G07
74HCT3G07 UNIT MIN. 4.5 0 0 -40 TYP. 5.0 - - +25 MAX. 5.5 5.5 VCC +125 V V V C
MAX. 6.0 6.0 VCC +125
tr, tf
- 6.0 -
1000 500 400
- - -
- 6.0 -
- 500 -
ns ns ns
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK IOK VO IO ICC Tstg PD Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. Above 110 C the value of PD derates linearly with 8 mW/K. PARAMETER supply voltage input diode current output diode current output voltage output sink current VCC or GND current storage temperature power dissipation Tamb = -40 to +125 C; note 2 VI < -0.5 V or VI > VCC + 0.5 V VO < -0.5 V active mode; note 1 high-impedance mode; note 1 -0.5 V < VO < 7.0 V note 1 CONDITIONS MIN. -0.5 - - -0.5 -0.5 - - -65 - +7.0 20 -20 VCC + 0.5 7.0 -25 50 +150 300 MAX. UNIT V mA mA V V mA mA C mW
2003 Oct 15
5
Philips Semiconductors
Product specification
Buffer with open-drain outputs
DC CHARACTERISTICS
74HC3G07; 74HCT3G07
Type 74HC3G07 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +85 C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA ILI IOZ ICC input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current VI = VCC or GND; IO = 0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 6.0 - - - - - - - - 0 0 0 0.15 0.16 - - - - - - - - - - - - - - - - - 0.1 0.1 0.1 0.33 0.33 1.0 5.0 10 - - - 0.5 1.35 1.8 0.1 0.1 0.1 0.4 0.4 1.0 10 20 V V V V V A A A 1.5 3.15 4.2 - - - 1.2 2.4 3.2 0.8 2.1 2.8 - - - 0.5 1.35 1.8 V V V V V V VCC (V) MIN. TYP.(1) MAX. UNIT
Tamb = -40 to +125 C VIH HIGH-level input voltage 2.0 4.5 6.0 VIL LOW-level input voltage 2.0 4.5 6.0 VOL LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 20 A IO = 20 A IO = 4.0 mA IO = 5.2 mA ILI IOZ ICC Note 1. All typical values are measured at Tamb = 25 C. 2003 Oct 15 6 input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current VI = VCC or GND; IO = 0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 6.0 - - - - - - - - V V V V V A A A 1.5 3.15 4.2 - - - V V V V V V
Philips Semiconductors
Product specification
Buffer with open-drain outputs
74HC3G07; 74HCT3G07
Type 74HCT3G07 At recommended operating conditions; voltages are referenced to GND (ground = 0 V). TEST CONDITIONS SYMBOL PARAMETER OTHER Tamb = -40 to +85 C VIH VIL VOL HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA ILI IOZ ICC ICC input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current additional supply current per input VI = VCC or GND; IO = 0 VI = VCC - 2.1 V; IO = 0 4.5 4.5 5.5 5.5 5.5 4.5 to 5.5 - - - - - - 0 0.15 - - - - 0.1 0.33 1.0 5.0 10 375 V V A A A A 4.5 to 5.5 4.5 to 5.5 2.0 - 1.6 1.2 - 0.8 V V VCC (V) MIN. TYP.(1) MAX. UNIT
Tamb = -40 to +125 C VIH VIL VOL HIGH-level input voltage LOW-level input voltage LOW-level output voltage VI = VIH or VIL IO = 20 A IO = 4.0 mA ILI IOZ ICC ICC Note 1. All typical values are measured at Tamb = 25 C. input leakage current VI = VCC or GND 3-state output OFF current VI = VIH or VIL; VO = VCC or GND quiescent supply current additional supply current per input VI = VCC or GND; IO = 0 VI = VCC - 2.1 V; IO = 0 4.5 4.5 5.5 5.5 5.5 4.5 to 5.5 - - - - - - - - - - - - 0.1 0.4 1.0 10 20 410 V V A A A A 4.5 to 5.5 4.5 to 5.5 2.0 - - - - 0.8 V V
2003 Oct 15
7
Philips Semiconductors
Product specification
Buffer with open-drain outputs
AC CHARACTERISTICS Type 74HC3G07 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C tPZL propagation delay see Figs 5 and 6 2.0 nA to nY 4.5 6.0 tPLZ propagation delay see Figs 5 and 6 2.0 nA to nY 4.5 6.0 tTHL output transition time see Figs 5 and 6 2.0 4.5 6.0 Tamb = -40 to +125 C tPZL propagation delay see Figs 5 and 6 2.0 nA to nY 4.5 6.0 tPLZ propagation delay see Figs 5 and 6 2.0 nA to nY 4.5 6.0 tTHL output transition time see Figs 5 and 6 2.0 4.5 6.0 Note 1. All typical values are measured at Tamb = 25 C. - - - - - - - - - - - - - - - - - - - - - - - - - - - 25 9 7 25 11 10 18 6 5 VCC (V) MIN.
74HC3G07; 74HCT3G07
TYP.(1)
MAX.
UNIT
95 19 16 95 23 23 95 19 16
ns ns ns ns ns ns ns ns ns
125 25 20 125 30 26 125 25 20
ns ns ns ns ns ns ns ns ns
2003 Oct 15
8
Philips Semiconductors
Product specification
Buffer with open-drain outputs
Type 74HCT3G07 GND = 0 V; tr = tf 6.0 ns; CL = 50 pF. TEST CONDITIONS SYMBOL PARAMETER WAVEFORMS Tamb = -40 to +85 C tPZL tPLZ tTHL propagation delay see Figs 5 and 6 nA to nY propagation delay see Figs 5 and 6 nA to nY output transition time see Figs 5 and 6 4.5 4.5 4.5 - - - VCC (V) MIN.
74HC3G07; 74HCT3G07
TYP.(1)
MAX.
UNIT
11 10 6
27 26 19
ns ns ns
Tamb = -40 to +125 C tPZL tPLZ tTHL Note 1. All typical values are measured at Tamb = 25 C. propagation delay see Figs 5 and 6 nA to nY propagation delay see Figs 5 and 6 nA to nY output transition time see Figs 5 and 6 4.5 4.5 4.5 - - - - - - 32 31 22 ns ns ns
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Philips Semiconductors
Product specification
Buffer with open-drain outputs
AC WAVEFORMS
74HC3G07; 74HCT3G07
handbook, full pagewidth
VI nA input GND t PLZ VCC nY output VOL VX
MNA528
VM
t PZL
VM
For 74HC3G07: VM = 50%; VI = GND to VCC. For 74HCT3G07: VM = 1.3 V; VI = GND to 3.0 V. For 74HC3G07 and 74HCT3G07: VX = 0.1 x VCC.
Fig.5 The input (nA) to output (nY) propagation delays and transition times.
handbook, full pagewidth
S1 VCC PULSE GENERATOR VI D.U.T. RT CL = 50 pF
MNA742
VCC open GND
RL = VO 1 k
TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH open VCC GND
S1
Definitions for test circuit: RL = Load resistor. CL = load capacitance including jig and probe capacitance. RT = termination resistance should be equal to the output impedance Zo of the pulse generator.
Fig.6 Load circuitry for switching times.
2003 Oct 15
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Philips Semiconductors
Product specification
Buffer with open-drain outputs
PACKAGE OUTLINES
74HC3G07; 74HCT3G07
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm
SOT505-2
D
E
A
X
c y HE vMA
Z
8
5
A pin 1 index
A2 A1
(A3)
Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.1 A1 0.15 0.00 A2 0.95 0.75 A3 0.25 bp 0.38 0.22 c 0.18 0.08 D(1) 3.1 2.9 E(1) 3.1 2.9 e 0.65 HE 4.1 3.9 L 0.5 Lp 0.47 0.33 v 0.2 w 0.13 y 0.1 Z(1) 0.70 0.35 8 0
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT505-2 REFERENCES IEC JEDEC --JEITA EUROPEAN PROJECTION ISSUE DATE 02-01-16
2003 Oct 15
11
Philips Semiconductors
Product specification
Buffer with open-drain outputs
74HC3G07; 74HCT3G07
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm
SOT765-1
D
E
A X
c y HE vMA
Z
8
5
Q A pin 1 index A2 A1 (A3) Lp L
1
e bp
4
wM
detail X
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1 A1 0.15 0.00 A2 0.85 0.60 A3 0.12 bp 0.27 0.17 c 0.23 0.08 D(1) 2.1 1.9 E(2) 2.4 2.2 e 0.5 HE 3.2 3.0 L 0.4 Lp 0.40 0.15 Q 0.21 0.19 v 0.2 w 0.13 y 0.1 Z(1) 0.4 0.1 8 0
Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT765-1 REFERENCES IEC JEDEC MO-187 JEITA EUROPEAN PROJECTION
ISSUE DATE 02-06-07
2003 Oct 15
12
Philips Semiconductors
Product specification
Buffer with open-drain outputs
DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development
74HC3G07; 74HCT3G07
DEFINITION This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
II
Preliminary data Qualification
III
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2003 Oct 15
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Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R44/01/pp14
Date of release: 2003
Oct 15
Document order number:
9397 750 12067

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