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| Datasheet File OCR Text: |
| SURFACE MOUNT CHIP LED LAMPS Model No. LEM-51321T FEATURES: Ultra compact (3.2x1.6x1.1) Compatible with automatic placement equipment Compatible with reflow solder process Emitted Color Material APPLICATION: Indicators on printed circuit boards LCD Back-lights Illuminations Automotive-Telecommunication Wavelength (nm) 570 Lens Color Water Clear Yellow Green GaP ABSOLUTE MAXIMUM RATINGS (Ta = 25) CHARACTERISTIC Power dissipation Forward direct current Peak forward current Reverse voltage Operating temperature Storage temperature SYMBOL Pm IFm IFp VRm Topr Tstg RATING 68 30 100 5 -30 to +80 -40 to +85 UNIT mW mA mA V ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25) CHARACTERISTIC Luminous intensity Forward voltage Reverse current Peak emission wavelength Dominant wavelength Viewing angle SYMBOL Iv VF IR P D 21/2 CONDITION IF=20mA IF=20mA VR=5V IF=20mA IF=20mA IF=20mA Min. 6.0 Typ. 15 2.3 Max. UNIT mcd V A nm nm deg. 2.7 10 568 570 140 PACKAGE DIMENSIONS OF DEVICE Recommended Soldering Pattern for Reflow Soldering Note: 1. All dimensions are in millimeters. 2. Tolerance is 0.25mm unless otherwise specified. Letex Technology Corp. |
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