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| FDD6676AS April 2005 FDD6676AS 30V N-Channel PowerTrench(R) SyncFETTM General Description The FDD6676AS is designed to replace a single MOSFET and Schottky diode in synchronous DC:DC power supplies. This 30V MOSFET is designed to maximize power conversion efficiency, providing a low and low gate charge. The FDD6676AS RDS(ON) includes a patented combination of a MOSFET monolithically integrated with a Schottky diode using Fairchild's monolithic SyncFET technology. Features * 90 A, 30 V RDS(ON) = 5.7 m @ VGS = 10 V RDS(ON) = 7.1 m @ VGS = 4.5 V * Includes SyncFET schottky body diode * Low gate charge (46nC typical) * High performance trench technology for extremely low RDS(ON) * High power and current handling capability Applications * DC/DC converter * Low side notebook D D G S G D-PAK TO-252 (TO-252) S Absolute Maximum Ratings Symbol VDSS VGSS ID PD TA=25oC unless otherwise noted Parameter Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed Power Dissipation for Single Operation (Note 3) (Note 1a) (Note 1) (Note 1a) (Note 1b) Ratings 30 20 90 100 70 3.1 1.3 -55 to +150 Units V V A W TJ, TSTG Operating and Storage Junction Temperature Range C Thermal Characteristics RJC RJA RJA Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient (Note 1) (Note 1a) (Note 1b) 1.8 40 96 C/W C/W C/W Package Marking and Ordering Information Device Marking FDD6676AS FDD6676AS Device FDD6676AS FDD6676AS_NL (Note 4) Reel Size 13'' 13'' Tape width 12mm 12mm Quantity 2500 units 2500 units FDD6676AS Rev A(X) (c)2005 Fairchild Semiconductor Corporation FDD6676AS Electrical Characteristics Symbol WDSS IAR TA = 25C unless otherwise noted Parameter Drain-Source Avalanche Energy Drain-Source Avalanche Current Test Conditions Single Pulse, VDD = 15 V, ID = 16A Min Typ 108 Max Units 250 16 mJ A Drain-Source Avalanche Ratings (Note 2) Off Characteristics BVDSS BVDSS TJ IDSS IGSS Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage (Note 2) VGS = 0 V, ID = 1 mA ID = 10 mA, Referenced to 25C VDS = 24 V, VGS = 0 V VDS = 24 V, VGS = 0 V, TJ=125C VGS = 20 V, VDS = 0 V 30 31 500 11 100 V mV/C A mA nA On Characteristics VGS(th) VGS(th) TJ RDS(on) Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance Forward Transconductance VDS = VGS, ID = 1 mA ID = 10 mA, Referenced to 25C VGS = 10 V, ID = 16 A VGS = 4.5 V, ID = 15 A VGS = 10 V, ID = 16 A,TJ=125C VDS = 5 V, ID = 16 A 1 1.5 -3.6 4.7 5.8 6.7 61 3 V mV/C 5.7 7.1 8.4 m gFS S Dynamic Characteristics Ciss Coss Crss RG Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance (Note 2) VDS = 15 V, f = 1.0 MHz V GS = 0 V, V GS = 0 V, 2500 710 270 1.6 pF pF pF f = 1.0 MHz Switching Characteristics td(on) tr td(off) tf td(on) tr td(off) tf Qg(TOT) Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time 12 VDD = 15 V, VGS = 10 V, ID = 1 A, RGEN = 6 12 46 28 20 VDD = 15 V, VGS = 4.5 V, ID = 1 A, RGEN = 6 24 35 27 46 VDS = 15 V, ID = 16 A 25 7 9 21 22 74 44 32 38 56 43 64 35 ns ns ns ns ns ns ns ns nC nC nC nC Total Gate Charge, Vgs = 10V Total Gate Charge, Vgs = 5V Gate-Source Charge Gate-Drain Charge FDD6676AS Rev A(X) FDD6676AS Electrical Characteristics (continued) Symbol IS VSD tRR IRM QRR TA = 25C unless otherwise noted Parameter Test Conditions Min Typ Max Units 3.5 A V ns A nC Drain-Source Diode Characteristics and Maximum Ratings Maximum Continuous Drain-Source Diode Forward Current Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Maximum Recovery Current Diode Reverse Recovery Charge VGS = 0 V, IS = 3.5 A (Note 2) 0.4 25 0.7 dIF/dt = 300A/us, IF = 16A 1.9 24 Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design. a) RJA = 40C/W when mounted on a 1in2 pad of 2 oz copper b) RJA = 96C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0% PD R DS(ON) 3. Maximum current is calculated as: where PD is maximum power dissipation at TC = 25C and RDS(on) is at TJ(max) and VGS = 10V. Package current limitation is 21A 4. FDD6676AS_NL is a lead free product. The FDD6676AS_NL marking will appear on the reel label. FDD6676AS Rev A(X) FDD6676AS Typical Characteristics 100 VGS = 10V 6.0V 4.0V 2.4 VGS = 3.0V RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 4.5V 3.5V 2.2 2 1.8 1.6 3.5V ID, DRAIN CURRENT (A) 80 60 40 3.0V 1.4 1.2 1 0.8 4.0V 4.5V 5.0V 6.0V 10V 20 2.5V 0 0 0.5 1 1.5 VDS, DRAIN-SOURCE VOLTAGE (V) 2 0 20 40 60 ID, DRAIN CURRENT (A) 80 100 Figure 1. On-Region Characteristics Figure 2. On-Resistance Variation with Drain Current and Gate Voltage 0.02 RDS(ON), ON-RESISTANCE (OHM) 1.6 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE ID = 78A VGS =10V ID = 39A 1.4 0.016 1.2 0.012 TA = 125 C o 1 0.8 0.008 TA =25 C o 0.6 -50 -25 0 25 50 75 100 o TJ, JUNCTION TEMPERATURE ( C) 125 150 0.004 2 4 6 8 VGS, GATE TO SOURCE VOLTAGE (V) 10 Figure 3. On-Resistance Variation with Temperature 100 VDS = 5V Figure 4. On-Resistance Variation with Gate-to-Source Voltage 100 VGS = 0V ID, DRAIN CURRENT (A) 80 IS, REVERSE DRAIN CURRENT (A) 10 TA = 125 C o 60 1 25oC -55oC 40 TA = 125oC 25 C o 20 -55oC 0.1 0 1 1.5 2 2.5 3 3.5 VGS, GATE TO SOURCE VOLTAGE (V) 4 0.01 0 0.2 0.4 0.6 0.8 VSD, BODY DIODE FORWARD VOLTAGE (V) 1 Figure 5. Transfer Characteristics Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature FDD6676AS Rev A(X) FDD6676AS Typical Characteristics 10 VGS, GATE-SOURCE VOLTAGE (V) ID = 78A 4000 f = 1MHz VGS = 0 V 8 CAPACITANCE (pF) VDS = 10V 20V 3000 Ciss 6 15V 2000 4 Coss 1000 2 Crss 0 0 10 20 30 Qg, GATE CHARGE (nC) 40 50 0 0 5 10 15 20 25 VDS, DRAIN TO SOURCE VOLTAGE (V) 30 Figure 7. Gate Charge Characteristics 1000 P(pk), PEAK TRANSIENT POWER (W) 50 Figure 8. Capacitance Characteristics ID, DRAIN CURRENT (A) 100 RDS(ON) LIMIT 10 100us 1ms 10ms 100ms 1s 10s DC 40 SINGLE PULSE RJA = 96C/W TA = 25C 30 1 VGS = 10V SINGLE PULSE o RJA = 96 C/W TA = 25 C o 20 0.1 10 0.01 0.01 0.1 1 10 VDS, DRAIN-SOURCE VOLTAGE (V) 100 0 0.001 0.01 0.1 1 t1, TIME (sec) 10 100 1000 Figure 9. Maximum Safe Operating Area Figure 10. Single Pulse Maximum Power Dissipation r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE 1 D = 0.5 0.2 RJA(t) = r(t) * RJA RJA = 96C/W 0.1 0.1 0.05 P(pk 0.02 0.01 0.01 SINGLE PULSE t1 t2 TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2 0.001 0.0001 0.001 0.01 0.1 t1, TIME (sec) 1 10 100 1000 Figure 11. Transient Thermal Response Curve Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design. FDD6676AS Rev A(X) FDD6676AS Typical Characteristics (continued) SyncFET Schottky Body Diode Characteristics Fairchild's SyncFET process embeds a Schottky diode in parallel with PowerTrench MOSFET. This diode exhibits similar characteristics to a discrete external Schottky diode in parallel with a MOSFET. Figure 12 shows the reverse recovery characteristic of the FDD6676AS. Schottky barrier diodes exhibit significant leakage at high temperature and high reverse voltage. This will increase the power in the device. 0.1 IDSS, REVERSE LEAKAGE CURRENT (A) TA = 125oC 0.01 0.001 TA = 100oC CURRENT : 0.8A/div 0.0001 TA = 25oC 0.00001 0 5 10 15 20 VDS, REVERSE VOLTAGE (V) 25 30 Figure 14. SyncFET body diode reverse leakage versus drain-source voltage and temperature. TIME : 12.5ns/div Figure 12. FDD6676AS SyncFET body diode reverse recovery characteristic. For comparison purposes, Figure 13 shows the reverse recovery characteristics of the body diode of an equivalent size MOSFET produced without SyncFET (FDD6676A). CURRENT : 0.8A/div TIME : 12.5ns/div Figure 13. Non-SyncFET (FDD6676A) body diode reverse recovery characteristic. FDD6676AS Rev A(X) FDD6676AS Typical Characteristics VDS VGS RGE VGS 0V tp L tP DUT IAS 0.01 + VDD IAS BVDSS VDS VDD vary tP to obtain required peak IAS tAV Figure 15. Unclamped Inductive Load Test Circuit Drain Current Same type as Figure 16. Unclamped Inductive Waveforms + 10V 50k 10F 1F - + VDD DUT VGS QG(TOT) 10V QGS QGD VGS Ig(REF Charge, (nC) Figure 17. Gate Charge Test Circuit Figure 18. Gate Charge Waveform tON VDS VGS RGEN VGSPulse Width 1s RL + DUT VDD 0V 10% 90% 50% 10% 50% 10% td(ON) VDS 90% tr tOFF td(OFF tf ) 90% VGS 0V Duty Cycle 0.1% Pulse Width Figure 19. Switching Time Test Circuit Figure 20. Switching Time Waveforms FDD6676AS Rev. A(X) TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM FAST ActiveArrayTM FASTrTM BottomlessTM FPSTM CoolFETTM FRFETTM CROSSVOLTTM GlobalOptoisolatorTM DOMETM GTOTM EcoSPARKTM HiSeCTM E2CMOSTM I2CTM EnSignaTM i-LoTM FACTTM ImpliedDisconnectTM FACT Quiet SeriesTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM Across the board. Around the world.TM OPTOLOGIC OPTOPLANARTM The Power Franchise PACMANTM Programmable Active DroopTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I15 |
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