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| PROCESS Zener Diode CPZ18 Central TM 0.5 Watt Zener Diode Chip Semiconductor Corp. PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 14 X 14 MILS 7.5 MILS 9.5 X 9.5 MILS Al - 30,000A Au - 14,000A GEOMETRY GROSS DIE PER 4 INCH WAFER 61,141 PRINCIPAL DEVICE TYPES CMPZ5221B THRU CMPZ5234B BACKSIDE CATHODE 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R2 (1-August 2002) Central TM PROCESS CPZ18 Semiconductor Corp. Typical Electrical Characteristics 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R2 (1-August 2002) |
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