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| ELEC-XROMC COMI'ONEXTS GROUP SW CORPORATION f \ DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. 1 LTlF67AF / 1. These specification sheetsinclude materials protected under the copyrjght of Sharp Corporation ("Sharp"). Please do not reproduce or causeanyone to reproduce them without S*.. consent 2. When using this product, please 0bsen.e the absolute maximum ratin&!q.nd the instructions for use outlined in these specification sheets,as well as the precautions mentioned bei@%.Sharp assumesno responsibility for any damage resulting from use of the product which does not c&r+& the absolute maximum ratings tith and the instructions inchrded in these specification sheets,and the precautions mentioned below. .Ii:. ) (Precautions) (1) This products is designed for use in the foUowtig application areas; * OA equipment * Audio visual equipment * Home tippliance * Telecommunication equipment (Terminal) * Measur@g.equipment 3 * Tooling machines * Computers I [ If the use of the product in the above application areas is for equipment listed in paragraphs . (2) or (3), please be sure to observethe precautions given ixi those respective paragraphs. (2) Appropriate measures, such as fail-safe design and redundant design considering the safec design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which d&$nds high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, t@n, automobile etc.) * Traffic signals * Gas leakage sensorbreakers * R@ue and security equipment * Other safetyequipment L I (3) Please do not use this product for equipment which require extremely high reliability and safety in fnnction and precision, such as ; * Space equipment * Tekcommunication equipment (for trunk lines) + Nuclear power control equipment * Medical equipment C 1 (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENTED BY: hp. & I t?b . CUSTOMER'S APPROVAL DATE: BY: Department General Manager of Enginewing Dept.,BI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION : This data sheet is to introduce Model No. LTlF61.G. delivered the light to emitting diode device' l.Structure and characteristics Structure: CaP gellorgreen chip LED device Outline dimensions and pin connections: Taping specification: Packing specification: Soldering method: See See See See page page page page 2 3456 7 8 @ate l.)Duty ratio=l/lO, Pulse width*. lm~ (Note 2)Tore!ance: 4. Luminous intensity 415% rank . (Ta=25"C) Condition c H I J K L 19.7 22.1 24.7 27.7 31.0 34.7 - 24. 0 26. 9 30. I 33.7 . 37. 0 42. 4 mcd IF=201n4 Cvote 3)Measured t.olerance; f 15? by SH.UP EC&C ~lODEL660 (RadiometeriPhotometersystem) 1. Plated. area j!:.; ReqJ area M bxq 2. Pin Conection 0 Cathode @ Anode 0-0 3. Unspecified tel. to be iO.1 Outline terminal dimensions connections and 1. This &tO 0h~t 10 to i*troduor thr lapin* sodi,i,fi~mlioO .Of LJ!U * dcrlcc. lode1 Ho. LmwAF rptciflc2tioo . 2 2. I taping spcciflcatlaa tapiag 2.2 Shipment table TABLE /-Hodel number `SHIPMENT PA-IT NO. QUANTITY -Quantity Lot amber* of prodqcts : noi3[1oaaa -m --v @ 0 `0 @8 LOT No. SHARP UADC IN JAI.4.Y - Luminous intensity rank . *:Lo e indication 0 Production plant code(to be indicated alphabetically) $3 Production Lot(singie or double figures) 3 Year of producrion(che last tuo figures of the year) 8 Konch of production (to be indicated alphabetically with January corresponding d Date of production(Ol-31) to A) 2.3 Rcl+tcd l ttcrs 2.3.1. Packing There should not be missing'rbova continuous peel iag: F= tbrte 0.1-O. 8N products. (I=lO* or Ied) 2.3.2. true strength 1)Cover'trpe strength against Forward 2) Tape strength against The radius +-- Cdneir bending should tape of bending circ!e If it .is less than 30aa.`the out of be 30~ or aore. cover tape may psi. 2.3.3. Taking products rt txeling. tape. 11 Products 2) Products 2.3.4.. Jointing There should should be easily taken out. should not be attached to the eover'taph not of true be joint of cover tape or csrrier 3: @anti tp per reel Average: 4.000 pcs. per reel 4-1. Taping 4-1-I. Shape and diwnsion of tape(TYP. > . r3- \/I Parameter ~ysbol~imens : P2 ' PI -I Benarks iod Concave square hole lot part iasertion Round sprocket hole cer dimension Cover Carrier kickness unit 3 i-taterial cape tape `fere icai Horitoatal Pitch Diameter A B pi Da PO 1 1.1)am Dimeasioq excludes cocaes R I 1.9mm at inside bottom 1 4. Omm 1. sala 4.Omn .. _ Pitch Position Vert.dire Hori .dire Wid:h Thickness Uidch Center Co ten- E P2 F ( W, 1 t3 1 wo AccumuLa{:ed error i0.5mm/lO pitch 1.75mm DistaaciI:becueen tape edge and hole center Ceacer Line of the concave square hole and 2.omm 3.5ms round sprocket hole 5.5mm 1 . 0. lnm [ 8. Omm ) 0.2mm 1 of the Thickness entire 1 cl Carrier to cape . ..PET. 1.2IIFA Cover With cover tape...Polyescer tape and carrier tape combined 1 X--I a-l-2.Shapc and dimensian of reel (TYP. ) Parameter Flange Hub Diameter Thickness Inner space direccioa External diameter Spindle bale diameter Key slit Width Degch 1 Symbol } Dimension )' &e@rks 9178mm IA l.Smm Ic 1W Diqension 1anlm E )6Qmm +13fUlQ of shaft core C 1 1 E U 1 2.0mm 4.5mm Notation 3 Hatcrial: for part came etc. Reel.. .Polystyrene I Labeling on one side of f Lange. 1 (Part name.quantity,loc No.) Packing Specification In order to avoid the absorption of humidity in transport .a& storage, the~devices are psdtcd in alusim0 skve. 4 1. Storage Conditions The storage should lx done under follaaing Temperature . 5 to 3oc less than 6OUl-l Humidity 2. Treatment after Opening 1) Please makea soldering within 2 days after opening under following conditions: Temperature 5 to 3OC less than 60;YRH Humidity 2) In case the devices are not used for a long time after opening, the storage in dq box is recommendable.Or it is better to repack the devices with a desiccative by the sealer and put them in the samestorage conditions as 6-I. Then they should be used rithin 2 W?XkS. conditions: .- 3) Please makea soldering after a following baking treatment if unused term should be over the amditions of 2). Remmendable Gmdi tions: (TJ in taping Tesprature 60t Time 90 to 100 Hours @ in individual ( on PIB or metallic tray > Temperature 11OC Time 3 to 4 Nours M aunt ing precautions 1. Soldering l-1 Xeflow soldering To be doae'undet the following conditiqa. UN. EOse c P3( ux. 5'5ec Recommendable T hermal M ode1 1-2 Reflow soldering precautions Second time soldering shoufd be done witin 8 ham after the first one is l%shcd (Storage condition:at30C,RH(60%) I 2. Soldering iron method At 3OOCwithln r seconds When using a soldering (Pay attion not to iran.care must be taken not to damage the package altou any undue stress or heat on package.) 1 Z X-l LT1F67AF |
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