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| CYStech Electronics Corp. 100V/100mA SURFACE MOUNT SWITCHING DIODE Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 1/3 CASD355SG Features: Small surface mounting type High reliability High speed(trr<4ns) Mechanical data: Case: Molded plastic, JEDEC SOD-323 Terminals : Solder plated, solderable per MIL-STD-750, method 2026. Polarity: Indicated by cathode band Mounting position: Any Weight: 0.000159 ounce, 0.0045 gram Absolute Maximum Ratings(At Ta=25, unless otherwise noted) Characteristics Repetitive Peak Reverse Voltage Average Forward Current, VR=0 Peak Forward Surge Current, tp<1s Power Dissipation Junction Temperature Storage Temperature Range Symbol VRRM IFAV IFSM PD Tj Tstg Value 100 100 500 350 175 -55 to +175 Unit V mA mA mW C C Electrical Characteristics ( At Ta=25C, unless otherwise noted) Parameter Forward Voltage Reverse Current Breakdown Voltage Diode Capacitance Reverse Recovery Time Conditions IF=10mA VR=25V VR=25V, Tj=150 VR=80V IR=100A, Tp/T=0.01, Tp=0.3ms VR=0, f=1MHz, VHF=50mV IF=10mA,VR=6V,IRR=0.1xIR, RL=100 Symbol VF IR IR IR V(BR) CD trr Min 100 Typ Max 1.2 100 50 30 4 4 Unit V nA A A V pF ns CASD355SG CYStek Product Specification CYStech Electronics Corp. Characteristic Curves Reverse Leakage Current vs Junction Temperature 1000 R(A) Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 2/3 Forward Current vs Forward Voltage 1000 F(mA) Instantaneous Forward Current---I 100 VR=80V / Max. Values Reverse Leakage Current---I 100 Tj=25 Pulse Width 300s 1% Duty Cycle 10 1 VR=80V / Typ Values 10 Scattering Limit 0.1 VR=25V / Typ. Values 1 0.01 0 20 40 60 80 100 120 140 160 180 200 Junction Temperature---Tj() 0.1 0 0.4 0.8 1.2 1.6 2 Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage 1000 3 Tj= 25 100 Scattering Limit 10 Capacitance vs Reverse Voltage Reverse Leakage Current---I R(nA) Diode Capacitance ---C D(pF) 2.5 f=1MHz Ta=25 2 1.5 1 1 1 10 100 0.5 0.1 1 10 100 Reverse Voltage---VR(V) Reverse Voltage---VR(V) CASD355SG CYStek Product Specification CYStech Electronics Corp. SOD-323F Dimension Spec. No. : C332SG Issued Date : 2004.03.26 Revised Date : Page No. : 3/3 SOD-323F Plastic Surface Mounted Package CYStek Package Code:SG *:Typical DIM A B C Inches Min. Max. 0.090 0.106 0.045 0.053 0.012(typ) Millimeters Min. Max. 2.3 2.7 1.15 1.35 0.3(typ) DIM D R Inches Min. Max. 0.028 0.035 0.02(typ) Millimeters Min. Max. 0.7 0.9 0.5(typ) Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. * CYStek reserves the right to make changes to its products without notice. * CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. CASD355SG CYStek Product Specification |
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