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DK27..FA
DK27..FA
Fast Switching Thyristor
Replaces January 2000 version, DS4269-3.0 DS4269-4.0 July 2001
FEATURES
s Low Switching Losses At High Frequency s Fully Characterised For Operation Up To 20kHz
KEY PARAMETERS VDRM IT(RMS) ITSM dVdt dI/dt tq 1200V 290A 5000A 200V/s 500A/s 20s
APPLICATIONS
s High Power Inverters And Choppers s UPS s AC Motor Drives s Induction Heating s Cycloconverters
VOLTAGE RATINGS
Type Number Repetitive Peak Voltages VDRM VRRM V 1200 1000 Conditions
DK27 12FA K or M DK27 10FA K or M
VRSM = VRRM + 100V IDRM = IRRM = 25mA at VRRM or VDRM & Tvj Outline type code: TO93 See Package Details for further information. Fig. 1 Package outline
ORDERING INFORMATION
When ordering, select the required part number shown in the Voltage Ratings selection table, then:Add K to type number for 3/4" 16 UNF thread, e.g. DK27 12FAK or Add M to type number for M16 thread, e.g. DK27 12FAM. Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order.
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CURRENT RATINGS
Symbol IT(AV) IT(RMS) Parameter Mean on-state current RMS value Conditions Half wave resistive load, Tcase = 80oC Tcase = 80oC Max. 185 290 Units A A
SURGE RATINGS
Symbol ITSM I2t Parameter Surge (non-repetitive) on-state current I2t for fusing Conditions tp 10ms half sine; Tcase = 125oC VR = 0% VRRM - 1/4 sine Max. 5.0 125.0 x 103 Units kA A2s
THERMAL AND MECHANICAL DATA
Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink dc Mounting torque 35.0Nm with mounting compound On-state (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Mounting torque -40 30.0 125 150 35.0
o
Conditions
Min. -
Max. 0.13 0.06 125
Units
o
C/W C/W
o
o
C
C C
o
Nm
MEASUREMENT OF RECOVERED CHARGE - QRA1
Measurement of QRA1 : QRA1 = IRR x tRR 2 ITM QRA1 tp = 1ms dIR/dt IRR
0.5x IRR
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DYNAMIC CHARACTERISTICS
Symbol VTM IRRM/IDRM dV/dt Parameter Maximum on-state voltage Peak reverse and off-state current Maximum linear rate of rise of off-state voltage Conditions At 600A peak, Tcase = 25oC At VRRM/VDRM, Tcase = 125oC Linear to 60% VDRM Tj = 125oC, Gate open circuit Gate source 20V, 20 dI/dt Rate of rise of on-state current tr < 0.5s, Tj = 125C VT(TO) rT tgd t(ON)TOT IH tq Threshold voltage On-state slope resistance Delay time Total turn-on time Holding current Turn-off time At Tvj = 125oC At Tvj = 125oC Tj = 25C, IT = 50A, VD = 300V, IG = 1A, dI/dt = 30A/s, dIG/dt = 1A/s Tj = 25oC, ITM = 1A, VD = 12V Tj = 125C, IT = 200A, VR = 50V, tq code: A dV/dt = 200V/s (Linear to 60% VDRM), dIR/dt = 30A/s, Gate open circuit Non-repetitive 1.5* 3* 800 1.2 1.0 70 20 A/s V m s s mA s Repetitive 50Hz Min. Max. 1.85 25 200 500 Units V mA V/s A/s
*Typical value.
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol VGT IGT VGD VRGM IFGM PGM PG(AV) Parameter Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power Anode positive with respect to cathode Conditions VDRM = 12V, Tcase = 25oC, RL = 6 VDRM = 12V, Tcase = 25oC, RL = 6 At VDRM Tcase = 125oC, RL = 1k Typ. Max. 3.0 200 0.2 5.0 4 16 3.0 Units V mA V V A W W
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CURVES
Fig.2 Maximum (limit) on-state characteristics
Fig.3 Gate characteristics
Fig.4 Typical recovered charge (for a device rated VDRM = 800V, tq = 20s)
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Fig.5 Transient thermal impedance - junction to case
Fig.6 Non-repetitive sub-cycle surge on-state current and I2t rating
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NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7
Fig.7 Energy per pulse for sinusoidal pulses
NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7
Fig.8 Maximum allowable peak on-state current vs pulse width for Tcase = 65C
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NOTES: 1. VD 600V. 2. VR 10V. 3. R.C Snubber, C = 0.22F, R = 4.7
Fig.9 Maximum allowable peak on-state current vs pulse width for Tcase = 90C
NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.10 Energy per pulse for trapezoidal pulses
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NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.11 Maximum allowable peak on-state current vs pulse width for Tcase = 65C NOTES: 1. dI/dt = 25A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.12 Maximum allowable peak on-state current vs pulse width for Tcase = 90C
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NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.13 Energy per pulse for trapezoidal pulses
NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.14 Maximum allowable peak on-state current vs pulse width for Tcase = 65C
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NOTES: 1. dI/dt = 50A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.15 Maximum allowable peak on-state current vs pulse width for Tcase = 65C NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.16 Energy per pulse for trapezoidal pulses
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NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.17 Maximum allowable peak on-state current vs pulse width for Tcase = 65C NOTES: 1. dI/dt = 100A/s 2. VD 600V. 3. VR 10V. 4. R.C Snubber, C = 0.22F, R = 4.7
Fig.18 Maximum allowable peak on-state current vs pulse width for Tcase = 90C
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PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
O4
15 max O8.4 0.3 8 min
210 10
30 max
160 10
M = M12 K = 1/2" 20 UNF
K = 20.6 0.6 M = 18.0 0.5
Nominal weight: 120g Mounting torque: 15Nm 10% Gate lead colour: White Cathode lead colour: Red Package outine type code: TO94
Hex. 27AF
8 min
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of pre-loaded clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of `T' 23mm and `E' 30mm discs, and bar clamps right up to 83kN for our `Z' 100mm thyristors and diodes. Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS4269-3 Issue No. 3.0 July 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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