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| CYStech Electronics Corp. Dual zener diodes Spec. No. : C334N3 Issued Date : 2003.05.22 Revised Date : Page No. : 1/3 BZ5239CAN3/BZ5239CCN3 Description Two ZD5239 diodes are encapsulated in a SOT-23 small plastic SMD package. Two different pinnings are available. Pinning Pin 1 2 3 Description BZ5239CA BZ5239CC K1 A1 K2 A2 A1,A2 K1,K2 Outline SOT-23 3 1 2 Marking: (1)BZ5239CA (2)BZ5239CC Type Marking Code BZ5239CAN3 29A BZ5239CCN3 29C Diode configuration and symbol Thermal Characteristics * Maximum Temperatures Storage Temperature Tstg ................................................................................................... -55~+150 C Junction Temperature Tj ............................................................................................................. +150 C * Maximum Power Dissipation Total Power Dissipation (Ta=25C) Ptot .. ................................................................................ 230 mW * Thermal Resistance, Junction to Ambient JA......................................................543 /W BZ5239CAN3/BZ5239CCN3 CYStek Product Specification CYStech Electronics Corp. Electrical Characteristic (VF=0.9V Max @IF=10mA.) Test Current IZT(mA) 20 Zener Voltage VZ(V) 9.1 5% ZZK IZ=0.25mA (, max) 600 ZZT IZ=IZT (, max) 10 Spec. No. : C334N3 Issued Date : 2003.05.22 Revised Date : Page No. : 2/3 Maximum Reverse Current IR(A) 3.0 VR(V) 7.0 Characteristic Curves Power Derating Curve 250 100 Reverse Current vs Reverse Voltage Power Dissipation---PD(mW) 200 Reverse Current (mA) 80 150 60 100 40 50 20 0 0 50 100 150 200 Ambient Temperature --- Ta( ) 0 4000 5000 6000 7000 8000 Reverse Voltage (mV) 9000 10000 Forward Current vs Forward Voltage 300 250 200 Forward Current (mA) 150 100 50 0 0 200 400 600 800 Forward Voltage (mV) 1000 1200 BZ5239CAN3/BZ5239CCN3 CYStek Product Specification CYStech Electronics Corp. SOT-23 Dimension Diagram: L 3 B 1 2 S Spec. No. : C334N3 Issued Date : 2003.05.22 Revised Date : Page No. : 3/3 A Marking: L4_ 29X V G C D K 3-Lead SOT-23 Plastic Surface Mounted Package. CYStek Package Code: N3 J H * BZ5239CAN3: Common Anode. (Marking Code : 29A ) * BZ5239CCN3: Common Cathode. (Marking Code : 29C ) *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.85 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. BZ5239CAN3/BZ5239CCN3 CYStek Product Specification |
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