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| #' -SHARP SPECIFICATIONS Product Type : l'7%FG lens-integrated CMOSColor Area Sensor for CIF Yodel No. LZOP3820 %This specifications contains 24 pages including the cover. If you have any objections,please contact us before issuing purchasing order. CUSTOMERS AcCEpTANCJ3 DATE: BY: PRESENTED I Dept. General Manager REVIEWD BY: PREPAREDBY: Product Development Dept. II CCD Development Center Integrated Circuits Devel SBABP CORPORATION SHARP l Handle this document carefully LZOP3820 for it contains material protected by international copyright law. Any reproduction, full or in part, of this material is prohibited without the express written permission of the company. please observe the conditions written herein and the precautions outlined in the following paragraphs. In no event shall the company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions, (1) The products covered herein are designed and manufactured for the following application areas. Vhen using the products covered herein for the equipment listed in Paragraph (2>, even for the following application areas, be sure to observe the precautions given in Paragraph CU. Never use the products for the equipment listed in Paragraph (3). *Office electronics OInstrumentation and measuring equipment #Machine tools SAudiovisual equipment *Home appliances Xommunication equipment other than for trunk lines (2) Those contemplating using the products covered herein for the following equipment which demands high reliability, should first contact a sales representative of the company and then accept responsibility for incorporating into the design fail-safe operation, redundancy, and other appropriate measures for ensuring reliability and safety of the equipment and the overall system. *Control and safety devices for airplanes, trains, automobiles, and other transportation equipment *Mainframe computers *Traffic control systems *Gas leak detectors and automatic cutoff devices ,Bescue and security equipment *Other safety devices and safety equipment,etc. (3) Do not use the products covered herein for the following equipment which demands extremely high performance in terms of functionality, reliability, accuracy. -Aerospace equipment Xcfnmunications equipment for trunk lines Control equipment for the nucJear power industry BMedical equipment related to life support, etc. (4) Please direct all queries and comments regarding above three Paragraphs to a sales representative the interpretation of the company. to a sales of the l Vhen using the products covered herein, or 0 Please direct representative all queries regarding of the company. the products covered herein SHARP LZOP3820 1 CONTENTS 1. GENERAL DESCRIPTION ~,I,*o.I.,Ill.l,.II,,.II1II1*1.L,~I~ 2. ARRANGEMENT PIXELS ANDCOLOR OF FILTORS 1**.111,*111.1,0 3. BLOCKDIAGRAM ,..1,1,.111.1...,1...*.1...1.1,.,.,...**.*. 4. PIN CONFIGURATION I.,,,I,..I...I..II.,.1O,IIOI..1,111.. 5. PIN DESCRIPTION ll,lI1111,1,1111,,,11,,11,1111,1.0,1~111 II.,,,.I,,.11.1..,,I.,,.L,,III,, 6. ELECTRIC CHARACTERISTICS~ 7. IMAGINGCiiABACTERISTICS II.I......11,1,,I.,,,,.I..I..I,.I 8. LENS SPECIFICATIONS ..,.11...1.1,,1.1,,..1....,.1..1..1.. 9. TIMING DIAGRAM ,,1,,,,1111.11111,,1,1~1,11~..~,..~~I1~..1 . 10. DESCRIPTIONOF SERIAL DATA 11111,1,,..1111.1111.011111,1 P. 2 P. 3 P. 4 P. 5 P. 6 P. 7 P.a p. 9 P. IO P. 13 P. 16 P. 17 P. 18 P. 20 1 1. EXAMPLE STANDARD OF OPERATING CIRCUIT ,.*..'.ll,,,*,l,ltl. 12. SPECIFICATION FORBLEMISH . . . . ..*..0..111,.1.10,11..1.. 1 3. CAUTIONSFORUSE ,1,,1.1,11..10,,,1....`.,,~......,.~... 14. PACKAGE OUTLINE ANDPACKING SPECIFICATI(JN Illl,,l#ll.~l*t SHARF, l.GENERAL DESCRIPTION LZOP3820 2 LZOP3820 is a l/7-type(approx.2.6mm) The sensor further includes a timing sampling(CDS) circuit, an auto gain digital converter(ADC) circuit. All by 3.3V single power supply. Having possible to make ultra-small color lens-integrated CMOS image sensor. generatoer(TG), a correlated double control(AGC) circuit and an analog-tothe circuits of the sensor can be driven smaI1 lens and small LCC-type flat pakage, camera easily. Features 1) Number of image pixels 2) 3) 4) 5) 6) 7) 8) 9) 10) : Horizontal 367 x vertical 291 (approximately 110,000 pixels) : Horizontal 5.6Pm x vertical 5.6pm Square pixel, Pixel pitch Progressive acan Compatible with CIF standard Primary color filter composed of B. G, B AnaIog output and a-bit digital output Variable electronic shutter (l/30 to l/10,000 s> Variable gain control (3 to 30 dB) Can be operating by DC3.3V single power supply 36-pin half-pitch LCC-type small pakage (Base section size: ll.5mmXll. 5mm max. ) 11) pprox. 58" (degrees) of horizontal view angle lens includes. 12) Not designed or rated as radiation hardened Applications Yireless phone camera Image capture camera for PC,PDA Amusement (Game, Toy) etc. . #The circuit diagram and others included in this specification are intended for use we take no responsibility for to explain typical application examples. Therefore, any problem as may occur due to the use of the included circuit and for any problem with industrial proprietary rights or other rights. SHARP 2. -T LZOP3820 3 .OF PIXELS AND COLOR FILTERS Optical black (4 Pixels) Optical black (13 Pixels) 367(H) x 291(V) Optical black (13 Pixels) by opticaliy shielded signs1 pixels genera- OB(B):Standard Optical black (4 Pixels) (1 , 1 R lG IRI . . ..- (367.291) . (367.1) HD,VDTG + D/A Control I + AGC + 8bit I V CLK tDATA- 3 . V 8bit A/D > Digital -+ Video output AGC output :* -' SHARP 4.PIN CONFIGRATION LZOP3820 VIEW> BIAS1 SCLK CLP OFS BIAS2 SICOUT SIGIN ACND AVDD N. c. N. c. D5 D4 LZOP3820 D3 D2 Dl DO DGMD DVDD *a a SHARP 5. PIN DESCRIPTION LZOP3820 6 STBY N. C. Ir; OutDut outp,t output output output Output Digital Di.gital Digital Digital Digital Digital Digital Digital Digital Digital Digital n1 -~:L-, mgisal Digital ~~ -Digital Digital Diiital - ii 13 14 15 DVDD DGND DO Dl D2 D3 1 I I I I 1 1 1 1 , 1 Digital power supply Digital ground ADC signal output 0 (L SB) AJX si&l output 1 ADC simal OutDut 2 output I I 16 17 D4 1 AM: signal , ADC siml I output 4 3 1 I I 18 19 20 zg 1 I N. C. D5 21 sl.7 1 D6 DVDD D7 -7 " LLh DGND HD I 1 output n ` .I uuqlur Input hlDUt outDut I 1 23 1 I I 27 28 1 VD iDI I ! 1 1 I I 1 I I I Input I N. c. - 1 29 SCLK CLP ._ rs Input - Digital Analog Analog 1 t=k34 35 36 1 I++-33 BIAS2 SIGOUT SIGIN AGND AVDD N. C. 1 AIX s&al output 5 1 No connection I ADC signal output 6 Digital power SUDDEN ADCsigna 1 OUtDUt 7 (MSB) _ l--d------- -1--1. ouepu~ -__A.-__A urhuu/ /n rxlR,-\ I nererence CIWK \Y. 1 Digital mound Horizontal drive pulse input I Vertical drive Dulse inmt I Control data input (AGCiEE,Offset etc. > I No connection-I -~-~~-~ 1 Control clock input for SD1 Analog bias voltage for clamp circuit Offset bias voltage for AGC Analog bias voltage 2 for image sensor Analog image signal output -Analog image signal input Analog ground Analog power supply No connection I 1 I 1 J SHARP 6.ELECTRIC CHARACTERISTICS LZOP3820 7 6 - 1. ABSOLUTEMAXIMUM BATINGS Parameter Power supply voltage Input signal voltage Storage temperature S)TllbOi VDD V@ Tstr Wings Unit V V -0.3 -0.3 -20 - 4.6 VDD+O. 3 -70 @c 6 - 2. BECOBBNDED OPEBATING CONDITIONS Parameter Power supply voltage Oneratine temnerature Oscillator frequency Digital input Low level vo 1tage High level Analog input voltage or-----..a --c-m ~~~ SYUlbOl VDD Tonr Fck V9L VdJH . YIN `lYP MAX Unit Note 3. 0 -10 __ 3.3 25 9-o 3. 6 60 V "c MHZ 1 0.2VDD V 0.8VDD VDD (Connect to terminal through capacitor) (Connect to GND through capacitor) V 2 3 Analog bias voltage Note 1 : Apply Note 2 : Apply Note 3 : Apply Please to input to input to pins do not pins HD, VD, SD1 and SCLK pin SIGIN, Please do not connect to DC directly. BIASI, BIASZ, OFS, ADL, DAL, CLP. connect to GND directly. C' ~5 SHARi= 7. 7 LZOP3820 8 Readout mode : l/30 see, Normal mode Ambient temperature : 25 "C Driving voltage : 3.3 V Color temperature of light source : 3200K *Measurement point : Analog image signal output (pin no.32) before ACC and AD. I [Note]' (a> Vo is the average output voltage of Green channel int the central areaWlO,V/lO) under uniform illumination. The standard exposure condition is defined when Vo is 150 mV. (b) The image area is divided into IO x 10 segments under 10 times exposure of the standard exposure condition, The segment's voltage is the average output voltages of all pixels whithin the segments. Vsat is the minimum segment's voltage of all the segments voltage. cc> Vdark is the difference between average output voltage of the effective area and that of the OB area, under non-exposure condition. Cd). Image area is divided into 10 X 10 segments under non-exposure condition. DSNU is defined by (Vdmax - Vdmin), where Vdmax and Vdmin are the maximum and minimun values of all the segments voltage, respectively. -(e> R(G) is the average output voltage of Green channel at central areaWlO.V/lO) when a 1000 Iux light source on a 90% reflector is image. (f) One mean horizontal line signal SHARP 8. LENS SPECIFICATIONS LZOP3820 Kondi t ions1 (a> Effective (b) TV distortion Image Area : (Hj2.06 is defined rectangular pattern x (V)l. 63mm (A y /Y > x 1 0 0 [%I the formura, height height at capturing "Y" * y" sized Horizontal by Vertcal as 4by 3. line. line. is defined as the Vertical is defined as the Vertical of center of Horizontal of edge of Horizontal t (c) The range isthe best points by adjustment by screwing the lens head. the lens. (d) Toruques which are necessary for turning (at shipping of products) . .. .. 9 - 1. Ho;izontal Pulse Timing HD ... 2 64 68 72 7'6 80 84 88 ioie2 4 8 12 I8 20 24 28 32 36 40 44 48 52 56 60 :* I ,I >! .. 906 L Qld di (DO-D7 > 11rror 7 %Ixxxxxm 1 08 .-.-.-.-.--..................OB s 3 HD 112 124 128 132 138 140 144 148 152 156 160 164 116 120 158 172 176 180 184 188 192 196 200 104 108 CLK KxXXXxxxrxwxxxxwxxxKxxX ,)B ._......._._._............... 08 nor*a1 ADOUT 2 4 6 8 10 (DO-D7) xxxxxKxxxx xxx ()B . . . . . . . . . . . . . _ ._... _ . . . . . . .._ 08 xx 366 Kx 364 xx 362. x n-T 360 358 Mirror *The rising edge of HD pulse must be between two rising must be between two rising edges of CLKtO> and CLK(l). edges of CLK(90) and CLK(91). *The falling edge of HD pulse ,. ' SHARP LZOP3820 11 SHARP LZOP3820 12 , SHARP 10. DESCRIPTION OF LZOP3820 13 SERIAL DATA (Fix to Low level) Shutter speed control (Exposure time is 1 to l/330 frame period) D31 D32 D33 D34 D35 D36 D37 D38 MIRH MIRV SAD1 (MS31 SAD0 (LSB) MAX2 (MSB) MAX 1 MAX0 (LSB) L PMD H:Horizontal mirror inversion image, H:Vertical mirror inversion image, Phase select of AD clock (Fix to Low level) Fixed gain select (3 to 10 dB) A:Power save mode (AGC and AD off), L:Normal L:Normal image image L:All active SHARI= 10-l. SETTING OF AUTUN LZOP3820 14 CONTROL *One LSB of the gain code represents appoximately 0.156dB. *Nominal gain values at typical codes are shown below. 1 20 H(HI HI RI H] 10-2. SETTtNG OF oFFSET LEVEL -One LSB of the offset code represents appoximately 0.002Y. -Nominal offset values at typical codes are shown below. SHARP LZOP3820 15 -One LSB of shutter speed code represents lfi, where 1H is HD pulse period. 10-4. ,SETTING *One LSB of gain OF FIXED GAIN code represents 1dB. SHARF, ll.EXAMPLE OF LZOP3820 OPERATING CIRCU 16 1 I I A 3 w ,* .' SHARP 12.SPECIFI&A-JION FOR LZOP3820 17 BLEMISH 1) Definition of blemish *Size of blemish : d 3 lines square by vertical lines. [For reference] Size of stain : 2 4 lines square by vertical l lines. (Green channel : 150mV) $@efer to note below White blemish {note) B l l l vout Vstd :Blemish level defined in fig. below. : Average output voltage at Green channel. : 150 mV. The standard output voltage defined * 7. Imaging Characteristics " in the specification of 2) Measureing conditions Operating temperature * Operating voltage Measureing point l l : Topr = 25C : VDD = 3.3V : Analog image signal output(Pin No.32) before AGC and AD. White blemish Black blemish White blemish (a) (Yout Exposed channel) (b) Non-exposed = 150mV at Green fig. Definition of blemish level SHARP 13. LAUTIONS FOR USE& LZOP3820 18 1, Package breakage In order to prevent the package, the lens holder and lens from being'broken, instructions below: follow the 1) This CMOS image sensor is a precise optical component and the packaege-base material is ceramic. Therefore, please be careful about the following instructions. Take care not to drop the device when mounting. handling, or transporting. Avoid giving a shock to the package. Especially when Ieads are fixed to the shocks or the circuit board, a small shock could break the package more easily tban when the package isn't fixed. l l 2) If any damage or breakage occur on the surface of the lens, its characteristics could deteriorate. Therefore. l Do not hit the Lens. -Do not give a shock large enough to cause distortion, *Do not scrub or scratch surface of the lens. --Even a soft cloth or applicator, if dry, could cause dust to scratch the Lens. 2. Electrostatic Darnage . As compared with general MOS-LSI, CMOS image sensor has lower ESD. Therefore, take the following anti-static measures when handling the CHCS image sensor. 1) Always discharge static electricity by grounding the human body and the instrument to be used. To ground the human body, provide resistance of about 1MQ between the hman body and the ground to be on the safe side. 2) When directly handling the device with the fingers, hoId the lens holder and do not touth the lead, 3 > To avoid generating static electricity, a. do not scrub the body and lens surface with cloth etc. b. do not attach any tape or labels. 4) Vhen storing or transporting the device, put it in a container of conductive material. .. SHARI== 3. Dust and contamination LZOP3820 19 Dust or contamination on the surface of lens and the inside of the lens holder could deteriorate the output characteristic or cause a scar. In order to mini&e dust or contamination on the device, take the following precautions: 1 > Do not remove the lens from the body. Especially when adjusting macro, be careful counterclockwise too much not to remove the lens by turning it 2) Do not touch the surface of the lens with the fingers. If dust or contamination gets on the surface of the lens, the following cleaning method is recommended: l IInadle the built-in lens CMOSimage sensor in a clean environment such as a cleaned both. .(The cleanliness level should be, if possible, if possible class 1000 at least. > *Dust from static electricity should be blown off with an ionized air blower. For anti-electrostatic measures, however, ground all the leads on the device before blowing off the dust. =The contamination on the surface of the lens should be wiped off with a clean applicator soaked in isopropyl alcohol. Wipe slowly and gently in one direction only. --Frequently replace the applicator and do not use the same applicator to clean more than one device. Make sure there is no dust or contamination on the lens and screw it on the lens holder. l 4. Other 1) Soldering measure and condition. *Use ESD-measured soldering iron. *Do not put too much force onto the lens and the lens holder while soldering. Be careful not to let the soldering iron touch the lens holder. --Soldering can be quickly/neatly done by laying the soldering iron so it lightly touches the border between the package and the circuit board and sliding it in sideways. 2) There is no guarantee of the performance of the device which haa been removed or resoldered after being soldered once under the conditions mentioned above. 3 > Avoid using or storing the CMOS image sensor at high temperature or high humidity as it is a precise optical component. Do not give a mechanical shock to the CMOS i wage sensor. 4) Do not expose the device to strong light, For the color device, long exposure to strong light will fade the color of the color filters. l SHARP 1. Package Outline Specification Refer to attached drawing LZOP3820 1 4. PACKAGEOUTLINE AND PACKING SPECIFICATION J 2. Markings Marking contents (1) Product name (2>Companyname (3)Countryname (41Datecode : : : : LZOP3820 SHARP JAPAN 1 I----Denotes the production ref.code.(l--2figures) Denotes the production day of the week 1 2 314 51617 SUN. MON. TUE. 1 WED. TIIU. 1 FRI. 1 SAT. Denotes the production week (01, ozo3, ,52,53) Denotes the production year. (Lower two digits of the year. > l l l l I Positions of markings are shown in the package outline drawing But,ntarkings shown in theat drawing are not provided any measurements of their and their positions. !. Packing Specification 3 - 1. Packing materials charactuers Device tray Cover tray Rubber band Buffer Cushion bag Tape Label 1 Conductive plastic (SUdevices/tray) 1 Conductive plastic(2trays/case) Cardboard Conductive Paper Paper 1 Device packing(Gays/case) Device packing Device tray fixing Shock absorber of device tray Device tray fixing Sealing cushion bag and device case Indicates part number, auantitv and date of manufacture 3 - 2. External appearance of packing Refer to attached drawing . . Precaution 1) Before unpacking, confirm the imports of the chapter `l&CAUTIONS FOE USE" in this device specifications. 2) Unpacking should be done on the stand treated with anti-ESD. At that time, the same anti-ED treatment should be done to operater's body, too. NIE NUMBER (NOTE) --_-__________-_-_ C-HS3820A -. SHARF, LZOP3820 N 8 : : : I / T , SHARP LZOP3820 S __ ;i w 0 fH a d T c) i B 0 `g -xoJddy SHARP LZOP3820 ! \\ --is?iz \ --t - \ \i , I (UNIT : mm) t4mMAw tt + FTMSH 8% NAME ,3--F a,,E . m DRAWING External Appearance Packing I *.;::::: : i:::;;; : . :::: ;: : : : ; : : : 1: : : : : II., 9.. ;::; No. of yxIL(-T-~-oOUTIIwr WrEGRATKJ CmJfrs (lc) GROW SHARP CORPORATION = L;C:-:H'L'3'8i * ** ' @A' * . J |
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