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FMM5829X
K-Band Power Amplifier MMIC
FEATURES *High Output Power; P1dB = 31 dBm (Typ.) *High Linear Gain; GL = 23 dB(Typ.) *Frequency Band ; 21.0 - 27.0 GHz *High Linearity ; OIP3 = 39dBm *Impedance Matched Zin/Zout = 50 DESCRIPTION The FMM5829X is a power amplifier MMIC that contains a four stage amplifier, internally matched, for standard communications band in 21.0 to 27.0GHz frequency range. This product is well suited for point-to-point radio applications. Eudyna's stringent Quality Assurance Program assures the highest reliability and consistent performance.
Device photo
ABSOLUTE MAXIMUM RATING Item Drain-Source Voltage Gate-Source Voltage Input Power Storage Temperature
Symbol VDD VGG Pin Tstg
Condition
Rating 10 -3 22 -55 ~ +125
Unit V V dBm degC
RECOMMENDED OPERATING CONDITIONS Symbol Item Drain-Source Voltage VDD Input Power Pin Operating Backside Temperature Top This Product should be hermetically packaged.
Condition
Recommend 7 12 -40 ~ +85
Unit V dBm degC
ELECTRICAL CHARACTERISTICS (Ambient Temperature Ta=25) Item Symbol Test Conditions Unit Limits Min. Typ. Max. 21 27 GHz 29.0 31.0 dBm 19 22 25 dB 21 % -34 -38 dBc 1000 1500 mA -8 dB -8 dB G.C.P. : Gain Compression Point S.C.L. : Single Carrier Level ~ 199V
VDD=6V Frequency Range f IDD(DC)=800mA(typ) Output Power at 1dB G.C.P. P1dB Zs=Zl=50ohm Power Gain at 1dB G.C.P. G1dB Power-added Efficiency at 1dB G.C.P. Nadd *df=10MHz,Po=20dBm (SCL) Third Order Intermodulation* IM3* Drain Current at 1dB G.C.P. Iddrf Input Return Loss (at Pin=-20dBm) RLin Output Return Loss (at Pin=-20dBm) RLout Note : RF parameter sample size 10ps. Criteria (accept/reject)=(0/1)
ESD
Note : Based on EIAJ ED-4701 C-111A(C=100pF, R=1.5k)
Class 0
Edition 2.0 April 2006
1
http://www.eudyna.com/
FMM5829X
K-Band Power Amplifier MMIC
Output Power vs. Frequency
VDD=6V, IDD(DC)=800mA 35 33 31 Output Power [dBm] 29 27 25 23 21 19 17 15 19 20 21 22 23 24 25 26 27 28 29 Frequency [GHz]
Pin=0dBm Pin=4dBm P1dB Pin=8dBm Pin=12dBm
Output Power, Drain Current vs. Input Power
VDD=6V, IDD(DC)=800mA 34 32 Output Power [dBm] 30 28 26 24 22 20 18 -4 -2 0 2 4 6 8 10 12 14 16 Input Power [dBm] Drain Current 21GHz 23GHz 25GHz 27GHz Pout 2200 2000 Drain Current [mA] 1800 1600 1400 1200 1000 800 600
Power Added Efficiency vs. Frequency
VDD=6V, IDD(DC)=800mA 30 Power Added Efficiency [%] 25 20 15 10
Pin=4dBm
Pin=12dBm P1dB
Pin=8dBm
5
Pin=0dBm
0 19 20 21 22 23 24 25 26 27 28 29 Frequency [GHz]
2
FMM5829X
K-Band Power Amplifier MMIC
IMD vs. Frequency
VDD=6V, IDD(DC)=800mA, Pout=20dBm S.C.L. -30 Intermodulation Distortion [dBc] -35 IM3 -40 -45 IM5 -50 -55 -60 19 20 21 22 23 24 25 26 27 28 29
-60 16 18 20 22 24 26 28 2-tone Total Output Power [dBm] 30 32 Intermodulation Distortion [dBc] -10 -15 -20 -25 -30 -35 -40 -45 -50 -55
IMD vs. Output Power
VDD=6V, IDD(DC)=800mA
21GHz 23GHz 25GHz 27GHz
IM3 IM5
Frequency [GHz]
Output Power, Gain vs. Drain Voltage
IDD(DC)=800mA 36 34 32 P1dB [dBm] 30 28 26 24 22 20 3 4 5 6 7 8 9 Drain Voltage [V] G1dB 21GHz 23GHz 25GHz 27GHz P1dB 34 32 30 G1dB [dB] 28 26 24 22 20 18 P1dB [dBm] 36 34 32 30
Output Power, Gain vs. Drain Current
VDD=6V 34 21GHz 23GHz 25GHz 27GHz 32 30 G1dB [dB] 28 P1dB 28 26 24 22 20 500 G1dB 26 24 22 20 18 1100
600
700
800
900
1000
Drain Current [mA]
3
FMM5829X
K-Band Power Amplifier MMIC
Output Power, Drain Current vs. Input Power by Drain Voltage
IDD(DC)=800mA, f=21GHz
34 32 30 Output Power [dBm] 28 26 24 22 20 18 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] Pout Drain Current 4V 5V 6V 7V 8V 2200 2000 1800
Output Power, Drain Current vs. Input Power by Drain Voltage
IDD(DC)=800mA, f=23GHz
34 32 30 Output Power [dBm]
Drain Current [mA]
2200 4V 5V 6V 7V 8V 2000 1800 1600 Pout 1400 1200 1000 Drain Current 800 600 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] Drain Current [mA]
Drain Current [mA]
1600 1400 1200 1000 800 600
28 26 24 22 20 18
Output Power, Drain Current vs. Input Power by Drain Voltage
IDD(DC)=800mA, f=25GHz
34 32 30 Output Power [dBm] 28 26 24 22 20 18 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] Drain Current Pout 4V 5V 6V 7V 8V 2200 2000 1800 1600 1400 1200 1000 800 600
Output Power, Drain Current vs. Input Power by Drain Voltage
IDD(DC)=800mA, f=27GHz
34 32 30 Output Power [dBm]
Drain Current [mA]
2200 4V 5V 6V 7V 8V 2000 1800 1600 Pout 1400 1200 1000 Drain Current 800 600 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ]
28 26 24 22 20 18
4
FMM5829X
K-Band Power Amplifier MMIC
Output Power, Drain Current vs. Input Power by Drain Current
VDD=6V, f=21GHz
34 32 30 Output Power [dBm] 28 26 24 22 20 18 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] Drain Current Pout 600m A 800m A 1000m A 2000 1800 1600
Output Power [dBm] 34 32 30 600m A 800m A 1000m A
Output Power, Drain Current vs. Input Power by Drain Current
VDD=6V, f=23GHz
2000 1800 1600 Pout 1400 1200 1000 800 Drain Current 600 400 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] Drain Current [mA]
Drain Current [mA]
1400 1200 1000 800 600 400
Drain Current [mA]
28 26 24 22 20 18
Output Power, Drain Current vs. Input Power by Drain Current
VDD=6V, f=25GHz
34 32 30 Output Power [dBm] 28 26 24 22 Drain Current 20 18 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ] 600 400 Pout 600m A 800m A 1000m A 2000 1800 1600
Output Power, Drain Current vs. Input Power by Drain Current
VDD=6V, f=27GHz
34 32 30 Output Power [dBm]
Drain Current [mA]
2000 600m A 800m A 1000m A 1800 1600 Pout 1400 1200 1000 800 600 400 -4 -2 0 2 4 6 8 10 12 14 16 Input Pow er [dBm ]
1400 1200 1000 800
28 26 24 22 20 18
Drain Current
5
FMM5829X
K-Band Power Amplifier MMIC
IMD vs. Output Power by Drain Voltage
IDD(DC)=800mA, f=21GHz -10
IMD vs. Output Power by Drain Voltage
IDD(DC)=800mA, f=23GHz -10 Intermodulation Distortion [dBc]
Intermodulation Distortion [dBc]
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
5V 6V 7V 8V
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
5V 6V 7V 8V
IM3
IM3
IM5
IM5
18
20
22
24
26
28
30
32
18
20
22
24
26
28
30
32
2-tone Total Pout [dBm]
2-tone Total Pout [dBm]
IMD vs. Output Power by Drain Voltage
IDD(DC)=800mA, f=25GHz -10 Intermodulation Distortion [dBc]
Intermodulation Distortion [dBc] -10
IMD vs. Output Power by Drain Voltage
IDD(DC)=800mA, f=27GHz
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
5V 6V 7V 8V
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
5V 6V 7V 8V
IM3
IM3
IM5
IM5
18
20
22
24
26
28
30
32
18
20
22
24
26
28
30
32
2-tone Total Pout [dBm]
2-tone Total Pout [dBm]
6
FMM5829X
K-Band Power Amplifier MMIC
IMD vs. Output Power by Drain Current
VDD=6V, f=21GHz -10
IMD vs. Output Power by Drain Current
VDD=6V, f=23GHz -10 Intermodulation Distortion [dBc]
Intermodulation Distortion [dBc]
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
600mA 800mA 1000mA
-15 -20 -25 -30
600mA 800mA 1000mA
IM3
IM3 -35 -40 -45 -50 -55 -60 16 18 20 22 24 26 28 30 32 IM5
IM5
18
20
22
24
26
28
30
32
2-tone Total Pout [dBm]
2-tone Total Pout [dBm]
IMD vs. Output Power by Drain Current
VDD=6V, f=25GHz -10 Intermodulation Distortion [dBc]
IMD vs. Output Power by Drain Current
VDD=6V, f=27GHz -10 Intermodulation Distortion [dBc]
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
600mA 800mA 1000mA
-15 -20 -25 -30 -35 -40 -45 -50 -55 -60 16
600mA 800mA 1000mA
IM3
IM3 IM5
IM5
18
20
22
24
26
28
30
32
18
20
22
24
26
28
30
32
2-tone Total Pout [dBm]
2-tone Total Pout [dBm]
7
FMM5829X
K-Band Power Amplifier MMIC
S-PARAMETER
@VDD=6V, IDD=800mA 35 30 25 20 15 Sxx [dB] 10 5 0 -5 -10 -15 -20 -25 -30 0 5 10 15 20 25 30 35 40 Frequency [GHz] S21 S11 S22
@VDD=6V, IDD=800mA 35 30 25 20 15 10 5 0 -5 -10 -15 -20 -25 -30 19
S21
S11
S22
Sxx [dB]
20
21
22
23
24
25
26
27
28
29
Frequency [GHz]
8
FMM5829X
S-PARAMETER VDD=6V, IDD=800mA
Frequency [GHz] 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 16.0 17.0 18.0 19.0 20.0 21.0 21.2 21.4 21.6 21.8 22.0 22.2 22.4 22.6 22.8 23.0 23.2 23.4 23.6 23.8 24.0 24.2 24.4 24.6 24.8 25.0 25.2 25.4 25.6 25.8 26.0 26.2 26.4 26.6 26.8 27.0 28.0 29.0 30.0 31.0 32.0 33.0 34.0 35.0 36.0 37.0 38.0 39.0 40.0 S11 MAG 0.95 0.93 0.93 0.93 0.94 0.94 0.95 0.95 0.95 0.95 0.90 0.85 0.83 0.80 0.78 0.73 0.67 0.58 0.45 0.31 0.25 0.26 0.28 0.29 0.32 0.34 0.36 0.39 0.41 0.43 0.45 0.47 0.49 0.51 0.52 0.52 0.53 0.53 0.52 0.51 0.50 0.48 0.45 0.41 0.36 0.29 0.21 0.10 0.04 0.17 0.31 0.76 0.87 0.92 0.93 0.94 0.94 0.94 0.95 0.94 0.95 0.95 0.94 0.95 ANG -46.52 -82.53 -109.37 -130.21 -146.80 -160.74 -172.97 175.84 164.96 153.37 141.87 133.80 125.44 115.80 104.59 91.67 76.49 57.35 30.88 -11.12 -81.26 -95.83 -110.02 -122.42 -133.00 -142.44 -151.02 -158.21 -165.59 -172.08 -178.18 176.15 170.83 165.17 159.85 154.19 149.03 143.99 139.08 133.70 128.47 122.94 116.83 111.18 104.32 97.35 90.19 84.65 -148.03 -135.67 -144.63 170.55 144.56 128.25 115.72 105.45 97.03 88.32 81.22 74.36 67.41 61.06 55.13 48.92 S21 MAG ANG 0.02 22.82 0.04 56.73 0.10 67.04 0.13 -58.16 0.07 -118.46 0.04 -138.70 0.04 -134.08 0.10 -130.87 0.27 171.39 0.35 144.98 1.01 78.71 1.28 1.73 1.36 -55.99 1.58 -104.99 2.02 -152.62 2.80 157.35 4.10 103.03 6.14 42.40 9.07 -25.14 12.64 -101.25 14.97 175.66 15.15 158.89 15.23 142.20 15.18 125.41 15.02 108.90 14.78 92.74 14.52 76.77 14.22 61.07 13.90 45.49 13.59 30.13 13.28 14.94 12.98 -0.03 12.74 -14.96 12.55 -29.90 12.35 -44.98 12.17 -60.13 12.03 -75.24 11.92 -90.38 11.89 -105.69 11.88 -121.55 11.93 -137.63 12.05 -154.24 12.21 -171.38 12.41 170.66 12.63 151.62 12.83 131.32 12.93 109.68 12.80 86.82 12.48 62.47 11.81 36.74 10.79 10.29 4.20 -118.89 0.80 128.02 0.08 53.68 0.01 118.01 0.01 95.87 0.00 43.09 0.00 -59.06 0.00 -165.76 0.00 -125.92 0.00 115.52 0.00 -78.22 0.01 -170.29 0.00 -79.65 S12 MAG ANG 0.00 75.66 0.00 -144.46 0.00 12.27 0.00 -164.67 0.00 -130.04 0.00 139.94 0.00 54.63 0.00 -4.39 0.00 -90.07 0.00 -158.98 0.00 150.77 0.00 85.46 0.00 91.85 0.00 30.67 0.00 29.14 0.00 43.85 0.00 1.77 0.00 -66.66 0.00 59.15 0.00 59.30 0.00 -113.49 0.00 18.99 0.00 136.79 0.00 123.31 0.00 57.33 0.00 81.33 0.00 -16.38 0.00 113.20 0.00 87.24 0.00 63.06 0.00 79.64 0.00 30.87 0.00 35.39 0.00 6.94 0.00 15.72 0.00 -45.32 0.00 5.77 0.00 -3.23 0.00 5.71 0.00 -55.25 0.00 -13.22 0.00 17.56 0.00 -1.67 0.00 -40.60 0.00 -120.63 0.00 -56.34 0.00 -86.35 0.00 4.47 0.00 10.48 0.00 -7.20 0.00 70.86 0.00 1.80 0.00 -54.60 0.00 -83.60 0.00 60.51 0.00 -108.88 0.00 -113.34 0.00 -12.11 0.00 -27.51 0.00 -145.32 0.00 124.56 0.00 -179.38 0.00 -70.65 0.00 115.57 S22 MAG ANG 1.00 -34.80 0.98 -66.71 0.96 -94.62 0.94 -113.92 0.97 -133.59 0.98 -151.02 0.97 -166.40 0.97 179.94 0.97 167.40 0.97 155.21 0.96 143.27 0.96 131.39 0.95 119.43 0.94 106.90 0.92 93.46 0.89 78.27 0.84 60.95 0.76 39.80 0.62 12.21 0.41 -27.35 0.17 -103.83 0.16 -130.13 0.16 -157.96 0.17 177.04 0.20 158.15 0.23 142.94 0.25 130.63 0.28 119.89 0.30 110.55 0.31 101.86 0.33 94.02 0.34 86.18 0.34 79.76 0.35 72.97 0.35 65.85 0.35 58.54 0.35 51.37 0.34 44.29 0.33 37.47 0.33 29.73 0.32 21.96 0.31 13.58 0.29 3.97 0.28 -5.76 0.26 -15.50 0.25 -25.73 0.24 -36.56 0.23 -49.93 0.22 -62.47 0.20 -74.09 0.19 -85.15 0.25 -114.71 0.48 -152.28 0.62 171.26 0.69 147.18 0.74 129.01 0.77 114.56 0.79 102.54 0.82 91.08 0.83 81.44 0.84 71.65 0.85 62.52 0.85 54.05 0.86 45.74
K-Band Power Amplifier MMIC
9
FMM5829X
K-Band Power Amplifier MMIC
Tch vs. Drain Voltage (Reference)
IDD(DC)=800mA
80 70 60 Tch [ ] 50 40 30 20 10 0 4 5
MTTF vs. Tch
6
7
8
9
VDD [V]
1.E+12 1.E+11 1.E+10 1.E+09 1.E+08 1.E+07 1.E+06 1.E+05 1.E+04 1.E+03 1.E+02 1.E+01 50 100 150 Tch [ C ]
o
Ea=1.56eV
MTTF [ hrs ]
200
250
10
FMM5829X
K-Band Power Amplifier MMIC
Chip Outline and Bonding Pad Locations (Dimension in Micro-Meters)
VDD1 VDD2 (VGG3) 1170 0 120 450 800 2235 2115 2100
VDD3 1840
(VGG5) 2990
VDD5 3430 3905 4025 2235 2040
RF-IN 1405
RF-OUT 1290
195 120 0 0 120 240 VGG1 830 1170 (VGG2) (VGG4) 1840 VDD4 2990 (VGG6) 3430 3905 4025 VDD6
195 0
Chip Size : 402530um x 223530um Chip Thickness : 6020um Bonding Pad Size : RF-Pad : 120um x 80um VGG-Pad : 80um x 80um VDD-Pad : 100um x 100um : Gate voltage is required from either or both bonding pad( VGG1 or/and VGG2~6).
11
FMM5829X
K-Band Power Amplifier MMIC
Assembly Diagrams Recommended assembly
100pF
100pF
100pF
100pF
1 uF VDD
50ohm Line
50ohm Line
VGG 1 uF
VDD
100pF 100pF 100pF
1 uF
"Copper" is the recommended material for the package or carrier.
12
FMM5829X
K-Band Power Amplifier MMIC
DIE ATTACH 1) The die-attach station must have accurate temperature control and an inert forming gas should be used. 2) Chips should be kept at room temperature except during die-attach. 3) Place package or carrier on the heated stage. 4) Lightly grasp the chip edges by the longer side using tweezers. Die attach conditions Stage Temperature : 300 to 310 deg.C Time : less than 15 seconds AuSn Preform Volume : per next Figure
2500 Volume of Au-Sn Perform (10 -3/mm 3)
2000
FMM5829X
1500
1000
500
0 0 2 4 6 8 10 12 14 16 18 20 Area of Chip Bach Surface (mm^2)
WIRE BONDING The bonding equipment must be properly grounded. The following or equivalent equipment, tools, materials, and conditions are recommended. 1) Bonding Equipment and Bonding Tool. Bonding Equipment : West Bond Model 7400 (Manual Bonder) Bonding Tool : CCOD-1/16-S-437-60-F-2010-MP (Deweyl) 2) Bonding Wire Material : Hard or Half hard gold Diameter : 0.7 to 1.0 mil 3) Bonding Conditions Method : Thermal Compression Bonding with Ultrasonic Power Tool Force : 0.196 N 0.0196 N Stage Temperature : 215 deg.C 5 deg.C Tool Heater : None Ultrasonic Power Transmitter : West Bond Model 1400 Duration : 150 mS/Bond
13
FMM5829X
K-Band Power Amplifier MMIC
For further information please contact :
Eudyna Devices USA Inc. 2355 Zanker Rd. San Jose, CA 95131-1138, U.S.A. TEL: +1 408 232-9500 FAX: +1 408 428-9111 Eudyna Devices Europe Ltd. Network House Norreys Drive Maidenhead, Berkshire SL6 4FJ United Kingdom TEL: +44 (0) 1628 504800 FAX: +44 (0) 1628 504888 Eudyna Devices International Srl Via Teglio 8/2 - 20158 Milano, Italy TEL: +39-02-8738-1695 Eudyna Devices Asia Pte. Ltd. Hong Kong Branch Suite 1906B, Tower 6, China Hong Kong City 33 Canton Road, Tsimshatsui, Kowloon Hong Kong TEL: +852-2377-0227 FAX: +852-2377-3921 Eudyna Devices Inc. 1000 Kamisukiahara, showa-cho Nakakomagun, Yamanashi 409-3883, Japan (Kokubo Industrial Park) TEL +81-55-275-4411 FAX +81-55-275-9461 Sales Division 1, Kanai-cho, Sakae-ku Yokohama, 244-0845, Japan TEL +81-45-853-8156 FAX +81-45-853-8170
CAUTION
Eudyna Devices Inc. products contain gallium arsenide (GaAs) which can be hazardous to the human body and the environment. For safety, observe the following procedures: Do not put these products into the mouth. Do not alter the form of this product into a gas, powder, or liquid through burning, crushing, or chemical processing as these byproducts are dangerous to the human body if inhaled, ingested, or swallowed. Observe government laws and company regulations when discarding this product. This product must be discarded in accordance with methods specified by applicable hazardous waste procedures. Eudyna Devices Inc. reserves the right to change products and specifications without notice.The information does not convey any license under rights of Eudyna Devices Inc. or others.
(c) 2006 Eudyna Devices Inc.
14

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