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H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler December 2006 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Features High data rate, 1MHz typical (NRZ) Free from latch up and oscilliation throughout voltage tm Description The H11LXM series has a high speed integrated circuit detector optically coupled to a gallium-arsenide infrared emitting diode. The output incorporates a Schmitt trigger, which provides hysteresis for noise immunity and pulse shaping. The detector circuit is optimized for simplicity of operation and utilizes an open collector output for maximum application flexibility. and temperature ranges. Microprocessor compatible drive Logic compatible output sinks 16mA at 0.4V maximum Guaranteed on/off threshold hysteresis Wide supply voltage capability, compatible with all popular logic systems Underwriters Laboratory (UL) recognized-- file #E90700, Volume 2 VDE recognized - File#102497 - Add option V (e.g., H11LIVM) Applications Logic to logic isolator Programmable current level sensor Line receiver--eliminate noise and transient problems A.C. to TTL conversion--square wave shaping Digital programming of power supplies Interfaces computers with peripherals Packages Schematic ANODE 1 6 VCC 6 6 1 1 3 4 VO CATHODE 2 5 GND 6 1 Truth Table Input H L Output L H (c)2005 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com H11L1M, H11L2M, H11L3M Rev. 1.0.0 H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Absolute Maximum Ratings (TA = 25C Unless otherwise specified.) Symbol TOTAL DEVICE TSTG TOPR TSOL PD EMITTER IF VR IF(pk) PD DETECTOR PD VO VCC IO Detector Power Dissipation @ 25C Derate Linearly from 25C V45 Allowed Range V65 Allowed Range I4 Output Current 150 2.0 0 to 16 3 to 16 50 mW mW/C V V mA Continuous Forward Current Reverse Voltage Forward Current - Peak (1s pulse, 300pps) LED Power Dissipation 25C Ambient Derate Linearly From 25C 60 6 3.0 120 1.41 mA V A mW mW/C Storage Temperature Operating Temperature Lead Solder Temperature Total Device Power Dissipation @ 25C Derate Above 25C -55 to +150 -40 to +85 260 for 10 sec 250 2.94 C C C mW mW/C Parameters Value Units 2 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Electrical Characteristics (TA = 25C Unless otherwise specified.) Individual Component Characteristics Symbol EMITTER VF IR CJ DETECTOR VCC ICC(off) IOH Operating Voltage Range Supply Current Output Current, High IF = 0, VCC = 5V IF = 0, VCC = VO = 15V All All All 3 1.6 15 5.0 100 V mA A Input Forward Voltage IF = 10mA IF = 0.3mA Reverse Current Capacitance VR = 3V V = 0, f = 1.0MHz All All All 0.75 1.2 1.0 10 100 A pF 1.5 V Parameters Test Conditions Device Min. Typ. Max. Units Transfer Characteristics Symbol ICC(on) VOL IF(on) Parameter Supply Current Output Voltage, low Turn-On Threshold Current(1) Test Conditions IF = 10mA, VCC = 5V RL= 270,VCC = 5V, IF = IF(on) max. RL = 270, VCC = 5V Device All All H11L1M H11L2M H11L3M Min. Typ. 1.6 0.2 Max. 5.0 0.4 1.6 10.0 5.0 Units mA V mA DC CHARACTERISTICS IF(off) Turn-Off Threshold Current RL = 270, VCC = 5V RL = 270, VCC = 5V RL = 270, VCC = 5V, IF = IF(on), TA = 25C RL = 270, VCC = 5V, IF = IF(on), TA= 25C RL= 270, VCC = 5V, IF = IF(on), TA= 25C RL = 270, VCC = 5V, IF = IF(on), TA = 25C All All 0.3 0.50 1.0 0.75 0.90 mA IF(off)/IF(on) Hysteresis Ratio AC CHARACTERISTICS, Switching Speed ton tf toff tr Turn-On time Fall Time Turn-Off Time Rise time Data Rate All All All All All 1.0 0.1 1.2 0.1 1.0 4 s s 4 s s MHz Isolation Characteristics Symbol VISO CISO RISO Parameter Input-Output Isolation Voltage Isolation Capacitance Isolation Resistance Test Conditions t =1 sec. VI-O = 0V, f = 1MHz VI-O = 500 VDC Min. 7500 Typ. Max. Units VPEAK 0.4 1011 0.6 pF Note: 1. Maximum IF(ON) is the maximum current required to trigger the output. For example, a 1.6mA maximum trigger current would require the LED to be driven at a current greater than 1.6mA to guarantee the device will turn on. A 10% guard band is recommended to account for degradation of the LED over its lifetime. The maximum allowable LED drive current is 60mA. 3 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Typical Performance Curves Figure 1. Transfer Characteristics VCC= 5V RL = 270 TA = 25C Figure 2. Threshold Current vs. Supply Voltage IF - THRESHOLD CURRENT (NORMALIZED) 1.6 IF NORMALIZED TO : IF(ON) AT VCC = 5V 1.4 TA = 25oC 6 V OH 5 O V - OUTPUT VOLTAGE (V) 4 I F(OFF) 3 I F(ON) 1.2 TURN ON THRESHOLD 1.0 TURN OFF THRESHOLD 0.8 2 1 V OL 0 0 1 2 3 0.6 0.4 0 2 4 6 8 10 12 14 16 IF - INPUT CURRENT (mA) IF(On) , IF(Off) - THRESHOLD CURRENT (NORMALIZED) VCC - SUPPLY VOLTAGE (V) Figure 3. Threshold Current vs. Supply Temperature 1.6 2 Figure 4. Output Voltage, Low vs. Load Current 1.4 VOL - OUTPUT VOLTAGE, LOW (V) 1.2 1.0 1 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.8 0.6 NORMALIZED TO : VCC = 5V TA = 25oC 0.2 0.4 IF = I F(ON) V CC = 5V R L = 270 0.1 1 10 100 0.2 -50 -25 0 25 50 75 100 TA - TEMPERATURE ( oC) I O - LOAD CURRENT (mA) Figure 5. Supply Current vs. Supply Voltage 6 TA = 0 C I F = 5mA 25 C 70 C 4 Figure 6. LED Forward Voltage vs. Forward Current 1.7 5 I C - SUPPLY CURRENT (mA) VF - FORWARD VOLTAGE (V) 1.6 1.5 1.4 TA = 55C 1.3 TA = 25C 1.2 TA = 100C 1.1 3 2 TA = 0 C 25 C 70 C 1 IF = 0mA 0 0 2 4 6 8 10 12 14 16 1.0 1 10 100 VCC - SUPPLY VOLTAGE (V) IF - LED FORWARD CURRENT (mA) 4 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler C IF RE VIN 1 H11L1 I6 5V VIN 5V 50% 0 6 RL 4 270 VO ton toff tr = tf = 0.01S Z = 50 2 5 10% VO 90% tf tr Figure 7. Switching Test Circuit and Waveforms 5 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Package Dimensions Through Hole 0.350 (8.89) 0.320 (8.13) Surface Mount 0.350 (8.89) 0.320 (8.13) 0.260 (6.60) 0.240 (6.10) 0.260 (6.60) 0.240 (6.10) 0.390 (9.90) 0.332 (8.43) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.070 (1.77) 0.040 (1.02) 0.014 (0.36) 0.010 (0.25) 0.320 (8.13) 0.200 (5.08) 0.115 (2.93) 0.200 (5.08) 0.115 (2.93) 0.012 (0.30) 0.008 (0.20) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 (2.54) 15 0.012 (0.30) 0.025 (0.63) 0.020 (0.51) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.035 (0.88) 0.012 (0.30) 0.4" Lead Spacing 0.350 (8.89) 0.320 (8.13) Recommend Pad Layout for Surface Mount Leadform 0.070 (1.78) 0.060 (1.52) 0.260 (6.60) 0.240 (6.10) 0.425 (10.79) 0.070 (1.77) 0.040 (1.02) 0.100 (2.54) 0.305 (7.75) 0.030 (0.76) 0.014 (0.36) 0.010 (0.25) 0.200 (5.08) 0.115 (2.93) 0.100 (2.54) 0.015 (0.38) 0.020 (0.50) 0.016 (0.41) 0.100 [2.54] 0.012 (0.30) 0.008 (0.21) 0.425 (10.80) 0.400 (10.16) Note: All dimensions are in inches (millimeters). 6 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Ordering Information Option/Order Entry Identifier S SR2 T V TV SV SR2V Description Surface Mount Lead Bend Surface Mount; Tape and reel 0.4" Lead Spacing VDE 0884 VDE 0884, 0.4" Lead Spacing VDE 0884, Surface Mount VDE 0884, Surface Mount, Tape & Reel Marking Information 1 H11L1 V 3 4 2 6 X YY Q 5 Definitions 1 2 3 4 5 6 Fairchild logo Device number VDE mark (Note: Only appears on parts ordered with VDE option - See order entry table) One digit year code, e.g., `3' Two digit work week ranging from `01' to `53' Assembly package code *Note - Parts that do not have the `V' option (see definition 3 above) that are marked with date code `325' or earlier are marked in portrait format. 7 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com H11L1M, H11L2M, H11L3M 6-Pin DIP Optocoupler Tape Dimensions 12.0 0.1 4.5 0.20 2.0 0.05 0.30 0.05 4.0 0.1 O1.5 MIN 1.75 0.10 11.5 1.0 21.0 0.1 9.1 0.20 24.0 0.3 0.1 MAX 10.1 0.20 O1.5 0.1/-0 User Direction of Feed Note: All dimensions are in millimeters. Reflow Profile 300 280 260 240 220 200 180 Time above 183C = 90 Sec >245C = 42 Sec 260C C 160 140 120 100 80 60 40 20 0 0 60 120 180 33 Sec 1.822C/Sec Ramp up rate 270 360 Time (s) 8 H11L1M, H11L2M, H11L3M Rev. 1.0.0 www.fairchildsemi.com FAIRCHILD SEMICONDUCTOR TRADEMARKS The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACT(R) FAST(R) FASTrTM FPSTM FRFETTM FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHC(R) UniFETTM VCXTM WireTM DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Preliminary First Production No Identification Needed Full Production Obsolete Not In Production Rev. I22 |
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