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 FDG327NZ
April 2005
FDG327NZ
20V N-Channel PowerTrench(R) MOSFET
General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized use in small switching regulators, providing an extremely low RDS(ON) and gate charge (QG) in a small package.
Features
* 1.5 A, 20 V. RDS(ON) = 90 m @ VGS = 4.5 V. RDS(ON) = 100 m @ VGS = 2.5 V RDS(ON) = 140 m @ VGS = 1.8 V
* Fast switching speed * Low gate charge * High performance trench technology for extremely low RDS(ON) * High power and current handling capability.
Applications
* DC/DC converter * Power management * Load switch
S D D G
Pin 1
D D
SC70-6
Absolute Maximum Ratings
Symbol
VDSS VGSS ID PD TJ, TSTG Drain-Source Voltage Gate-Source Voltage Drain Current - Continuous - Pulsed
TA=25oC unless otherwise noted
Parameter
Ratings
20 8
(Note 1a)
Units
V A W C
1.5 6 0.42 0.38 -55 to +150
Power Dissipation for Single Operation
(Note 1a) (Note 1b)
Operating and Storage Junction Temperature Range
Thermal Characteristics
RJA RJA Thermal Resistance, Junction-to-Ambient Thermal Resistance, Junction-to-Ambient
(Note 1a) (Note 1b)
300 333
C/W
Package Marking and Ordering Information
Device Marking .37 Device FDG327NZ Reel Size 7'' Tape width 8mm Quantity 3000 units
(c)2005 Fairchild Semiconductor Corporation
FDG327NZ Rev C(W)
FDG327NZ
Electrical Characteristics
Symbol
BVDSS BVDSS TJ IDSS IGSS
TA = 25C unless otherwise noted
Parameter
Drain-Source Breakdown Voltage Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate-Body Leakage
(Note 2)
Test Conditions
VGS = 0 V, ID = 250 A
Min Typ
20 11
Max
Units
V mV/C
Off Characteristics
ID = 250 A, Referenced to 25C VDS = 16 V, VGS = 8 V, VGS = 0 V VDS = 0 V
1 10
A A
On Characteristics
VGS(th) VGS(th) TJ RDS(on) ID(on) gFS
Gate Threshold Voltage Gate Threshold Voltage Temperature Coefficient Static Drain-Source On-Resistance On-State Drain Current Forward Transconductance
VDS = VGS, ID = 250 A ID = 250 A, Referenced to 25C VGS = 4.5 V, ID = 1.5 A VGS = 2.5 V, ID = 1.4 A VGS = 1.8 V, ID = 1.2 A VGS = 4.5 V, ID = 1.5 A, TJ =125C VGS = 4.5V, VDS = 5 V VDS = 10 V, ID = 1.5 A
0.4
0.7 -2 68 77 90 86
1.5
V mV/C
90 100 140 123
m
3 2.2
A S
Dynamic Characteristics
Ciss Coss Crss RG Input Capacitance Output Capacitance Reverse Transfer Capacitance Gate Resistance
(Note 2)
VDS = 10 V, f = 1.0 MHz
V GS = 0 V
412 81 44 1.9
pF pF pF
VGS = 15 mV, f = 1.0 MHz
Switching Characteristics
td(on) tr td(off) tf Qg Qgs Qgd Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Total Gate Charge Gate-Source Charge Gate-Drain Charge
VDD = 10 V, VGS = 4.5 V,
ID = 1 A, RGEN = 6
13 12 33 18
23 22 53 20 6
ns ns ns ns nC nC nC
VDS = 10 V, VGS = 4.5 V
ID = 1.5 A,
4.2 0.4 1
Drain-Source Diode Characteristics and Maximum Ratings
VSD trr Qrr Drain-Source Diode Forward Voltage Diode Reverse Recovery Time Diode Reverse Recovery Charge VGS = 0 V, IF = 1.5 A, IS = 0.32 A
(Note 2)
0.6 4 2
1.2
V nS nC
diF/dt = 100 A/s
Notes: 1. RJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RJC is guaranteed by design while RCA is determined by the user's board design.
a)
300C/W when mounted on a 1in2 pad of 2 oz copper.
b)
333C/W when mounted on a minimum pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300s, Duty Cycle < 2.0%
FDG327NZ Rev C(W)
FDG327NZ
Typical Characteristics
10
1.8V
ID, DRAIN CURRENT (A) 8
RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE
VGS= 4.5V 2.5V V
1.8
2.0V VGS=1.5V
1.6
6
1.4
1.8V 2.0V
1.5V
4
1.2
2.5V 3.0V
2
1
4.5V
0 0 1 2 3 VDS, DRAIN TO SOURCE VOLTAGE (V)
0.8 0 2 4 6 8 10 ID, DRAIN CURRENT (A)
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
0.22 RDS(ON), ON-RESISTANCE (OHM)
1.5 RDS(ON), NORMALIZED DRAIN-SOURCE ON-RESISTANCE 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 -50 -25 0 25 50 75 100
o
ID = 1.5A VGS = 4.5V
ID = 0.8A
0.17
TA = 125oC
0.12
TA = 25oC
0.07
0.02
125 150
0.5
1.5
2.5
3.5
4.5
TJ, JUNCTION TEMPERATURE ( C)
VGS, GATE TO SOURCE VOLTAGE (V)
Figure 3. On-Resistance Variation withTemperature.
10
Figure 4. On-Resistance Variation with Gate-to-Source Voltage.
10
25 C
IS, REVERSE DRAIN CURRENT (A)
VDS = 5.0V
ID, DRAIN CURRENT (A) 8
TA = -55oC
o
VGS = 0V
1
TA = 125oC 25oC -55oC
125 C
6
o
0.1
4
0.01
2
0.001
0 0.5 1 1.5 2 2.5 VGS, GATE TO SOURCE VOLTAGE (V)
0.0001 0 0.2 0.4 0.6 0.8 1 1.2 1.4 VSD, BODY DIODE FORWARD VOLTAGE (V)
Figure 5. Transfer Characteristics.
Figure 6. Body Diode Forward Voltage Variation with Source Current and Temperature.
FDG327NZ Rev C(W)
FDG327NZ
Typical Characteristics
5 VGS, GATE-SOURCE VOLTAGE (V)
600
ID = 1.5A
4
VDS = 5V 10V
CAPACITANCE (pF) 500
f = 1 MHz VGS = 0 V CISS
3
15V
400 300 200
2
COSS
100
1
CRSS
0 0 1 2 3 4 5 Qg, GATE CHARGE (nC)
0 0 5 10 15 20 VDS, DRAIN TO SOURCE VOLTAGE (V)
Figure 7. Gate Charge Characteristics.
10
Figure 8. Capacitance Characteristics.
20
ID, DRAIN CURRENT (A)
1
100s 1ms 10ms 100ms 1s 10s DC
P(pk), PEAK TRANSIENT POWER (W)
RDS(ON) LIMIT
SINGLE PULSE RJA = 333C/W TA = 25C
15
10
0.1
VGS = 4.5V SINGLE PULSE RJA = 333oC/W TA = 25oC
5
0.01 0.1 1 10 100 VDS, DRAIN-SOURCE VOLTAGE (V)
0 0.0001
0.001
0.01
0.1
1
10
100
1000
t1, TIME (sec)
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum Power Dissipation.
r(t), NORMALIZED EFFECTIVE TRANSIENT THERMAL RESISTANCE
1
D = 0.5
RJA(t) = r(t) * RJA RJA = 333 C/W P(pk) t1 t2
SINGLE PULSE 0.02 0.01
o
0.2
0.1
0.1 0.05
TJ - TA = P * RJA(t) Duty Cycle, D = t1 / t2
0.01 0.0001
0.001
0.01
0.1
t1, TIME (sec)
1
10
100
1000
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1b. Transient thermal response will change depending on the circuit board design.
FDG327NZ Rev C(W)
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
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POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench QFET QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM SILENT SWITCHER SMART STARTTM
SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic TINYOPTOTM TruTranslationTM UHCTM UltraFET UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 2. A critical component is any component of a life 1. Life support devices or systems are devices or support device or system whose failure to perform can systems which, (a) are intended for surgical implant into be reasonably expected to cause the failure of the life the body, or (b) support or sustain life, or (c) whose support device or system, or to affect its safety or failure to perform when properly used in accordance with instructions for use provided in the labeling, can be effectiveness. reasonably expected to result in significant injury to the user. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I15


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