Part Number Hot Search : 
MC68331 LR8203 L78M05C SMAJ15 4568D EL5177IY 5311F SSR10C40
Product Description
Full Text Search
 

To Download CHA4094-99F00 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 CHA4094
36-40GHz High Power Amplifier
GaAs Monolithic Microwave IC Description
The CHA4094 is a high gain broadband threestage balanced monolithic power amplifier. It is designed for a wide range of applications, from military to commercial communication systems. The circuit is manufactured with a PM-HEMT process, 0.25m gate length, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Typical on wafer measurements :
15
Main Features
Broadband performances 22 dBm output power ( 1dB gain comp. ) 9 dB 1 dB gain Chip size : 1.65 X 2.05 X 0.10 mm
10 5 0 -5 -10
Gain
(dB) -15
-20 -25 -30 28 30 32 34 36 38 40 42
OUT
IN
Frequency (GHz)
Main Characteristics
Tamb. = 25C
Symbol
Fop G P1dB Id Small signal gain Output power at 1dB gain compression Bias current
Parameter
Operating frequency range
Min
36 7
Typ
9 22 750
Max
40
Unit
GHz dB dBm
920
mA
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHA40949349 - 15 Dec. 99
1/4
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Departementale 128 - B.P.46 - 91401 Orsay Cedex France Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHA4094
Tamb = +25C, Vd1,2,3 = 3.5Volts Symbol
Fop G G Is P1db VSWRin
36-40GHz High Power Amplifier
Electrical Characteristics for Broadband Operation
Parameter
Operating frequency range (1) Small signal gain (1) (2) Small signal gain flatness (1) (2) Reverse isolation (1) Pulsed Output power at 1dB gain compression (1) Input VSWR (1)
Min
36 7
Typ
Max
40
Unit
GHz dB dB dB dBm
9 1 30 22 2.0:1 2.0:1 750 920
VSWRout Output VSWR (1) Id Bias current (3)
mA
(1) These values are representative of on-wafer measurements that are made without bonding wires at the RF ports. In the case of a jig or a module CW mode operation, the typical output power may be around 2dB less. (2) Vd1, 2, 3 = 2Volts (3) Depends on Biasing point, see application note for recommended biasing point
Absolute Maximum Ratings
Tamb. = 25C (1) Symbol Vd Id Vg Ta Drain bias voltage Drain bias current Gate bias voltage Operating temperature range Parameter Values 4 1200 -2 to +0.4 -40 to +85 Unit V mA V C
Tstg
(1)
Storage temperature range
-55 to +155
C
Operation of this device above anyone of these parameters may cause permanent damage.
Ref. : DSCHA40949349 - 15 Dec. 99
2/4
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
36-40GHz High Power Amplifier
Typical On Jig Measurements
Bias Conditions : Tamb = +25C, Vd = 3.5Volt, Vg = -0.2Volt.
15 10 5 Gain
CHA4094
(dB)
0 -5 -10 -15 -20 30 32 34 36 38 40 OUT IN
Frequency (GHz)
25 23 21 19 17 15 13 11 9 7 5 -5
25 23 21 19 17 15 13 11 9 7 5
-5
Freq= 36 GHz Pout (dBm)
Freq= 38GHz Pout (dBm)
Gain (dB)
Gain (dB)
0
5
10
15
20
0
5
10
15
Input power (dBm)
25 23 21 19 17 15 13 11 9 7 5
-5
Input power (dBm)
Freq= 40GHz
Pout (dBm)
Gain (dB)
0
5
10
15
Input power (dBm)
Application note
The given DC Bias condition in table or curves are for class A biasing point. This amplifier could be used in class AB. For this the Gate voltage must be adjusted for a total drain supply current of typically 500mA. The loss in linear gain is around 0.4dB, but the output power at 1dB compression point is higher, between 0.5 and 1dBm more. This biasing point shows a main advantage in regard of thermal aspect. Indeed the junction temperature in transistor decreases approximatively of 10C for 20% reduction in drain current.
Ref. : DSCHA40949349 - 15 Dec. 99
3/4
Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
CHA4094
36-40GHz High Power Amplifier
Chip Assembly and Mechanical Data
Note : Supply feed should be capacitively bypassed.
Bonding pad positions.
( Chip thickness : 100m. All dimensions are in micrometers )
Ordering Information
Chip form : CHA4094-99F/00
Information furnished is believed to be accurate and reliable. However united monolithic semiconductors S.A.S. assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of united monolithic semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United monolithic semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from united monolithic semiconductors S.A.S.
Ref. : DSCHA40949349 - 15 Dec. 99 4/4 Specifications subject to change without notice
Route Departementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09


▲Up To Search▲   

 
Price & Availability of CHA4094-99F00

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X