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| 05212 EMIF2MIC-68FCC Only One Name Means ProT ek'TionTM EMI FIL TER/TVS ARRA Y APPLICA TIONS Cellular Phones Notebooks Personal Digital Assistant (PDA) Ground Positioning System (GPS) Audio Ports IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Bidirectional EMI Filtering/TVS Low Pass Filters Low Insertion Loss: -3db Roll-Off @ 72MHz Bidirectional Configuration Protects Up to Two(2) Signal Lines RoHS Compliant on Lead-Free Versions MECHANICAL CHARACTERISTICS 5 Bump Flip Chip Package Weight 0.73 milligrams (Approximate) Available in Tin-Lead or Lead-Free Plating Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270C Flammability Rating UL 94V-0 8mm Tape and Reel Per EIA Standard 481 PIN CONFIGURA TION 5 BUMP FC G 05212.R1 9/05 1 www.protekdevices.com EMIF2MIC-68FCC DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature DC Power Per Resistor Typical Resistance (@ 15% Tolerance) SYMBOL TJ TSTG P R VALUE -40C to 85C -55C to 150C 100 68 UNITS C C mW OHMS ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM DIODE LEAKAGE CURRENT @ 5V ID A 1 MINIMUM ATTENUATION CUT-OFF FREQUENCY (50 Ohms I/O ZERO BIAS) TYPICAL CAPACITANCE PER LINE (See Note 1) @0V, 1 MHz C pF 80 VWM VOLTS EMIF2MIC-68FCC Note 1: 20% tolerance. @ 1mA V(BR) VOLTS 6.0 @ 800-3000 MHz dB 30 fc MHz 72 5.0 05212.R1 9/05 2 www.protekdevices.com EMIF2MIC-68FCC APPLICA TION INFORMA TION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down 05212.R1 9/05 3 www.protekdevices.com EMIF2MIC-68FCC PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE BOTTOM VIEW PACKAGE DIMENSIONS MILLIMETERS DIM MIN 0.914 1.285 0.495 0.245 0.430 0.430 0.180 0.180 0.432 0.330 INCHES MIN 0.036 0.0506 0.0195 0.0096 0.0169 0.0169 0.0071 0.0071 0.017 0.013 A G C O G H I 1 2 D I J E F B SIDE VIEW MAX 1.016 1.375 0.505 0.255 0.440 0.440 0.280 0.280 0.559 0.457 MAX 0.040 0.0541 0.0199 0.0100 0.0173 0.0173 0.0110 0.0110 0.022 0.018 A B C D E F G H I J 0.30 DIA. 63/67 Sn/Pb SOLDER BUMPS NOTE: 1. Controlling dimensions in millimeters. Outline & Dimensions: Rev 1 - 8/05, 06055 Tape & Reel Specifications (Dimensions in millimeters) Reel Dia. 178mm (7") Tape Width 8mm A0 B0 K0 D E F W P0 P2 P t 1.08 0.05 1.60 0.05 0.72 0.05 1.50 0.10 1.75 0.10 3.50 0.05 8.00 0.30 4.00 0.10 2.00 0.05 4.00 0.10 0.200.025 P0 t D P2 10 Pitches Cumulative Tolerance on Tape. 0.2 E Top cover tape A0 K0 B0 F W P User Direction of Feed TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. Plastic 8mm Tape: Suffix-T73-1 = 7 Inch Reel - 3,000 pieces per reel, i.e., EMIF2MIC-68FCC-T73-1. 3. Suffix - LF - Lead-Free, i.e., EMIF2MIC-68FCC-LF-T73-1. COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com 05212.R1 9/05 4 www.protekdevices.com |
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