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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6423-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 1/3 HBC557 PNP EPITAXIAL PLANAR TRANSISTOR Description The HBC557 is designed for use in driver stage of audio amplifier applications. Features * High Breakdown Voltage: 45V * High AC Current Gain: 75-800 at IC=2mA Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 500 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ....................................................................................... -50 V VCEO Collector to Emitter Voltage .................................................................................... -45 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ..................................................................................................... -100 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO VBE(on)1 VBE(on)2 *VCE(sat)1 *VCE(sat)2 *hFE fT Cob Min. -50 -45 -5 -600 75 Typ. 300 4.5 Max. -100 -1 -750 -820 -300 -650 800 Unit V V V nA uA mV mV mV mV MHz PF Test Conditions IC=-100uA IC=-1mA IE=-10uA VCB=-20V VEB=-5V IC=-2mA, VCE=-5V IC=-10mA, VCE=-5V IC=-10mA, IB=-1mA IC=-100mA, IB=-10mA VCB=-5V, IC=-2mA VCE=-5V, IC=-10mA, f=100MHz VCB=-10V, IE=0, f=1MHz *Pulse Test : Pulse Width 380us, Duty Cycle2% Classification of hFE Rank Range A 125-260 B 240-500 C 420-800 Normal 75-260 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 100.000 Spec. No. : HE6423-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 2/3 Saturation Voltage & Collector Current VCE=5V 100 Saturation Voltage (mV) 10.000 hFE 1.000 10 0.100 VCE(sat) @ IC=10IB 1 1 10 100 1000 0.010 1 10 100 1000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) VCE=5V 100 On Voltage (mV) 1 VBE(on) @ VCE=5V 10 0.1 1 10 100 1000 1 1 10 100 1000 Collector Current (mA) Collector Current (mA) Capacitance & Reverse-Biased Voltage 10 10 Safe Operating Area PT=1ms Collector Current-IC (mA) PT=100ms 1 PT=1s Capacitance (pF) 0.1 Cob 1 1 10 100 0.01 1 10 100 Reverse Biased Voltage (V) Forward Voltage-VCE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6423-B Issued Date : 1992.11.25 Revised Date : 2000.09.20 Page No. : 3/3 2 Marking : HSMC Logo Part Number Date Code Rank Product Series 3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Collector 2.Base 3.Emitter 1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : * Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : * Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification |
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