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Datasheet File OCR Text: |
3.5x2.8 mm SMD CHIP LED LAMP APED3528EC HIGH EFFICIENCY RED Features !SINGLE COLOR. !SUITABLE Description The High Efficiency Red source color devices are made with Gallium Arsenide Phosphide on Gallium Phosphide Orange Light Emitting Diode. FOR ALL SMT ASSEMBLY AND " SOLDER PROCESS. !IDEAL FOR BACKLIGHTING. !AVAILABLE !PACKAGE ON TAPE AND REEL. : 500PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.2(0.0079") unless otherwise noted. 3. Specifications are subject to change without notice. SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 1 OF 4 Selection Guide Par t No . Dic e L en s Ty p e Iv (m c d ) @ 20 m A Min . A P E D 3528E C HIGH EFFICIENCY RED (GaAsP/ GaP ) WATER CLEAR 18 Ty p . 50 V i ew i n g An g l e 21/2 40 Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at T)=25C Sy m b o l peak D 1/2 C VF IR Par am et er Peak Wavelength Dominate Wavelength D ev i c e High Efficiency Red High Efficiency Red Ty p . 6 27 6 25 45 15 2.0 2.5 10 Max . Un it s nm nm nm pF V uA Tes t Co n d it io n s I F =20mA I F =20mA I F =20mA VF=0V;f=1MHz I F =20mA VR = 5V Spectral Line Half-width High Efficiency Red Capacitance Forward Voltage Reverse Current High Efficiency Red High Efficiency Red High Efficiency Red Absolute Maximum Ratings at T)=25C Par am et er Power dissipation DC Forward Current Peak Forward Current [1] Reverse Voltage Operating/Storage Temperature Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. H i g h E f f i c i en c y R ed 105 30 16 0 5 -40C To +85C Un it s mW mA mA V SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 2 OF 4 High Efficiency Red APED3528EC SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 3 OF 4 APED3528EC SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) SPEC NO: DSAD1054 APPROVED : J. Lu REV NO: V.1 CHECKED : Allen Liu DATE:MAR/18/2003 DRAWN: L.ZHANG PAGE: 4 OF 4 |
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